JPH03104614A - Manufacture of composite molded circuit board - Google Patents
Manufacture of composite molded circuit boardInfo
- Publication number
- JPH03104614A JPH03104614A JP24270289A JP24270289A JPH03104614A JP H03104614 A JPH03104614 A JP H03104614A JP 24270289 A JP24270289 A JP 24270289A JP 24270289 A JP24270289 A JP 24270289A JP H03104614 A JPH03104614 A JP H03104614A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- insulating
- movable part
- resin
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002131 composite material Substances 0.000 title claims description 23
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 239000011347 resin Substances 0.000 claims abstract description 43
- 229920005989 resin Polymers 0.000 claims abstract description 43
- 239000004020 conductor Substances 0.000 claims abstract description 38
- 238000000034 method Methods 0.000 claims abstract description 22
- 238000000465 moulding Methods 0.000 claims description 50
- 238000009413 insulation Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 description 10
- 239000012212 insulator Substances 0.000 description 7
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 206010040844 Skin exfoliation Diseases 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
- B29C45/1635—Making multilayered or multicoloured articles using displaceable mould parts, e.g. retractable partition between adjacent mould cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0017—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor moulding interconnected elements which are movable with respect to one another, e.g. chains or hinges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
- B29C45/1675—Making multilayered or multicoloured articles using exchangeable mould halves
Abstract
Description
【発明の詳細な説明】 （イ）産業上の利用分野 この発明は、複合成形回路基板の製造方法に関する。[Detailed description of the invention] (b) Industrial application field The present invention relates to a method for manufacturing a composite molded circuit board.
（ロ）従来の技術
第５図は、従来の複合成形回路基板を示す斜視図である
。(b) Prior Art FIG. 5 is a perspective view showing a conventional composite molded circuit board.
この複合成形同路基板は、予め形戒した基板８１の上下
面に、所望の配線導体８２をメッキ形成し、上下面の配
線導体８２間にスルーホール８３を形或する。この後に
、このスルーホール８３の内周面にメッキ処理を施して
、上下に対向位置する配線導体８２を導通させている。This composite molded circuit board is formed by plating desired wiring conductors 82 on the upper and lower surfaces of a pre-shaped board 81, and forming through holes 83 between the wiring conductors 82 on the upper and lower surfaces. Thereafter, the inner circumferential surface of the through hole 83 is plated to provide electrical continuity between the wiring conductors 82 located vertically opposite each other.
（ハ）発明が解決しようとする課題
従来の複合成形回路基板は、基板の上下面にメッキ処理
を施して配線導体を形或している。従って、メッキ層（
配線導体）と基板との密着性が不充分であり、また、メ
ッキ層と基板とは熱膨張係数が異なるために、温度変化
によって配線パターンが剥離し易く、性能・信頼性等、
品質上の問題があった。また、基板両面（上下面）の配
線導体を接続するのにスルーホールを形成し、且つこの
スルーホールの内周面にメッキ処理を施す必要があり、
製造が煩わしい許かりでなく工程数が多い等の不利があ
った。(c) Problems to be Solved by the Invention In conventional composite molded circuit boards, wiring conductors are formed by plating the top and bottom surfaces of the board. Therefore, the plating layer (
The adhesion between the wiring conductor) and the board is insufficient, and because the plating layer and the board have different coefficients of thermal expansion, the wiring pattern is likely to peel off due to temperature changes, resulting in poor performance, reliability, etc.
There were quality issues. In addition, it is necessary to form through holes to connect the wiring conductors on both sides (upper and lower surfaces) of the board, and to perform plating on the inner peripheral surfaces of these through holes.
There were disadvantages such as the fact that manufacturing was complicated and the number of steps was large.
この発明は、少ない工程数で基板の両面に剥離する虞れ
のない配線導体を形成し得る複合成形回路基板の製造方
法を提供することを目的とする。SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a composite molded circuit board that can form wiring conductors on both sides of the board without the risk of peeling with a small number of steps.
