JPH0310552U - - Google Patents
Info
- Publication number
- JPH0310552U JPH0310552U JP1989070045U JP7004589U JPH0310552U JP H0310552 U JPH0310552 U JP H0310552U JP 1989070045 U JP1989070045 U JP 1989070045U JP 7004589 U JP7004589 U JP 7004589U JP H0310552 U JPH0310552 U JP H0310552U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- bonding
- mounting
- metal
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/30—
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- H10W72/01308—
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- H10W72/07311—
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- H10W72/07353—
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- H10W72/334—
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- H10W72/884—
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- H10W72/931—
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- H10W74/00—
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- H10W90/736—
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989070045U JPH0310552U (enExample) | 1989-06-15 | 1989-06-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989070045U JPH0310552U (enExample) | 1989-06-15 | 1989-06-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0310552U true JPH0310552U (enExample) | 1991-01-31 |
Family
ID=31605878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989070045U Pending JPH0310552U (enExample) | 1989-06-15 | 1989-06-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0310552U (enExample) |
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1989
- 1989-06-15 JP JP1989070045U patent/JPH0310552U/ja active Pending