JPH0485788U - - Google Patents
Info
- Publication number
- JPH0485788U JPH0485788U JP12628990U JP12628990U JPH0485788U JP H0485788 U JPH0485788 U JP H0485788U JP 12628990 U JP12628990 U JP 12628990U JP 12628990 U JP12628990 U JP 12628990U JP H0485788 U JPH0485788 U JP H0485788U
- Authority
- JP
- Japan
- Prior art keywords
- molded
- base material
- molded product
- conductive base
- conductive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図ａ，ｂはこの考案に係る導電層付成形品
の上・下ケースの嵌合前および嵌合後の部分断面
図、第２図は第１図における導電層付成形品の上
ケースの平面図および断面図、第３図はこの考案
に係る導電層付成形品を製造するための金型構造
の一例を示す断面図、第４図および第５図はこの
考案の他の実施例を示す説明図、第６図および第
７図はこの考案におけるさらに他の実施例を示す
説明図、第８図は従来の導電性層付き成形品の上
・下ケースを示す説明用断面図である。
Ａ……嵌合部、１…上ケース、２……下ケース
、１ａ，２ａ……端部、３……導電性材料。
Figures 1a and b are partial sectional views of the upper and lower cases of the molded product with a conductive layer according to this invention before and after fitting, and Figure 2 is the upper case of the molded product with a conductive layer in Figure 1. 3 is a sectional view showing an example of a mold structure for manufacturing a molded product with a conductive layer according to this invention, and FIGS. 4 and 5 are other embodiments of this invention. FIGS. 6 and 7 are explanatory views showing still other embodiments of this invention, and FIG. 8 is an explanatory cross-sectional view showing upper and lower cases of a conventional molded product with a conductive layer. be. A... Fitting portion, 1... Upper case, 2... Lower case, 1a, 2a... End portion, 3... Conductive material.
Claims (1)
るいはその内部に一体成形してなる導電層付成形
品において、 上記成形品の嵌合部を形成する端部であつて内
側に相手方の端部が入り込む端部側には、導電性
基材をその端部と一体成形させずその端部下側の
空間部に延長させるように取付け成形し、かつ嵌
合時にはこの延長された導電性基材を相手方端部
が挟むことを特徴とする導電層成形品。 ２ 延長された導電性基材の部分の一部または全
体が、成形品の内面に設けたリブまたは壁と一体
成形されていることを特徴とする請求項１記載の
導電層付成形品。[Claims for Utility Model Registration] 1. In a molded product with a conductive layer formed by integrally molding a flexible conductive base material on the inner surface or inside of the molded product, the end portion of the molded product forming the fitting part On the end side where the other end enters inside, the conductive base material is not molded integrally with the end but is attached and molded so as to extend into the space below the end. A conductive layer molded product characterized in that the extended conductive base material is sandwiched between the opposite ends. 2. The molded article with a conductive layer according to claim 1, wherein part or all of the extended portion of the conductive base material is integrally molded with a rib or wall provided on the inner surface of the molded article.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12628990U JPH0485788U (en) | 1990-11-30 | 1990-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12628990U JPH0485788U (en) | 1990-11-30 | 1990-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0485788U true JPH0485788U (en) | 1992-07-24 |
Family
ID=31873850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12628990U Pending JPH0485788U (en) | 1990-11-30 | 1990-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0485788U (en) |
-
1990
- 1990-11-30 JP JP12628990U patent/JPH0485788U/ja active Pending