（二）課題を解決するための手段及び作用この邑的を達
威させるために、この複合成形回路基板の製造方法は、
適所に備えた可動部を上昇移動させた基台金型の上部に
、一次側成形用金型を配備し、一次側成形用金型と基台
金型との対向空間に絶縁性樹脂を注入して絶縁部を形成
する工程と、この一次側戊形工程終了後に、一次側成形
用金型に替えて絶縁部の凹み穴開口面を閉威する二次側
成形用金型を配備すると共に、上記基本金型の可動部を
下降移動させて可動部と絶縁部との間に対向空間を形成
した後、二次側成形用金型と可動部との間に導電性樹脂
を注入して絶縁部の両面に配線導体を形或する工程とか
ら成ることを特徴としている。(2) Means and effects for solving the problem In order to achieve this objective, this method for manufacturing a composite molded circuit board is as follows:
A primary molding mold is placed on top of the base mold with the movable part in the appropriate position moved upward, and insulating resin is injected into the space facing the primary molding mold and the base mold. After completing this primary side forming process, a secondary side forming mold is installed to close the recessed hole opening surface of the insulating part in place of the primary side forming mold. After moving the movable part of the basic mold downward to form an opposing space between the movable part and the insulating part, conductive resin is injected between the secondary molding mold and the movable part. The method is characterized by a process of forming wiring conductors on both sides of the insulating part.
このような複合成形回路基板の製法では、特殊な金型を
用いて、導電性樹脂と絶縁性樹脂とを段階的に注入する
２色成形法により行われる。The manufacturing method of such a composite molded circuit board is carried out by a two-color molding method in which a conductive resin and an insulating resin are injected in stages using a special mold.
一次側成形においては、基本金型上に一次側成形用金型
を載せる（嵌合配置する）。一次側成形用金型の下面に
は、長さの短い足軸（表面のみに配線導体を形成するた
めの短足）と、長さの長い足軸（表面の配線導体と裏面
の配線導体とを連通させるための長足）とが立設してあ
る。一方、基本金型の可動部は、一次戒形用金型側（上
方）へ移動させてある。従って、一次側成形用金型と基
本金型との対向状態は、可動部において、一次側成形用
金型の長足先端が、可動部の上面に接面している。この
状態で、一次側成形用金型と基本金型との対向空間に、
絶縁性樹脂を注入して所望形状の絶縁部（樹脂基板）を
形成する。この絶縁部の形成が完了した後に、二次側成
形に移行する。In primary molding, a primary molding die is placed on a basic mold (fitting arrangement). The bottom surface of the primary molding mold has short legs (short legs for forming wiring conductors only on the front surface) and long legs (short legs for forming wiring conductors on the front surface and wiring conductors on the back surface). (long legs) are erected to communicate with each other. On the other hand, the movable part of the basic mold has been moved toward the primary mold mold (upward). Therefore, when the primary molding die and the basic mold are opposed to each other, in the movable part, the long end of the primary molding die is in contact with the upper surface of the movable part. In this state, in the space facing the primary mold and the basic mold,
Insulating resin is injected to form an insulating part (resin substrate) in a desired shape. After the formation of this insulating portion is completed, the process moves to secondary side molding.
二次側成形においては、一次側成形用金型に替えて二次
側成形用金型を使用する。つまり絶縁部の上面に二次側
成形用金型を配置する。この二次側成形用金型は、下面
が平坦面（水平面）となっている。従って、一次側成形
用金型の長・短足によって絶縁部に形成された凹み穴（
表面のみに配線導体を形或するための凹み穴）、及び貫
通孔（表面の配線導体と裏面の配線導体とを連通させる
ための貫通孔）の開口上面が、二次（！＋１戊形用金型
の下面で閉成される。また、二次側成形用金型の、上記
開口上面対応位置には、樹脂注入口が設けてある。一方
、基台金型の可動部は、基台金型の外周部と同位置まで
降下させ、基台金型の上而を面一に揃える。これにより
、絶縁部の下面と可動部上面との間に、対向空間が開く
。つまり、この対向空間は上記絶縁物の貫通孔と連通し
ている。In the secondary molding, a secondary molding die is used in place of the primary molding die. That is, the secondary molding die is placed on the upper surface of the insulating part. The lower surface of this secondary molding die is a flat surface (horizontal surface). Therefore, the recessed hole (
The upper surface of the opening of the recessed hole for forming a wiring conductor only on the front surface) and the through hole (through hole for communicating the wiring conductor on the front surface and the wiring conductor on the back surface) are It is closed on the bottom surface of the mold.Also, a resin injection port is provided at a position corresponding to the above-mentioned opening top surface of the secondary molding mold.On the other hand, the movable part of the base mold is Lower the mold to the same position as the outer periphery of the mold and align the physical structure of the base mold flush with each other.This opens an opposing space between the lower surface of the insulating part and the upper surface of the movable part.In other words, this opposing space The space communicates with the through hole of the insulator.
ここで、二次側戒形用金型側から環電性樹脂を注入して
、配線導体を形成する。Here, a ring-conductive resin is injected from the side of the secondary molding mold to form a wiring conductor.
