JPH0310532U - - Google Patents

Info

Publication number
JPH0310532U
JPH0310532U JP1989071992U JP7199289U JPH0310532U JP H0310532 U JPH0310532 U JP H0310532U JP 1989071992 U JP1989071992 U JP 1989071992U JP 7199289 U JP7199289 U JP 7199289U JP H0310532 U JPH0310532 U JP H0310532U
Authority
JP
Japan
Prior art keywords
electrode pad
window opening
insulating film
semiconductor element
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989071992U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989071992U priority Critical patent/JPH0310532U/ja
Publication of JPH0310532U publication Critical patent/JPH0310532U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond

Landscapes

  • Wire Bonding (AREA)
JP1989071992U 1989-06-20 1989-06-20 Pending JPH0310532U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989071992U JPH0310532U (fr) 1989-06-20 1989-06-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989071992U JPH0310532U (fr) 1989-06-20 1989-06-20

Publications (1)

Publication Number Publication Date
JPH0310532U true JPH0310532U (fr) 1991-01-31

Family

ID=31609525

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989071992U Pending JPH0310532U (fr) 1989-06-20 1989-06-20

Country Status (1)

Country Link
JP (1) JPH0310532U (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007291561A (ja) * 2006-04-25 2007-11-08 L Rose:Kk 内側全面にシルク生地を縫い合わせた下着

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5192171A (fr) * 1975-02-10 1976-08-12
JPS5295171A (en) * 1976-02-06 1977-08-10 Hitachi Ltd Electrode for semi-conductor
JPS6338236A (ja) * 1986-08-01 1988-02-18 Fujitsu Ltd 半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5192171A (fr) * 1975-02-10 1976-08-12
JPS5295171A (en) * 1976-02-06 1977-08-10 Hitachi Ltd Electrode for semi-conductor
JPS6338236A (ja) * 1986-08-01 1988-02-18 Fujitsu Ltd 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007291561A (ja) * 2006-04-25 2007-11-08 L Rose:Kk 内側全面にシルク生地を縫い合わせた下着

Similar Documents

Publication Publication Date Title
JPH0310532U (fr)
JPH01165649U (fr)
JPH01140850U (fr)
JPS6364035U (fr)
JPH0353843U (fr)
JPS648732U (fr)
JPS63106133U (fr)
JPH0477240U (fr)
JPS6179542U (fr)
JPH0471032U (fr)
JPS61183540U (fr)
JPH01154633U (fr)
JPS61196299U (fr)
JPS6170941U (fr)
JPH024247U (fr)
JPS6361127U (fr)
JPH0470738U (fr)
JPS61102001U (fr)
JPH0184452U (fr)
JPS6393637U (fr)
JPH0444732U (fr)
JPS6159346U (fr)
JPH0267641U (fr)
JPS60154881U (ja) 半導体ｘ線検出器
JPS6230364U (fr)