JPH03112953U - - Google Patents
Info
- Publication number
- JPH03112953U JPH03112953U JP2052490U JP2052490U JPH03112953U JP H03112953 U JPH03112953 U JP H03112953U JP 2052490 U JP2052490 U JP 2052490U JP 2052490 U JP2052490 U JP 2052490U JP H03112953 U JPH03112953 U JP H03112953U
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting
- resin mold
- receiving
- fresnel lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims 2
- 238000001514 detection method Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 1
Description
第１図は本考案による発光素子の一実施例を示
す概略側面図、第２図は本考案による発光素子の
他の実施例を示す概略側面図、第３図は本考案に
よる反射型フオトセンサの一実施例を示す概略断
面図である。第４図Ａ，Ｂ，Ｃ及び第５図はそれ
ぞれ従来の発光素子の例を示す概略断面図、第６
図は従来の反射型フオトセンサの一例を示す概略
断面図である。
１０……発光素子、１１……発光チツプ、２…
…樹脂モールド、２ａ……凸状の外面、１３……
二次曲面のフレネルレンズ、２０……反射型フオ
トセンサ、２１……基板、２２……発光素子、２
３……受光素子、２２ａ……発光チツプ、２３ａ
……受光チツプ、２２ｂ，２３ｂ……樹脂モール
ド、２４，２５……二次曲面のフレネルレンズ。
FIG. 1 is a schematic side view showing one embodiment of the light emitting device according to the present invention, FIG. 2 is a schematic side view showing another embodiment of the light emitting device according to the present invention, and FIG. 3 is a schematic side view showing another embodiment of the light emitting device according to the present invention. FIG. 1 is a schematic cross-sectional view showing one embodiment. 4A, B, C and 5 are schematic cross-sectional views showing examples of conventional light emitting devices, and FIG.
The figure is a schematic cross-sectional view showing an example of a conventional reflective photo sensor. 10... Light emitting element, 11... Light emitting chip, 2...
...Resin mold, 2a... Convex outer surface, 13...
Quadratic curved Fresnel lens, 20... Reflective photo sensor, 21... Substrate, 22... Light emitting element, 2
3... Light receiving element, 22a... Light emitting chip, 23a
... Light receiving chip, 22b, 23b ... Resin mold, 24, 25 ... Quadratic curved Fresnel lens.
Claims (1)
封止されている発光素子または受光素子を含む光
電素子において、 上記発光部または受光部を封止するための樹脂
モールドの光射出領域の外面が、凸状に形成され
ていると共に、該凸状の外面に沿つて二次曲面を
有するフレネルレンズが備えられていることを特
徴とする、光電素子。 (2) 前記フレネルレンズが、樹脂モールドの前
記凸状の外面に対して別体に形成されていること
を特徴とする、請求項１に記載の光電素子。 (3) 検知領域に対して実質的に同じ側から対向
するように配設された一対の発光素子及び受光素
子を含むフオトセンサにおいて、 上記発光素子及び受光素子のうち少なくとも一
方が、発光部または受光部を封止するための樹脂
モールドの光射出領域の外面が凸状に形成されて
いると共に、該凸状の外面に沿つて二次曲面を有
するフレネルレンズが備えられていることを特徴
とする、反射型フオトセンサ。[Claims for Utility Model Registration] (1) In a photoelectric device including a light-emitting element or a light-receiving element whose light-emitting part or light-receiving part is sealed with a resin mold, a resin mold for sealing the light-emitting part or the light-receiving part. A photoelectric element, characterized in that the outer surface of the light emitting region is formed in a convex shape, and a Fresnel lens having a quadratic curved surface is provided along the convex outer surface. (2) The photoelectric device according to claim 1, wherein the Fresnel lens is formed separately from the convex outer surface of the resin mold. (3) In a photo sensor including a pair of light-emitting element and light-receiving element arranged to face each other from substantially the same side with respect to the detection area, at least one of the light-emitting element and the light-receiving element is connected to the light-emitting part or the light-receiving part. The outer surface of the light emission area of the resin mold for sealing the part is formed in a convex shape, and a Fresnel lens having a quadratic curved surface is provided along the convex outer surface. , reflective photo sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2052490U JPH03112953U (en) | 1990-03-02 | 1990-03-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2052490U JPH03112953U (en) | 1990-03-02 | 1990-03-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03112953U true JPH03112953U (en) | 1991-11-19 |
Family
ID=31523617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2052490U Pending JPH03112953U (en) | 1990-03-02 | 1990-03-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03112953U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999050915A1 (en) * | 1998-03-27 | 1999-10-07 | Yoshio Takada | Light emitter |
| JP4734770B2 (en) * | 2001-06-12 | 2011-07-27 | ソニー株式会社 | Manufacturing method of resin forming element, manufacturing method of image display device, and manufacturing method of lighting device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60123309A (en) * | 1983-11-30 | 1985-07-02 | 株式会社フジキカイ | Film molding device |
-
1990
- 1990-03-02 JP JP2052490U patent/JPH03112953U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60123309A (en) * | 1983-11-30 | 1985-07-02 | 株式会社フジキカイ | Film molding device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999050915A1 (en) * | 1998-03-27 | 1999-10-07 | Yoshio Takada | Light emitter |
| JP4734770B2 (en) * | 2001-06-12 | 2011-07-27 | ソニー株式会社 | Manufacturing method of resin forming element, manufacturing method of image display device, and manufacturing method of lighting device |