JPH03108152A - Tape feed system measuring method - Google Patents

Abstract

PURPOSE:To accurately perform the measurement of the position of a flange lower plane by detecting a position where an output voltage is decreased by scanning the outside of a guide roller with a transmission type optical sensor and shielding light at the flange lower plane. CONSTITUTION:The projector 5 and the receiver 6 of the transmission type optical sensor are mounted on a mounting plate 4, and a part between them is irradiated with transmission light 7. The transmission light 7 is ascended along the guide roller 2 mounted at a flange 8, and the transmission light 7 is shielded at the position of the lower plane of the flange 8, then, the output voltage is changed steeply. The position where the steep change of the output voltage occurs is detected, thereby, the position of the lower plane of the flange 8 can be accurately detected. Also, a major diameter is measured as moving laser scanners 9, 10 upward from a roller 2 side. The positions of the scanners 9, 10 at the moment when the major diameter changes at the lower plane of the flange 8 are detected, and the position of the lower plane of the flange 8 of the roller 2 even when it is measured can be accurately obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for measuring the position of running system components of a VTR and the position of a tape during running.

[Conventional technology]

The conventional device includes a detection optical system that detects the amount of displacement at two edges at both ends of a tape-shaped object using a light transmission type sensor, as described in Japanese Patent Application Laid-open No. 57-19616, and It had analog calculation processing means for performing analog calculations on edge displacement amounts at two edges at both ends of the tape and outputting width displacement amounts and meandering amounts of the tape.

[Problem to be solved by the invention]

The above conventional technology does not take into consideration the position of the lower surface of the flange for guiding the upper end of the tape on the guide roller, the inclination of the guide roller, and the measurement of the lead position of the cylinder.
Furthermore, there was no consideration given to measurements when there was no space for sensors due to crowded parts, and there was a problem in ensuring the performance of the tape running system.

The purpose of the present invention is to ensure the stability of the performance of the tape running system, and furthermore, the lower surface of the flange of the guide roller for guiding the upper end of the tape, the inclination of the guide roller, the lead position of the cylinder, and the position of the tape during running. The objective is to provide a method for measuring

[Means to solve the problem]

To achieve the above objective, the position of the lower surface of the flange for guiding the upper end of the tape on the guide roller is measured by vertically scanning a transmission optical sensor and using a semiconductor laser scanner. This provides a method for capturing and measuring the outer diameter of a flange at different moments.

Furthermore, the present invention provides a method of measuring the lead position of a cylinder by using a laser displacement meter and changing the optical path of the laser of the laser displacement meter using two mirrors.

Furthermore, a semiconductor laser scanner is used to measure the tape position while the tape is running, and a method is provided in which the returned light is detected and measured via two mirrors.

Furthermore, a semiconductor laser scanner is used to measure the inclination of the guide roller, and a method of measuring the inclination by detecting the difference in the width of the returned laser beam is provided.

[Effect]

The transmission type optical sensor scans the outside of the guide roller up and down, is shielded from light by the lower surface of the flange, the output voltage is lowered, and detects the position of the lower surface of the flange.

The position of the bottom surface of the flange is detected by using a semiconductor laser scanner to measure the outer diameter while moving the laser scanner upward from the guide roller side, and detecting the position of the laser scanner at the moment when the outer diameter differs on the bottom surface of the flange. can.

The lead position can be detected by scanning the laser displacement meter up and down on the side of the cylinder and detecting a sudden change in the output voltage at the lead position.

By fixing the semiconductor laser scanner, irradiating the tape with a laser beam through two mirrors, and setting the returned light to all+, the position of the running tape is set to a1! I can determine.

Since the optical path of the laser of the laser displacement meter is changed using two mirrors, the distance between the laser displacement meter and the cylinder can be freely selected and the lead position of the cylinder can be measured.

By setting the scanning laser width of the semiconductor laser scanner to be larger than the diameter of the guide roller and smaller than the diameter of the flange, the outer diameter of the flange can be measured at the bottom surface of the flange when the laser scanner is moved upward. By detecting the position of the laser scanner at the moment when the laser scanner becomes disabled, the position of the lower surface of the guide roller flange can be measured.

By changing the optical path using two mirrors between the emitter and receiver of the laser beam scanned by the semiconductor laser scanner, the distance between the semiconductor laser scanner and the guide roller can be set freely, and parts are not crowded together. The position of the bottom surface of the guide roller flange can be measured even when

By using light such as a laser beam, measurement can be performed without contacting the surface of the component, and the surface of the component will not be damaged.

