JPH03112119A - Solid electrolytic capacitor and its manufacture - Google Patents
Solid electrolytic capacitor and its manufactureInfo
- Publication number
- JPH03112119A JPH03112119A JP25113189A JP25113189A JPH03112119A JP H03112119 A JPH03112119 A JP H03112119A JP 25113189 A JP25113189 A JP 25113189A JP 25113189 A JP25113189 A JP 25113189A JP H03112119 A JPH03112119 A JP H03112119A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- exterior member
- parts
- terminal
- solid electrolytic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 48
- 239000007787 solid Substances 0.000 title claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 6
- 239000000057 synthetic resin Substances 0.000 claims abstract description 6
- 238000005452 bending Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 abstract description 7
- 238000007789 sealing Methods 0.000 abstract description 4
- 230000003014 reinforcing effect Effects 0.000 abstract description 3
- 238000003466 welding Methods 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 6
- 230000035882 stress Effects 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、リードフレーム及び樹脂封止を用いたチッ
プ型の固体電解コンデンサの製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a chip-type solid electrolytic capacitor using a lead frame and resin sealing.
従来、チップ型の固体電解コンデンサでは、例えば、第
３図の（Ａ）に示すように、コンデンサ素子２の端子部
４に外部リード６を接続した後、樹脂モールド８を一体
的に施し、第３図の（Ｂ）に示すように、樹脂モールド
８から引き出された外部リード６をその端面側から側壁
側に折り曲げてフェイスボンディング用の接続用端子を
形成している。Conventionally, in a chip-type solid electrolytic capacitor, for example, as shown in FIG. As shown in FIG. 3(B), the external lead 6 pulled out from the resin mold 8 is bent from its end face side to the side wall side to form a connection terminal for face bonding.
ところで、このような樹脂モールド８による場合、端子
部４の端面を覆う樹脂モールド８の厚さｄは、固体電解
コンデンサを小型化するために、比較的薄く形成されて
いる。このため、外部リード６を折り曲げるとき、樹脂
モールド８にストレスが加わると、そのモールド部分と
外部リード６との間にモールド樹脂の剥離を生じ、気密
性を損なうとともに、端子部４と外部リード６との間に
接続不良を生じさせる欠点があった。By the way, in the case of such a resin mold 8, the thickness d of the resin mold 8 that covers the end surface of the terminal portion 4 is formed to be relatively thin in order to downsize the solid electrolytic capacitor. Therefore, if stress is applied to the resin mold 8 when bending the external lead 6, the mold resin will peel between the molded part and the external lead 6, impairing airtightness, and This has the disadvantage of causing poor connection between the two.
また、第４図の（Ａ）に示すように、外部り−ド６を樹
脂モールド８の側面側から引き出すと、モールド樹脂の
剥離についての問題は解消されるものの、第４図の（Ｂ
）に示すように、ハンダ付は可能な外部リード６の部分
が樹脂モールド８の側面側に移行するため、ハンダの付
着面積が小さく、ハンダ付は性能を低下させ、実装され
る電子回路の信頼性を低下させる原因になる。Further, as shown in FIG. 4(A), if the external wire 6 is pulled out from the side surface of the resin mold 8, the problem of peeling of the mold resin is solved;
), the part of the external lead 6 that can be soldered moves to the side of the resin mold 8, so the solder adhesion area is small, and soldering reduces the performance and reduces the reliability of the electronic circuit to be mounted. It causes a decline in sexuality.
そこで、この発明は、外装部材によるコンデンサ素子の
端子部とリード部との接続部分の補強とともに、封止強
度を高め、リード部のハンダ付は性能を向上させた固体
電解コンデンサの提供を第１の目的とする。Therefore, the present invention aims to provide a solid electrolytic capacitor in which the connecting part between the terminal part of the capacitor element and the lead part is reinforced by the exterior member, the sealing strength is increased, and the soldering performance of the lead part is improved. The purpose of
また、この発明は、外装部材によるコンデンサ素子の端
子部とリード部との接続部分の補強とともに、ハンダの
付着面積の低下を来すことなく、封止強度を高めた固体
電解コンデンサの製造方法の提供を第２の目的とする。The present invention also provides a method for manufacturing a solid electrolytic capacitor that enhances the sealing strength without reducing the solder adhesion area while reinforcing the connecting portion between the terminal portion of the capacitor element and the lead portion using an exterior member. The second purpose is to provide information.