かくして、絶縁性樹脂と導電性樹脂を用いて、簡易な２
色成形法により、樹脂基板（絶縁物）と一体の配線導体
（導電性樹脂）が、基板の両面に容易に形或できる。Thus, by using an insulating resin and a conductive resin, a simple 2
By the color molding method, wiring conductors (conductive resin) integrated with a resin substrate (insulator) can be easily formed on both sides of the substrate.
（ホ）実施例
第ｌ図及び第２図は、この発明に係る複合成形回路基板
の製造方法の具体的な一実施例を示している。(E) Embodiment FIGS. 1 and 2 show a specific embodiment of the method for manufacturing a composite molded circuit board according to the present invention.
第１図は、複合成形回路基板の一次側成形工程を示す断
面図である。FIG. 1 is a sectional view showing the primary side molding process of a composite molded circuit board.
一次側成形工程では、基台金型１上に一次側成形用金型
２を載せる（嵌合配置する）。基台金型１は、例えば上
開口有底の筒体形状で、底部の適所、つまり後述する絶
縁物の裏面に配線導体が必要とされる部分に、上下方向
へ昇降動可能な可動部１１が設けてある。また、一次側
成形用金型は一定厚みを有する平板で、基台金型１に対
し嵌合する大きさに形成してある。この一次側成形用金
型２の適所には樹脂注入口２ｌが開口してある。In the primary molding step, the primary molding mold 2 is placed on the base mold 1 (fitting arrangement). The base mold 1 has, for example, a cylindrical shape with an upper opening and a bottom, and a movable part 11 that can move up and down in the vertical direction is placed at a proper place on the bottom, that is, at a part where a wiring conductor is required on the back surface of an insulator, which will be described later. is provided. Further, the primary molding die is a flat plate having a constant thickness, and is formed in a size that fits into the base die 1. A resin injection port 2l is opened at a suitable position in the primary molding die 2.
更に、一次側成形用金型２の下面には、長さの短い足軸
（表面のみに配線導体を形或するための短足）２２と、
長さの長い足軸（表面の配線導体と裏面の配線導体とを
連通させるための長足）２３とが立設してある。一方、
基台金型１の可動部１１は、一次戒形用金型２側（上方
）へ上昇移動させてある。つまり、可動部ｌ１は基台金
型１の外周部１１ａに対し、段差状に上方へ移動させて
ある．従って、一次側成形用金型２と基台金型１との対
向状態は、可動部１１において、一次側成形用金型２の
長足２３先端が、可動部１１の上面に接面している。こ
の状態で、一次側成形用金型２と基本金型１との対向空
間に、絶縁性樹脂３ａを注入して絶縁部３を形戒する。Further, on the lower surface of the primary molding die 2, a short leg shaft 22 (a short leg for forming a wiring conductor only on the surface),
A long foot shaft (a long foot for communicating the wiring conductor on the front surface and the wiring conductor on the back surface) 23 is provided upright. on the other hand,
The movable part 11 of the base mold 1 is moved upward toward the primary molding mold 2 (upward). That is, the movable part l1 is moved upward in a stepped manner with respect to the outer peripheral part 11a of the base mold 1. Therefore, the facing state of the primary molding die 2 and the base mold 1 is such that the tip of the long leg 23 of the primary molding die 2 is in contact with the upper surface of the movable part 11 in the movable part 11. . In this state, insulating resin 3a is injected into the opposing space between primary molding die 2 and basic die 1 to form insulating portion 3.
つまり、一次側成形用金型２の上部に配置されるゲート
部金型４から、絶縁性樹脂３ａを流し込む時、この絶縁
性樹脂３ａは注入口部２ｌを介して対向空間に注入され
、所望形状の絶縁部（樹脂基板）３が得られる。That is, when insulating resin 3a is poured from the gate part mold 4 disposed on the upper part of the primary molding mold 2, this insulating resin 3a is injected into the opposing space through the injection port part 2l, and is injected into the opposing space as desired. A shaped insulating portion (resin substrate) 3 is obtained.
この絶縁部３の形成が完了した後に、二次側成形に移行
する。After the formation of the insulating portion 3 is completed, the process moves to secondary side molding.
第２図は、複合成形回路基板の二次側成形工程を示す断
面図である。FIG. 2 is a sectional view showing the secondary side molding process of the composite molded circuit board.
