JPH03104800U - - Google Patents

Info

Publication number
JPH03104800U
JPH03104800U JP1305090U JP1305090U JPH03104800U JP H03104800 U JPH03104800 U JP H03104800U JP 1305090 U JP1305090 U JP 1305090U JP 1305090 U JP1305090 U JP 1305090U JP H03104800 U JPH03104800 U JP H03104800U
Authority
JP
Japan
Prior art keywords
adhesive
die bonding
stage
substrate
measuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1305090U
Other languages
English (en)
Japanese (ja)
Other versions
JP2502995Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1305090U priority Critical patent/JP2502995Y2/ja
Publication of JPH03104800U publication Critical patent/JPH03104800U/ja
Application granted granted Critical
Publication of JP2502995Y2 publication Critical patent/JP2502995Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP1305090U 1990-02-15 1990-02-15 ダイボンディング装置における接着剤塗布量確認装置 Expired - Lifetime JP2502995Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1305090U JP2502995Y2 (ja) 1990-02-15 1990-02-15 ダイボンディング装置における接着剤塗布量確認装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1305090U JP2502995Y2 (ja) 1990-02-15 1990-02-15 ダイボンディング装置における接着剤塗布量確認装置

Publications (2)

Publication Number Publication Date
JPH03104800U true JPH03104800U (enrdf_load_html_response) 1991-10-30
JP2502995Y2 JP2502995Y2 (ja) 1996-06-26

Family

ID=31516492

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1305090U Expired - Lifetime JP2502995Y2 (ja) 1990-02-15 1990-02-15 ダイボンディング装置における接着剤塗布量確認装置

Country Status (1)

Country Link
JP (1) JP2502995Y2 (enrdf_load_html_response)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013048130A (ja) * 2011-08-29 2013-03-07 Panasonic Corp 樹脂塗布装置および樹脂塗布方法
WO2013121752A1 (ja) * 2012-02-16 2013-08-22 パナソニック株式会社 樹脂塗布装置および樹脂塗布方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013048130A (ja) * 2011-08-29 2013-03-07 Panasonic Corp 樹脂塗布装置および樹脂塗布方法
WO2013121752A1 (ja) * 2012-02-16 2013-08-22 パナソニック株式会社 樹脂塗布装置および樹脂塗布方法

Also Published As

Publication number Publication date
JP2502995Y2 (ja) 1996-06-26

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