JPH0310655Y2 - - Google Patents
Info
- Publication number
- JPH0310655Y2 JPH0310655Y2 JP1985001831U JP183185U JPH0310655Y2 JP H0310655 Y2 JPH0310655 Y2 JP H0310655Y2 JP 1985001831 U JP1985001831 U JP 1985001831U JP 183185 U JP183185 U JP 183185U JP H0310655 Y2 JPH0310655 Y2 JP H0310655Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resin layer
- infrared rays
- far infrared
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 32
- 239000011347 resin Substances 0.000 claims description 32
- 239000003990 capacitor Substances 0.000 claims description 26
- 239000000126 substance Substances 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 1
- 230000006866 deterioration Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【考案の詳細な説明】
（産業上の利用分野）
本考案は樹脂外装型コンデンサに関するもので
ある。[Detailed Description of the Invention] (Field of Industrial Application) The present invention relates to a resin-clad capacitor.
（従来の技術）
樹脂外装型コンデンサは、例えばコンデンサ素
子を熱硬化型樹脂や紫外線硬化型樹脂中にデイツ
プし、引き出して加熱あるいは紫外線硬化するこ
とにより樹脂外装を形成している。(Prior Art) In a resin-clad capacitor, a resin exterior is formed by, for example, dipping a capacitor element in a thermosetting resin or an ultraviolet curable resin, pulling it out and curing it by heating or ultraviolet rays.
（考案が解決しようとする問題点）
ところで、樹脂外装型コンデンサを印刷配線板
に接続するのに遠赤外線炉による半田リフロー等
の方法を用いることがある。が、遠赤外線が照射
されるとコンデンサ素子が加熱され劣化する欠点
があつた。(Problems to be Solved by the Invention) By the way, a method such as solder reflow using a far-infrared furnace may be used to connect a resin-clad capacitor to a printed wiring board. However, there was a drawback that the capacitor element was heated and deteriorated when it was irradiated with far infrared rays.
本考案の目的は、以上の欠点を改良し、印刷配
線板等に接続する際の熱劣化を防止し、特性を向
上しうる樹脂外装型コンデンサを提供するもので
ある。 The object of the present invention is to provide a resin-clad capacitor which can improve the above-mentioned drawbacks, prevent thermal deterioration when connected to a printed wiring board, etc., and improve its characteristics.
（問題点を解決するための手段）
本考案は、上記の目的を達成するために、第１
図に示す通り、コンデンサ素子１に樹脂外装を設
けた樹脂外装型コンデンサにおいて、コンデンサ
素子１を絶縁保護する第１樹脂層６と、該第１樹
脂層６の内側又は外側に形成された、遠赤外線を
透過しない物質を含む第２樹脂層７とを設けるこ
とを特徴とする樹脂外装型コンデンサを提供する
ものである。(Means for solving the problem) In order to achieve the above purpose, the present invention has the following features:
As shown in the figure, in a resin-clad capacitor in which a capacitor element 1 is provided with a resin exterior, there is a first resin layer 6 that insulates and protects the capacitor element 1, and a remote layer formed on the inside or outside of the first resin layer 6. This invention provides a resin-clad capacitor characterized by being provided with a second resin layer 7 containing a substance that does not transmit infrared rays.
（作用）
本考案によれば、遠赤外線を透過しない物質を
含む第２樹脂層を設けているために、コンデンサ
に遠赤外線を照射しても遠赤外線は第２樹脂層に
より反射又は吸収され、コンデンサ素子１は遠赤
外線の照射により直接加熱することなく、熱劣化
を防止できる。(Function) According to the present invention, since the second resin layer containing a substance that does not transmit far infrared rays is provided, even if the capacitor is irradiated with far infrared rays, the far infrared rays are reflected or absorbed by the second resin layer. The capacitor element 1 can be prevented from thermal deterioration without being directly heated by irradiation with far infrared rays.
（実施例）
以下、本考案を図示の実施例に基づいて説明す
る。(Example) Hereinafter, the present invention will be explained based on the illustrated example.
第１図において、１は、コンデンサ素子であ
り、金属化プラスチツクフイルムや金属化紙等を
巻回したものであり、両端面にメタリコン２及び
３が設けられている。４及び５はメタリコン２及
び３に接続されているリード線である。６はコン
デンサ素子１に被覆され、エポキシ等の熱硬化型
樹脂又は紫外線硬化型樹脂からなり、コンデンサ
素子１を絶縁保護する第１樹脂層である。７は第
１樹脂層６に被覆され、アルミやステンレス等の
遠赤外線を透過しない物質８を含む熱硬化型樹脂
又は紫外線硬化型樹脂からなる第２樹脂層であ
る。 In FIG. 1, numeral 1 denotes a capacitor element, which is wound with metallized plastic film, metallized paper, etc., and has metallized contacts 2 and 3 on both end faces. 4 and 5 are lead wires connected to the metallic contacts 2 and 3. A first resin layer 6 covers the capacitor element 1 and is made of a thermosetting resin such as epoxy or an ultraviolet curable resin and protects the capacitor element 1 from insulation. A second resin layer 7 is coated with the first resin layer 6 and is made of a thermosetting resin or an ultraviolet curable resin containing a substance 8 that does not transmit far infrared rays, such as aluminum or stainless steel.
