JPH0310565U - - Google Patents
Info
- Publication number
- JPH0310565U JPH0310565U JP7026889U JP7026889U JPH0310565U JP H0310565 U JPH0310565 U JP H0310565U JP 7026889 U JP7026889 U JP 7026889U JP 7026889 U JP7026889 U JP 7026889U JP H0310565 U JPH0310565 U JP H0310565U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- edge
- end surface
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989070268U JPH0739258Y2 (ja) | 1989-06-15 | 1989-06-15 | 基板のエッジにおける端子構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989070268U JPH0739258Y2 (ja) | 1989-06-15 | 1989-06-15 | 基板のエッジにおける端子構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0310565U true JPH0310565U (fr) | 1991-01-31 |
| JPH0739258Y2 JPH0739258Y2 (ja) | 1995-09-06 |
Family
ID=31606284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989070268U Expired - Lifetime JPH0739258Y2 (ja) | 1989-06-15 | 1989-06-15 | 基板のエッジにおける端子構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0739258Y2 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019071332A (ja) * | 2017-10-06 | 2019-05-09 | 富士通株式会社 | 配線基板、電子機器、板金部品の取り付け方法及び配線基板の製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5720172U (fr) * | 1980-07-09 | 1982-02-02 | ||
| JPS57168267U (fr) * | 1981-04-17 | 1982-10-23 |
-
1989
- 1989-06-15 JP JP1989070268U patent/JPH0739258Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5720172U (fr) * | 1980-07-09 | 1982-02-02 | ||
| JPS57168267U (fr) * | 1981-04-17 | 1982-10-23 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019071332A (ja) * | 2017-10-06 | 2019-05-09 | 富士通株式会社 | 配線基板、電子機器、板金部品の取り付け方法及び配線基板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0739258Y2 (ja) | 1995-09-06 |