JPH03110850U - - Google Patents

Info

Publication number
JPH03110850U
JPH03110850U JP1934790U JP1934790U JPH03110850U JP H03110850 U JPH03110850 U JP H03110850U JP 1934790 U JP1934790 U JP 1934790U JP 1934790 U JP1934790 U JP 1934790U JP H03110850 U JPH03110850 U JP H03110850U
Authority
JP
Japan
Prior art keywords
detection mark
tape
dummy pattern
pattern
tape substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1934790U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1934790U priority Critical patent/JPH03110850U/ja
Publication of JPH03110850U publication Critical patent/JPH03110850U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
JP1934790U 1990-02-27 1990-02-27 Pending JPH03110850U (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1934790U JPH03110850U (ko) 1990-02-27 1990-02-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1934790U JPH03110850U (ko) 1990-02-27 1990-02-27

Publications (1)

Publication Number Publication Date
JPH03110850U true JPH03110850U (ko) 1991-11-13

Family

ID=31522471

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1934790U Pending JPH03110850U (ko) 1990-02-27 1990-02-27

Country Status (1)

Country Link
JP (1) JPH03110850U (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006210478A (ja) * 2005-01-26 2006-08-10 Renesas Technology Corp 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006210478A (ja) * 2005-01-26 2006-08-10 Renesas Technology Corp 半導体装置

Similar Documents

Publication Publication Date Title
JPH03110850U (ko)
JPS59189846U (ja) 導電性粘着テ−プ
JPS6155336U (ko)
JPS5845534U (ja) ホトマスク
JPS6127579U (ja) ワ−ク受けポスト
JPS58119787U (ja) 腕時計用文字板
JPS6096831U (ja) 半導体チツプ
JPS58499U (ja) 半導体装置のキャリア
JPS6362932U (ko)
JPH0472629U (ko)
JPS587399U (ja) チップ部品用テ−プ
JPH042044U (ko)
JPS6217181U (ko)
JPS61110576U (ko)
JPH0326761U (ko)
JPS6025719U (ja) ズボン裾当て具
JPS5817577U (ja) 時計用文字板
JPH01108934U (ko)
JPS60135186U (ja) ジグソ−パズル印画紙
JPS5881960U (ja) 半導体装置用フイルムキヤリア
JPS5928537U (ja) 粘着テ−プ
JPS6262464U (ko)
JPS58168499U (ja) 立体模様化粧板
JPH0437238U (ko)
JPS58178183U (ja) ラベル母材