〔課題を解決するための手段］
（請求項１）
この発明の固体電解コンデンサは、第１の目的を達成す
るため、コンデンサ素子（２０）の端子部（２２，２４
）とリード部（１４，１６）との接続部を前記コンデン
サ素子とともに被覆する外装部材（３０）と、この外装
部材の端面側に形成されて前記リード部を露出させる切
欠き部（３２）と、この切欠き部から露出させた前記リ
ード部を前記外装部材の側面に折り曲げて配設された外
部接続用端子部（ＴＩ、Ｔｚ ）とを備えたものである
。[Means for Solving the Problems] (Claim 1) In order to achieve the first object, the solid electrolytic capacitor of the present invention includes terminal portions (22, 24) of a capacitor element (20).
) and the lead portions (14, 16) together with the capacitor element, and a notch portion (32) formed on the end face side of the exterior member to expose the lead portion. , and an external connection terminal portion (TI, Tz) provided by bending the lead portion exposed from the notch portion onto the side surface of the exterior member.
（請求項２）
この発明の固体電解コンデンサの製造方法は、第２の目
的を達成するため、リードフレーム（ｌＯ）に形成され
たリード部（１４，１６）に、コンデンサ素子（２０）
の端子部（２２，２４）を接続する工程と、前記コンデ
ンサ素子、その端子部及び前記リード部を合成樹脂によ
ってモールドして外装部材（３０）を形成するとともに
、この外装部材の端面側の角部（３４）に切欠き（切欠
き部３２）を設けて前記リード部を露出させる工程と、
前記リードフレームから切り離した前記リード部を前記
外装部材の側面側に折り曲げて外部接続用端子部（ＴＩ
、ＴＩ ）に整形する工程とからなることを特徴とす
るものである。(Claim 2) In order to achieve the second object, the method for manufacturing a solid electrolytic capacitor of the present invention includes a capacitor element (20) attached to a lead portion (14, 16) formed on a lead frame (lO).
a step of connecting the terminal portions (22, 24) of the capacitor element, its terminal portions and the lead portions with synthetic resin to form an exterior member (30); providing a notch (notch part 32) in the part (34) to expose the lead part;
The lead portion cut off from the lead frame is bent toward the side surface of the exterior member to form an external connection terminal portion (TI
, TI).
（請求項１）
このような構成とすれば、コンデンサ素子の端子部とリ
ード部との接続部が外装部材によって補強される上、外
装部材から引き出されたリード部が外装部材に形成され
た切欠き部から露出する。(Claim 1) With this configuration, the connection portion between the terminal portion of the capacitor element and the lead portion is reinforced by the exterior member, and the lead portion pulled out from the exterior member is connected to the cut formed in the exterior member. It is exposed through the notch.
そこで、この露出したリード部を外装部材の側面側に折
り曲げた場合、外装部材に対するストレスがなく、外装
部材の気密性を損なうことがない。Therefore, when this exposed lead portion is bent toward the side surface of the exterior member, there is no stress on the exterior member, and the airtightness of the exterior member is not impaired.
また、この露出したリード部によってハンダの付着面積
が十分に確保されるので、ハンダ付は性能の低下が防止
できる。Furthermore, since the exposed lead portion ensures a sufficient solder adhesion area, deterioration in soldering performance can be prevented.
（請求項２）
リードフレームには製造すべき固体電解コンデンサのコ
ンデンサ素子に対応したリード部が形成され、このリー
ド部にコンデンサ素子の端子部を接続する。(Claim 2) A lead portion corresponding to a capacitor element of a solid electrolytic capacitor to be manufactured is formed on the lead frame, and a terminal portion of the capacitor element is connected to this lead portion.
前記コンデンサ素子、その端子部及び前記リード部を合
成樹脂によってモールドするとともに、端面側の角部に
前記リード部を露出させる切欠きを設けて前記リード部
の露出させる外装部材を形成すると、リード部が外装部
材の端面側にその一部を露出させて外装部材から引き出
される。When the capacitor element, its terminal portion, and the lead portion are molded with synthetic resin, and a notch is provided at a corner on the end face side to expose the lead portion to form an exterior member through which the lead portion is exposed, the lead portion is pulled out from the exterior member with a portion thereof exposed on the end face side of the exterior member.
そして、リード部を外装部材の端面とは反対側に折り曲
げると、外装部材の側面側に位置している角部を支点と
してリード部が折り曲げられることになり、その折曲部
が外装部材の切欠き部から露出しているので、折曲げに
よる外装部材へのストレス、端子部とリード部との間の
接続部に対するストレスを抑制することができ、外装部
材の気密性の低下を抑えることができる。Then, when the lead portion is bent to the side opposite to the end surface of the exterior member, the lead portion is bent using the corner located on the side surface of the exterior member as a fulcrum, and the bent portion is a cut of the exterior member. Since it is exposed through the notch, stress on the exterior member due to bending and stress on the connection between the terminal part and the lead part can be suppressed, and a decrease in airtightness of the exterior member can be suppressed. .
