JPH03109335U - - Google Patents
Info
- Publication number
- JPH03109335U JPH03109335U JP1616590U JP1616590U JPH03109335U JP H03109335 U JPH03109335 U JP H03109335U JP 1616590 U JP1616590 U JP 1616590U JP 1616590 U JP1616590 U JP 1616590U JP H03109335 U JPH03109335 U JP H03109335U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- adhesive
- substrate support
- adhesive application
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1616590U JPH03109335U (enrdf_load_stackoverflow) | 1990-02-22 | 1990-02-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1616590U JPH03109335U (enrdf_load_stackoverflow) | 1990-02-22 | 1990-02-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03109335U true JPH03109335U (enrdf_load_stackoverflow) | 1991-11-11 |
Family
ID=31519450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1616590U Pending JPH03109335U (enrdf_load_stackoverflow) | 1990-02-22 | 1990-02-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03109335U (enrdf_load_stackoverflow) |
-
1990
- 1990-02-22 JP JP1616590U patent/JPH03109335U/ja active Pending