JPH03109808U - - Google Patents
Info
- Publication number
- JPH03109808U JPH03109808U JP2004790U JP2004790U JPH03109808U JP H03109808 U JPH03109808 U JP H03109808U JP 2004790 U JP2004790 U JP 2004790U JP 2004790 U JP2004790 U JP 2004790U JP H03109808 U JPH03109808 U JP H03109808U
- Authority
- JP
- Japan
- Prior art keywords
- mold body
- molded
- cavity space
- auxiliary electrode
- electrode plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 6
- 238000000465 moulding Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Description
第１図は本考案に係る高周波成形用成形型を示
す断面図、第２，３図は同成形型の変形例を示す
断面図、第４図は同成形型で加熱成形する被成形
材となる中間材を示す部分斜視図、第５，６図は
従来例に係る高周波成形用成形型を示す断面図、
第７，８図は同成形型による樹脂成形の課題を示
す説明図である。
Ａ……被成形材、ａ１……薄肉部、ａ２……厚
肉部、１０，１０ａ，１０ｂ……型本体、１１…
…キヤビテイ空間、１２……補助電極板、ｔ１，
ｔ２……補助電極板の板厚差。
Fig. 1 is a sectional view showing a mold for high frequency molding according to the present invention, Figs. 2 and 3 are sectional views showing modifications of the same mold, and Fig. 4 shows a material to be formed by heat forming with the same mold. 5 and 6 are cross-sectional views showing a conventional high-frequency molding die,
FIGS. 7 and 8 are explanatory diagrams showing problems in resin molding using the same mold. A...material to be formed, a1 ...thin wall part, a2 ...thick wall part, 10, 10a, 10b...mold body, 11...
...Cavity space, 12...Auxiliary electrode plate, t 1 ,
t 2 ...Difference in thickness of auxiliary electrode plate.
Claims (1)
を有する材料で型本体１０を形成し、その型本体
１０の内部に被成形材Ａの薄肉部ａ１と厚肉部ａ
２に相応した異なる深さを呈するキヤビテイ空間
１１を設け、このキヤビテイ空間１１の内部に挿
置される被成形材Ａの薄肉部ａ１と相対的に近接
位置する板厚差ｔ１，ｔ２を持つ補助電極板１２
を型本体１０の外部面で少なくとも片側部１０ａ
，１０ｂに配設したことを特徴とする高周波成形
用成形型。 A mold body 10 is formed of a material having a dielectric loss lower than that of the material to be molded A, and a thin part a1 and a thick part a of the material to be molded A are formed inside the mold body 10.
A cavity space 11 having different depths corresponding to 2 is provided, and a plate thickness difference t 1 , t 2 located relatively close to the thin wall portion a 1 of the material to be formed A inserted into the cavity space 11 is provided. Auxiliary electrode plate 12 with
at least one side 10a on the outer surface of the mold body 10
, 10b.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004790U JPH03109808U (en) | 1990-02-28 | 1990-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004790U JPH03109808U (en) | 1990-02-28 | 1990-02-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03109808U true JPH03109808U (en) | 1991-11-12 |
Family
ID=31523142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004790U Pending JPH03109808U (en) | 1990-02-28 | 1990-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03109808U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60217122A (en) * | 1984-04-09 | 1985-10-30 | クリント・インコ−ポレ−テツド | Molding device and method |
-
1990
- 1990-02-28 JP JP2004790U patent/JPH03109808U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60217122A (en) * | 1984-04-09 | 1985-10-30 | クリント・インコ−ポレ−テツド | Molding device and method |