以下、この発明を図面に示した実施例を参照して詳細に
説明する。Hereinafter, the present invention will be described in detail with reference to embodiments shown in the drawings.
第１図は、この発明の固体電解コンデンサ及びその製造
方法の一実施例を示す。FIG. 1 shows an embodiment of the solid electrolytic capacitor of the present invention and its manufacturing method.
第１図の（Ａ）に示すように、ハンダ付は可能な金属板
によってリードフレーム１０が整形される。このリード
フレーム１０には、帯状を成すフレーム本体１２の側縁
部に一定の間隔を以て対を成ずリード部１４．１６が一
体に形成されている。As shown in FIG. 1A, a lead frame 10 is formed of a metal plate that can be soldered. In this lead frame 10, lead portions 14 and 16 are integrally formed in pairs at regular intervals on the side edges of a frame body 12 forming a band shape.
各リード部１４．１６の間隔は、コンデンサ素子２０の
端面に引き出されている端子部２２．２４に対応してい
る。コンデンサ素子２０には、電極箔を巻回してなる右
同型等の固体素子が用いられている。The distance between each lead portion 14.16 corresponds to the terminal portion 22.24 drawn out to the end face of the capacitor element 20. The capacitor element 20 is a solid element of the same type as shown in the right, which is formed by winding an electrode foil.
次に、第１図の（Ｂ）に示すように、リード部１４．１
６の下面側にコンデンサ素子２０の端子部２２．２４を
臨ませ、リード部１４．１６と端子部２２．２４とを溶
接して両者の電気的な接続を行う。この結果、リードフ
レームＩＯと複数のコンデンサ素子２０が一体化される
。Next, as shown in FIG. 1(B), the lead portion 14.1
The terminal portions 22.24 of the capacitor element 20 are exposed to the lower surface side of the capacitor 6, and the lead portions 14.16 and the terminal portions 22.24 are welded to electrically connect them. As a result, the lead frame IO and the plurality of capacitor elements 20 are integrated.
次に、第１図の（Ｃ）に示すように、コンデンサ素子２
０、その端子部２２．２４及びリード部１４．１６を合
成樹脂でモールドすることによって外装部材３０が形成
される。この外装部材３０には、その端面側の角部にリ
ード部１４．１６を露出させる切欠き部３２を設ける。Next, as shown in FIG. 1(C), the capacitor element 2
0, the exterior member 30 is formed by molding the terminal portions 22, 24 and lead portions 14, 16 with synthetic resin. This exterior member 30 is provided with a notch 32 at a corner on the end face side thereof to expose the lead portions 14,16.
切欠き部３２は、リード部１４．１６の中途部を外装部
材３０の端面側に露出させるために、外装部材３０の端
面側に段部を設けて直角を成すＬ字型の凹部である。The notch 32 is a right-angled L-shaped recess with a step provided on the end surface of the exterior member 30 in order to expose the middle part of the lead portion 14.16 on the end surface of the exterior member 30.
次に、第１図の（Ｄ）に示すように、リード部１４．１
６を、外装部材３０側にフェイスボンディング用リード
として必要な長さを残してフレーム本体１２から切り離
した後、各リード部１４．１６を外装部材３０の外壁面
に沿って折り曲げることによって、外装部材３０から露
出している部分を以てフェイスボンディング用の外部接
続用端子部Ｔ、 、Ｔ、に整形し、単体としての固体電
解コンデンサ４０が得られる。Next, as shown in FIG. 1(D), the lead portion 14.1
6 from the frame main body 12 leaving a length necessary as a face bonding lead on the exterior member 30 side, and then bending each lead portion 14 and 16 along the outer wall surface of the exterior member 30 to form the exterior member. The portions exposed from 30 are shaped into external connection terminal portions T, , T, for face bonding, and solid electrolytic capacitor 40 as a single unit is obtained.
以上の製造工程によれば、第２図に示すように、コンデ
ンサ素子２０、その端子部２２．２４及びリード部１′
４．１６を合成樹脂でモールドすることによって外装部
材３０が形成されるので、コンデンサ素子２０の端子部
２２．２４とリード部１４．１６との接続部分が外装部
材３０によって補強される。According to the above manufacturing process, as shown in FIG.
