JPH03106737U - - Google Patents
Info
- Publication number
- JPH03106737U JPH03106737U JP1653090U JP1653090U JPH03106737U JP H03106737 U JPH03106737 U JP H03106737U JP 1653090 U JP1653090 U JP 1653090U JP 1653090 U JP1653090 U JP 1653090U JP H03106737 U JPH03106737 U JP H03106737U
- Authority
- JP
- Japan
- Prior art keywords
- cleaning
- aqueous solution
- wafer
- hno
- cleaned
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007864 aqueous solution Substances 0.000 claims 2
- 238000004140 cleaning Methods 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Description
第１図ａ，ｂはシリコンウエーハの説明図であ
る。第２図はシリコンウエーハの表面に付着した
Ｆｅ，Ｃｕ，Ｎｉ量を示すグラフである。
１……ウエーハ、２……結晶欠陥。
FIGS. 1a and 1b are explanatory diagrams of a silicon wafer. FIG. 2 is a graph showing the amounts of Fe, Cu, and Ni attached to the surface of a silicon wafer. 1...Wafer, 2...Crystal defect.
Claims (1)
成形後に、ＨＦ＋ＨＮＯ３による少なくとも１段
階エツチング、ＮＨ４ＯＨ／Ｈ２Ｏ２水溶液によ
る洗浄、ＨＣ１／Ｈ２Ｏ２水溶液による洗浄の各
洗浄工程を経て清浄化されたことを特徴とするウ
エーハの熱処理用載置治具。 Made of cut and molded polycrystalline silicon,
Heat treatment of a wafer characterized in that after molding, the wafer is cleaned through at least one step of etching with HF+HNO 3 , cleaning with an NH 4 OH/H 2 O 2 aqueous solution, and cleaning with an HC1/H 2 O 2 aqueous solution. mounting jig.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990016530U JP2548357Y2 (en) | 1990-02-20 | 1990-02-20 | Mounting jig for wafer heat treatment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990016530U JP2548357Y2 (en) | 1990-02-20 | 1990-02-20 | Mounting jig for wafer heat treatment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03106737U true JPH03106737U (en) | 1991-11-05 |
| JP2548357Y2 JP2548357Y2 (en) | 1997-09-17 |
Family
ID=31519792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990016530U Expired - Lifetime JP2548357Y2 (en) | 1990-02-20 | 1990-02-20 | Mounting jig for wafer heat treatment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2548357Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015199619A (en) * | 2014-04-07 | 2015-11-12 | 株式会社トクヤマ | Cleaning method of polycrystal silicon |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59162200A (en) * | 1983-03-03 | 1984-09-13 | Agency Of Ind Science & Technol | Cleaning of surface of silicon substrate |
-
1990
- 1990-02-20 JP JP1990016530U patent/JP2548357Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59162200A (en) * | 1983-03-03 | 1984-09-13 | Agency Of Ind Science & Technol | Cleaning of surface of silicon substrate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015199619A (en) * | 2014-04-07 | 2015-11-12 | 株式会社トクヤマ | Cleaning method of polycrystal silicon |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2548357Y2 (en) | 1997-09-17 |