The guide roller is irradiated with the parallel laser beam scanned by the semiconductor laser scanner, and installed at the position of the parallel laser beam so that the returned light returns only from one side of the guide roller.
The inclination of the guide roller can be measured based on the difference in the width of the laser beam returned at the bottom.

〔Example〕

An embodiment of the present invention will be described below with reference to FIGS. 1 to 8.

FIG. 1 is a schematic diagram of a VTR running system for which 1 lll is fixed. Cylinder 3 is installed.

FIG. 2 is a schematic diagram of a method for measuring the position of the lower surface of the flange of a guide roller using a transmission type optical sensor.

A light transmitter 5 for a transmission type optical sensor is attached to the mounting plate 4. A light receiver 6 is attached, and transmitted light 7 is irradiated therebetween. A flange 8 is attached to the guide roller 2. The transmitted light 7 is raised along the side surface of the guide roller 2, and at the position of the lower surface of the flange, the transmitted light 7 is blocked and the output voltage suddenly changes.

By detecting the position of the sensor at the moment when this output voltage suddenly changes, the position of the lower surface of the flange can be measured.

FIG. 3 is a schematic diagram of a method for measuring the position of the lower surface of the flange of the roller using a semiconductor laser scanner.

Emitter 9 and receiver 10 of the semiconductor laser scanner. It consists of a mirror 11 and scanned parallel laser light [
The light 12 is irradiated onto the guide roller 2 and is blocked by the guide roller 2, and a shadow portion is generated in the returned light 12'. By calculating the length of time during which this shadow is present, the outer diameter of the guide roller 2 can be determined by '/Jl'J.

The emitter 9, the receiver 10, and the mirror 11 of the semiconductor laser scanner are raised simultaneously, and on the lower surface of the flange 8,
Since the outer diameter of the flange 8 is different from the outer diameter of the guide roller 2, the length of time of the shadow portion produced in the returned light 12' becomes longer, and the measurement results of the outer diameter are different. By detecting the position of the light projector 9 or the light receiver of the semiconductor laser scanner at this time, the position of the lower surface of the flange 8 can be measured.

FIG. 4 is a schematic diagram of a method of measuring cylinder lead position using a laser displacement meter. A laser displacement meter 14 is moved along the side surface of the cylinder 3 and irradiated with a laser beam 15, and the reflected light is diffusely reflected at the lead position of the cylinder, causing a change in the amount of light and a sudden change in the output voltage. By detecting the position of the laser displacement meter 14 at the moment when the output voltage suddenly changes, the cylinder lead position can be measured.

FIG. 5 is a schematic diagram of a method for measuring the position of a running tape using a semiconductor laser scanner and mirrors. Semiconductor laser scanner emitter 1G and receiver 17. When the parallel laser beam 18 is irradiated onto the tape 21 guided by the guide roller 2 with the mirror 19 fixed, the parallel laser beam 18 is blocked by the tape 21 and a shadow portion is created in the returned light 20. The width of the returned light 20 can be calculated from the length of time during which this shadow occurs. Therefore, when the tape 21 moves up and down while running, this returned light 20
Since the width of the tape 21 changes, the vertical movement position of the tape 21 while it is running can be determined by d111.

FIG. 6 is a schematic diagram illustrating that the distance between the laser displacement meter and the cylinder can be freely selected in order to change the optical path of the laser displacement meter. The laser beam 15 emitted from the light emitting part of the laser displacement meter 14 has its optical path changed by a mirror 22 arranged at an angle of 45'' with respect to the laser beam 15.
4, the optical path is changed by a mirror 23 arranged at an angle of 45 degrees with respect to this laser beam 24, and the optical path is changed to a laser beam 25, which is reflected on the surface of the cylinder 3 and becomes a return beam 26.The light receiving part of the relay laser displacement meter 14 Return to Mirrors 22 and 2
3, the laser 15 advances as indicated by a broken line 28, is reflected on the surface of the cylinder 3', and returns to the light receiving section of the laser displacement meter 14 as a return beam 27. In this case, the returned beams 26 and 27 are on the same line.

Therefore, it is possible to change the distance from the light projecting part of the laser displacement meter 14 to the cylinder like Q and Q'.

7 and 8 are schematic diagrams relating to a method of measuring the inclination of a guide roller by changing the way in which the guide roller is irradiated with a parallel laser beam of a semiconductor laser scanner. The parallel laser beam 12 scanned by the projector 9 of the semiconductor laser scanner is directed to the guide roller 2 as shown in FIG. 7 so that the return light 30 exits only on one side of the guide roller 2. and a mirror 11 is arranged. In this state, first, return light 3 is placed above the guide roller 2.
The width of 0 is measured by the same method as explained in FIG. 5 using the projector 9 of the semiconductor laser scanner as shown in FIG. Light receiver 10. The mirrors 11 are lowered while maintaining their positional relationship, and the width of the returned light 30 is similarly measured below the guide roller 2. When the guide roller 2 is tilted, the width of the returned light 3° differs between the upper and lower portions, so the tilt can be calculated from this difference in width.

The measurement accuracy of the transmission type optical sensor in Fig. 2 is 36, ±
An accuracy of 4.3 μm is obtained.

The measurement accuracy according to the method using the semiconductor laser scanner shown in FIG. 3 is 36 and an accuracy of ±4.3 μm is obtained.

Further, in the method of detecting the lead position of the cylinder by direction using the laser displacement meter shown in FIG. 4, a measurement accuracy of 3.9 μm can be obtained.

Further, in the tape position measuring method using the semiconductor laser scanner shown in FIG. 5, a measurement accuracy of ±3.2 μrn can be obtained.

In the guide roller inclination measurement method using the semiconductor laser scanner shown in FIGS. 7 and 8, a measurement accuracy of ±3.2 μl can be obtained.

By doing this, the lower surface of the flange of the guide roller, the lead position of the cylinder, the position of the tape during running, and the inclination of the guide roller can be accurately measured, which has the effect of measuring the stability of the tape running system.

〔Effect of the invention〕

Since the present invention is configured as described above, it has the effects described below.

1) The position of the lower surface of the guide roller flange can be accurately measured using a transmission type optical sensor.

2) The position of the guide roller flange can be accurately measured using a semiconductor laser scanner and mirror.

3) By using a laser displacement meter, the cylinder lead position can be accurately measured.

4) The position of the running tape can be accurately determined using a measurement method that uses a combination of a semiconductor laser scanner and a mirror.

5) By changing the optical path of the laser displacement meter with two mirrors, the distance between the laser displacement meter and the cylinder can be freely selected.

6) The inclination of the guide roller can be accurately measured using a semiconductor laser scanner and two mirrors.

7) By using a semiconductor laser scanner and two mirrors, the position of the lower surface of the guide roller flange can be accurately measured δ1 even when parts are crowded together.

[Brief explanation of drawings]

Fig. 1 is a perspective view of a total of 11,111 target products according to an embodiment of the present invention, Fig. 2 is a perspective view of a method for measuring the position of the lower surface of a guide roller flange using a transmission type optical sensor, and Fig. 3 is a perspective view of a method for measuring the position of the lower surface of a guide roller flange using a transmission type optical sensor. , a perspective view of a method of measuring the position of the lower surface of the guide roller flange, FIG. 4 is a perspective view of a method of measuring a total of 31 lead positions of the cylinder using a laser displacement meter,
Figure 5 is a perspective view of a method for measuring tape using a semiconductor laser scanner and a mirror, and Figure 6 is an explanation of how the distance between the laser displacement meter and the cylinder can be freely selected to change the optical path of the laser displacement meter. 7 and 8 are explanatory diagrams of a method for measuring the guide roller inclination using a semiconductor laser scanner. 1...Base, 2...Guide roller. 3...Cylinder, 4...Base, 5...
- Emitter, 6... Light receiver, 7... Transmitted light, 8... Flange, 9... Semiconductor laser scanner (light emitter). 10... Semiconductor laser scanner (light receiver), 11.
...mirror, 12...laser parallel beam,
13... Cylinder lead position, 14... Laser displacement meter, 15... Laser beam,
16... Floodlight of semiconductor laser scanner. 17...Receiver of semiconductor laser scanner, 18...
・Parallel laser beam, 19...Mirror 20...Laser return light, 21...Tape, 22...Mirror
23... Mirror 24... Laser light,
25... Laser light, 26... Laser return light, 27... Laser return light, 30... Laser return light. No. 1 Otsu 1- Base? 0. -Daidroller 3-Symph No. 2 Kuniman 80

Claims (1)

[Claims] 1. This relates to a method for measuring the assembly accuracy of VTR tape running system parts. To measure the bottom surface of the flange of the guide roller that guides the upper end of the tape, a transmission type optical sensor is scanned up and down to find the position where the output voltage suddenly changes. Using a measuring method and a semiconductor laser scanner, measure the outer diameter while moving the laser scanner upward from the guide roller side, detect the position of the laser scanner at the moment when the outer diameter differs on the bottom surface of the flange, and measure the outer diameter of the guide roller flange. A tape running system measuring method characterized by measuring the position of the lower surface.