Since the exterior member 30 is formed by molding 4.16 with synthetic resin, the connection portion between the terminal portion 22.24 of the capacitor element 20 and the lead portion 14.16 is reinforced by the exterior member 30.
そして、外装部材３０の端面側の角部には切欠き部３２
を形成したので、各リード部１４．１６は、外装部材３
０から引き出されるとともに、その中途部を切欠き部３
２から露出させることができる。そこで、各リード部１
４．１６を外装部材３０の反対側に折曲げて外部接続用
端子Ｔ１、Ｔ２に整形した場合、各リード部１４．１６
は外装部材３０の側面側に位置している角部３４を支点
として折り曲げられることになり、各リード部１４．１
６の折曲げ部分には、外装部材３０が密着していないた
め、その折曲げに伴ってリード部１４．１６と外装部材
３０との間にストレスが加わることがない。したがって
、リード部１４．１６を外部接続用端子Ｔ、 、Ｔ２に
加工しても、外装部材３０の気密性を損なうことがない
。A notch 32 is provided at a corner on the end surface side of the exterior member 30.
, each lead portion 14.16 is connected to the exterior member 3.
0, and the middle part is pulled out from the notch 3.
It can be exposed from 2. Therefore, each lead part 1
When 4.16 is bent to the opposite side of the exterior member 30 and shaped into external connection terminals T1 and T2, each lead portion 14.16
are bent using the corner portion 34 located on the side surface of the exterior member 30 as a fulcrum, and each lead portion 14.1
Since the exterior member 30 is not in close contact with the bent portion 6, no stress is applied between the lead portions 14, 16 and the exterior member 30 due to the bending. Therefore, even if the lead portions 14, 16 are processed into external connection terminals T, , T2, the airtightness of the exterior member 30 is not impaired.
そして、この製造方法によって得られる固体電解コンデ
ンサ４０では、外装部材３０の気密性低下の防止によっ
て信顛性が高められる上に、外装部材３０の端面側に切
欠き部３２を通じてリード部１４．１６が露出している
ため、切欠き部３２の部分へのハンダの回り込みが行わ
れ、ハンダ付は性能が高められる。In the solid electrolytic capacitor 40 obtained by this manufacturing method, the reliability is improved by preventing the deterioration of the airtightness of the exterior member 30, and the lead portions 14, 16 are formed through the notch 32 on the end surface side of the exterior member 30. Since the is exposed, the solder wraps around the notch portion 32, and the soldering performance is improved.
なお、実施例では、外装部材３０として一体型の樹脂モ
ールドを例にとって説明したが、この発明は、例えば、
外装部材を２以上の部分に分け、その一部を予め端子部
とリード部との接続部分を覆う部分に第１の外装部材と
して形成し、他の部分をコンデンサ素子を被覆する第２
の外装部材として形成して両者を一体化することも可能
であり、実施例の形態に限定されるものではない。In addition, although the embodiment has been described using an integrated resin mold as the exterior member 30, the present invention can be applied to, for example,
The exterior member is divided into two or more parts, one part of which is formed in advance as a first exterior member in a part that covers the connecting part between the terminal part and the lead part, and the other part is formed as a second part that covers the capacitor element.
It is also possible to integrate the two by forming them as an exterior member, and the present invention is not limited to the form of the embodiment.
以上説明したように、この発明によれば、次のような効
果が得られる。As explained above, according to the present invention, the following effects can be obtained.
（ａ） コンデンサ素子の端子部とリード部との溶接
部分が外装部材によって補強されるので、両者の接続強
度が向上し、外部からのストレスによる損傷から保護す
ることができ、また、外装部材の端面側に切欠き部を設
けてリード部を露出させたので、リード部の整形に際し
て外装部材の剥離等を防止でき、外装部材の気密性の保
持が高められるとともに、切欠き部から露出しているリ
ード部にハンダが回り込み、十分なハンダの付着面積が
確保されるので、ハンダ付は性能を高めることができる
。(a) Since the welded part between the terminal part and the lead part of the capacitor element is reinforced by the exterior member, the strength of the connection between the two is improved, and it is possible to protect them from damage due to external stress. Since a notch is provided on the end face side to expose the lead part, it is possible to prevent the exterior member from peeling off when shaping the lead part, improve the maintenance of airtightness of the exterior member, and prevent the lead from being exposed through the notch. Soldering can improve performance because the solder wraps around the lead portion, ensuring a sufficient solder adhesion area.
