JPH0310663Y2 - - Google Patents
Info
- Publication number
- JPH0310663Y2 JPH0310663Y2 JP9468885U JP9468885U JPH0310663Y2 JP H0310663 Y2 JPH0310663 Y2 JP H0310663Y2 JP 9468885 U JP9468885 U JP 9468885U JP 9468885 U JP9468885 U JP 9468885U JP H0310663 Y2 JPH0310663 Y2 JP H0310663Y2
- Authority
- JP
- Japan
- Prior art keywords
- electrolytic capacitor
- chip
- flat part
- case
- flat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 27
- 238000007789 sealing Methods 0.000 claims description 9
- 239000000945 filler Substances 0.000 claims description 4
- 239000011888 foil Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9468885U JPH0310663Y2 (US06346242-20020212-C00066.png) | 1985-06-22 | 1985-06-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9468885U JPH0310663Y2 (US06346242-20020212-C00066.png) | 1985-06-22 | 1985-06-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS624124U JPS624124U (US06346242-20020212-C00066.png) | 1987-01-12 |
| JPH0310663Y2 true JPH0310663Y2 (US06346242-20020212-C00066.png) | 1991-03-15 |
Family
ID=30653389
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9468885U Expired JPH0310663Y2 (US06346242-20020212-C00066.png) | 1985-06-22 | 1985-06-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0310663Y2 (US06346242-20020212-C00066.png) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0670339B2 (ja) * | 1991-03-29 | 1994-09-07 | 忠彦 藤城 | 枠組足場 |
| JP2500899B2 (ja) * | 1993-03-17 | 1996-05-29 | アサヒ産業株式会社 | 枠組足場の構築方法 |
-
1985
- 1985-06-22 JP JP9468885U patent/JPH0310663Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS624124U (US06346242-20020212-C00066.png) | 1987-01-12 |
