JPH03110853U - - Google Patents
Info
- Publication number
- JPH03110853U JPH03110853U JP1833590U JP1833590U JPH03110853U JP H03110853 U JPH03110853 U JP H03110853U JP 1833590 U JP1833590 U JP 1833590U JP 1833590 U JP1833590 U JP 1833590U JP H03110853 U JPH03110853 U JP H03110853U
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- semiconductor chip
- heat radiator
- resin
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 2
- 230000000630 rising effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1833590U JP2506933Y2 (ja) | 1990-02-27 | 1990-02-27 | 樹脂密封型半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1833590U JP2506933Y2 (ja) | 1990-02-27 | 1990-02-27 | 樹脂密封型半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03110853U true JPH03110853U (hu) | 1991-11-13 |
| JP2506933Y2 JP2506933Y2 (ja) | 1996-08-14 |
Family
ID=31521498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1833590U Expired - Lifetime JP2506933Y2 (ja) | 1990-02-27 | 1990-02-27 | 樹脂密封型半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2506933Y2 (hu) |
-
1990
- 1990-02-27 JP JP1833590U patent/JP2506933Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2506933Y2 (ja) | 1996-08-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |