JPH03106740U - - Google Patents

Info

Publication number
JPH03106740U
JPH03106740U JP11154890U JP11154890U JPH03106740U JP H03106740 U JPH03106740 U JP H03106740U JP 11154890 U JP11154890 U JP 11154890U JP 11154890 U JP11154890 U JP 11154890U JP H03106740 U JPH03106740 U JP H03106740U
Authority
JP
Japan
Prior art keywords
film
device mounting
semiconductor device
mounting portion
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11154890U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11154890U priority Critical patent/JPH03106740U/ja
Publication of JPH03106740U publication Critical patent/JPH03106740U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP11154890U 1989-12-01 1990-10-24 Pending JPH03106740U (US20100056889A1-20100304-C00004.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11154890U JPH03106740U (US20100056889A1-20100304-C00004.png) 1989-12-01 1990-10-24

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP13956089 1989-12-01
JP11154890U JPH03106740U (US20100056889A1-20100304-C00004.png) 1989-12-01 1990-10-24

Publications (1)

Publication Number Publication Date
JPH03106740U true JPH03106740U (US20100056889A1-20100304-C00004.png) 1991-11-05

Family

ID=31890337

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11154890U Pending JPH03106740U (US20100056889A1-20100304-C00004.png) 1989-12-01 1990-10-24

Country Status (1)

Country Link
JP (1) JPH03106740U (US20100056889A1-20100304-C00004.png)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5158066A (US20100056889A1-20100304-C00004.png) * 1974-11-15 1976-05-21 Nippon Electric Co
JPS5890752A (ja) * 1981-11-25 1983-05-30 Nec Corp 半導体装置の製造方法
JPS6246537A (ja) * 1985-08-23 1987-02-28 Nec Corp フィルムキャリヤ半導体装置の電気試験方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5158066A (US20100056889A1-20100304-C00004.png) * 1974-11-15 1976-05-21 Nippon Electric Co
JPS5890752A (ja) * 1981-11-25 1983-05-30 Nec Corp 半導体装置の製造方法
JPS6246537A (ja) * 1985-08-23 1987-02-28 Nec Corp フィルムキャリヤ半導体装置の電気試験方法

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