樹脂外装の形成は、先ず、コンデンサ素子１を
粉末状のエポキシ樹脂等にデイツプし、引き上
げ、加熱あるいは紫外線照射して硬化し第１樹脂
層とし、次に同様に、アルミ等の金属を含有する
粉末状エポキシ樹脂等にデイツプし、引き上げ、
加熱あるいは紫外線照射して硬化し第２樹脂層と
する。 The resin exterior is formed by first dipping the capacitor element 1 in powdered epoxy resin, etc., pulling it up, heating it or irradiating it with ultraviolet rays to harden it to form the first resin layer, and then similarly coating it with a metal such as aluminum. Dipped in powdered epoxy resin etc., pulled up,
It is cured by heating or UV irradiation to form a second resin layer.
上記実施例の構成では、第２樹脂層７が第１樹
脂層６の外側に設けられているために、コンデン
サ素子１の遠赤外線による熱劣化を防止できると
ともに、第１樹脂層６も遠赤外線が透過すること
なく加熱によるヒビ割れ等を防止できる。 In the configuration of the above embodiment, since the second resin layer 7 is provided outside the first resin layer 6, thermal deterioration of the capacitor element 1 due to far infrared rays can be prevented, and the first resin layer 6 also It is possible to prevent cracks caused by heating without penetrating the film.
また、第２図は本考案の他の実施例を示し、第
２樹脂層９が第１樹脂層１０の内側に設けられた
構成になつており、遠赤外線から第１樹脂層１０
を保護する効果はないが、コンデンサ素子１１の
熱劣化を防止できる。 Further, FIG. 2 shows another embodiment of the present invention, in which the second resin layer 9 is provided inside the first resin layer 10, and the first resin layer 10 is protected from far infrared rays.
Although it does not have the effect of protecting the capacitor element 11, thermal deterioration of the capacitor element 11 can be prevented.
（考案の効果）
以上の通り、本考案によれば、遠赤外線による
熱劣化を防止でき、特性を向上しうる樹脂外装型
コンデンサが得られる。(Effects of the Invention) As described above, according to the present invention, a resin-clad capacitor that can prevent thermal deterioration due to far infrared rays and improve characteristics can be obtained.
第１図は本考案の実施例の正面断面図、第２図
は本考案の他実施例の正面断面図を示す。
１，１１……コンデンサ素子、６，１０……第
１樹脂層、７，９……第２樹脂層、８……遠赤外
線を透過しない物質。
FIG. 1 shows a front sectional view of an embodiment of the present invention, and FIG. 2 shows a front sectional view of another embodiment of the invention. 1, 11... Capacitor element, 6, 10... First resin layer, 7, 9... Second resin layer, 8... Substance that does not transmit far infrared rays.
Claims (1)
型コンデンサにおいて、コンデンサ素子を絶縁
保護する第１樹脂層と、該第１樹脂層の内側又
は外側に形成された、遠赤外線を透過しない物
質を含む第２樹脂層とを設けることを特徴とす
る樹脂外装型コンデンサ。 (2) 遠赤外線を透過しない物質がアルミ金属であ
る実用新案登録請求の範囲第１項記載の樹脂外
装型コンデンサ。 (3) 遠赤外線を透過しない物質がステンレス金属
である実用新案登録請求の範囲第１項記載の樹
脂外装型コンデンサ。[Scope of Claim for Utility Model Registration] (1) In a resin-clad capacitor in which a capacitor element is provided with a resin sheath, a first resin layer that insulates and protects the capacitor element, and a first resin layer formed inside or outside of the first resin layer. , a second resin layer containing a substance that does not transmit far infrared rays. (2) The resin-clad capacitor according to claim 1, wherein the substance that does not transmit far infrared rays is aluminum metal. (3) The resin-clad capacitor according to claim 1, wherein the material that does not transmit far infrared rays is stainless steel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985001831U JPH0310655Y2 (en) | 1985-01-11 | 1985-01-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985001831U JPH0310655Y2 (en) | 1985-01-11 | 1985-01-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61119333U JPS61119333U (en) | 1986-07-28 |
| JPH0310655Y2 true JPH0310655Y2 (en) | 1991-03-15 |
Family
ID=30474932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985001831U Expired JPH0310655Y2 (en) | 1985-01-11 | 1985-01-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0310655Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014100469A1 (en) | 2013-11-29 | 2015-06-03 | Epcos Ag | Electronic component and use thereof |
-
1985
- 1985-01-11 JP JP1985001831U patent/JPH0310655Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61119333U (en) | 1986-07-28 |
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