（ｂ） コンデンサ素子の端子部とリード部との補強
、外装部材の気密性の低下防止及びハンダ付は性能を高
めた信頼性の高い固体電解コンデンサを生産することが
できる。(b) By reinforcing the terminal and lead portions of the capacitor element, preventing deterioration of the airtightness of the exterior member, and soldering, it is possible to produce a highly reliable solid electrolytic capacitor with improved performance.
第１図はこの発明の固体電解コンデンサ及びその製造方
法の一実施例を示す図、
第２図は第１図の（Ｄ）に示す固体電解コンデンサの■
−■線断面図、
第３図及び第４図は従来の固体電解コンデンサを示す断
面図である。
１０・ ・ ・リードフレーム
１４、■６・・ ・リード部
２０・・・コンデンサ素子
２２．２４・・・端子部
３０・・・外装部材
３２・・・切欠き部
３４・・・角部
Ｔ Ｉ、 Ｔ ｚ ・・・外部接続用端子部４０・・
・固体電解コンデンサ
第
２
図
（第１図（Ｄ）の■−■線断面）
第３図
（従来の固体電解コンデンサ）FIG. 1 is a diagram showing an embodiment of the solid electrolytic capacitor and its manufacturing method of the present invention, and FIG. 2 is a diagram showing an example of the solid electrolytic capacitor shown in (D) in FIG.
3 and 4 are cross-sectional views showing conventional solid electrolytic capacitors. 10... Lead frame 14, ■6... Lead part 20... Capacitor element 22.24... Terminal part 30... Exterior member 32... Notch part 34... Corner part T I , T z ...terminal section 40 for external connection...
・Solid electrolytic capacitor Figure 2 (cross section on the ■-■ line in Figure 1 (D)) Figure 3 (Conventional solid electrolytic capacitor)
Claims (2)
記コンデンサ素子とともに被覆する外装部材と、 この外装部材の端面側に形成されて前記リード部を露出
させる切欠き部と、 この切欠き部から露出させた前記リード部を前記外装部
材の側面に折り曲げて配設された外部接続用端子部と、 を備えたことを特徴とする固体電解コンデンサ。1. an exterior member that covers a connecting portion between a terminal portion of a capacitor element and a lead portion together with the capacitor element; a notch portion formed on an end face side of the exterior member to expose the lead portion; and an exterior member exposed from the notch portion. A solid electrolytic capacitor, comprising: an external connection terminal portion that is arranged by bending the lead portion that has been bent onto a side surface of the exterior member.
サ素子の端子部を接続する工程と、前記コンデンサ素子
、その端子部及び前記リード部を合成樹脂によってモー
ルドして外装部材を形成するとともに、この外装部材の
端面側の角部に切欠きを設けて前記リード部を露出させ
る工程前記リードフレームから切り離した前記リード部
を前記外装部材の側面側に折り曲げて外部接続用端子部
に整形する工程と、 からなることを特徴とする固体電解コンデンサの製造方
法。2. Connecting the terminal portion of the capacitor element to the lead portion formed on the lead frame, molding the capacitor element, its terminal portion, and the lead portion with synthetic resin to form an exterior member, and forming an exterior member of the exterior member. a step of exposing the lead portion by providing a notch in the corner of the end face; and a step of bending the lead portion cut off from the lead frame toward the side surface of the exterior member to form an external connection terminal portion. A method for manufacturing a solid electrolytic capacitor, characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1251131A JP2901279B2 (en) | 1989-09-27 | 1989-09-27 | Solid electrolytic capacitor and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1251131A JP2901279B2 (en) | 1989-09-27 | 1989-09-27 | Solid electrolytic capacitor and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03112119A true JPH03112119A (en) | 1991-05-13 |
| JP2901279B2 JP2901279B2 (en) | 1999-06-07 |
Family
ID=17218134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1251131A Expired - Fee Related JP2901279B2 (en) | 1989-09-27 | 1989-09-27 | Solid electrolytic capacitor and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2901279B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7352563B2 (en) * | 2006-03-13 | 2008-04-01 | Avx Corporation | Capacitor assembly |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59131144U (en) * | 1983-02-22 | 1984-09-03 | 日本電気株式会社 | Chip type solid electrolytic capacitor |
-
1989
- 1989-09-27 JP JP1251131A patent/JP2901279B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59131144U (en) * | 1983-02-22 | 1984-09-03 | 日本電気株式会社 | Chip type solid electrolytic capacitor |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7352563B2 (en) * | 2006-03-13 | 2008-04-01 | Avx Corporation | Capacitor assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2901279B2 (en) | 1999-06-07 |
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