二次側成形工程では、一次側成形用金型２に替えて二次
側成形用金型５を使用する。つまり絶縁部３の上面に二
次側成形用金型５を配置する。この二次側成形用金型５
は、基台金型工に対し嵌合する大きさの平板で、下面を
平坦面（水平面）に形成してある。従って、一次側成形
用金型２の長・短足２２、２３によって絶縁部３に形成
された凹み穴（表面のみに配線導体を形或するための凹
み穴）３１、及び貫通孔（表面の配線導体と裏面の配線
導体とを連通させるための貫通孔）３２の開口上面が、
二次側成形用金型５の下面で閉威される。また、二次側
成形用金型５には、樹脂注入口５１が開口してあり、こ
の樹脂注入口５１が上記凹み穴３１、貫通孔３２に対応
するように設定してある。一方、基台金型１の可動部１
１は、基台金型１の外周部１１ａと同位置まで降下させ
、基台金型１の上面を面一に揃える。これにより、絶縁
部３の下面と可動部１１上面との間に、対向空間３３が
開く。従って、この対向空間３３は−Ｌ記絶縁物３の貫
通孔３２と連通している。ここで、二次側成形用金型側
５から導電性樹脂を注入し７て、配線導体６を形成する
。つまり、ゲート部金型４より導雫性樹脂６ａを流し込
むと、この導電性樹脂６ａが注入口部５１を介して、樹
脂基板（絶縁物）３の凹み穴３１、貫通孔３２、対向空
間３３に注入され、両面に配線導体６が形成される。In the secondary molding step, a secondary mold 5 is used in place of the primary mold 2. That is, the secondary molding die 5 is placed on the upper surface of the insulating section 3. This secondary side molding die 5
is a flat plate of a size that fits into the base mold, and the lower surface is formed into a flat surface (horizontal surface). Therefore, the recessed hole 31 (recessed hole for forming a wiring conductor only on the surface) formed in the insulating part 3 by the long and short legs 22 and 23 of the primary molding die 2, and the through hole (recessed hole on the surface) The opening upper surface of the through hole (32) for communicating the wiring conductor with the wiring conductor on the back side is
It is closed at the lower surface of the secondary molding die 5. Further, a resin injection port 51 is opened in the secondary side molding die 5, and the resin injection port 51 is set to correspond to the recessed hole 31 and the through hole 32. On the other hand, the movable part 1 of the base mold 1
1 is lowered to the same position as the outer peripheral part 11a of the base mold 1, and the upper surface of the base mold 1 is made flush. This opens an opposing space 33 between the lower surface of the insulating section 3 and the upper surface of the movable section 11. Therefore, this opposing space 33 communicates with the through hole 32 of the -L insulator 3. Here, a conductive resin is injected 7 from the secondary mold side 5 to form a wiring conductor 6. That is, when the conductive resin 6a is poured from the gate mold 4, the conductive resin 6a flows through the injection port 51 to the recessed hole 31 of the resin substrate (insulator) 3, the through hole 32, and the opposing space 33. The wiring conductors 6 are formed on both sides.
二次側成形が完了した後、基台金型１のノックビンｌｌ
ｂを動作させることで、樹脂基板（絶縁性樹脂基板）３
に対し配線導体（導電性樹脂）６が一体戒形された複合
成形回路基仮７を金型より取り出す。After the secondary side molding is completed, the knock bottle ll of the base mold 1
By operating b, the resin substrate (insulating resin substrate) 3
Then, the temporary composite molded circuit board 7 on which the wiring conductor (conductive resin) 6 is integrally formed is taken out from the mold.
かくして、絶縁性樹脂３ａと導電性樹脂６ａを用いて、
簡易な２色成形法により、第３図に示すような樹脂基板
（絶縁物）３と配線壇体（導電性樹脂）６とが一体とな
った複合成形回路基板７を得ることができる。また、こ
の複合戒形回路基板７は、第４図に示すように、樹脂基
板３の両面に配線導体６が一体に成形される。Thus, using the insulating resin 3a and the conductive resin 6a,
By a simple two-color molding method, a composite molded circuit board 7 in which a resin substrate (insulator) 3 and a wiring board (conductive resin) 6 are integrated as shown in FIG. 3 can be obtained. Further, in this composite circuit board 7, as shown in FIG. 4, wiring conductors 6 are integrally molded on both sides of the resin board 3.
従って、製造に際しての工程数が少なく簡易であり、し
かも基板３と配線導体６が一体に成形されるから、基板
３と配線導体６との剥離の虞れが全くなく、性能品質の
信頼性の高い複合成形回路基仮７を得ることが出来る。Therefore, the number of manufacturing steps is small and simple, and since the board 3 and the wiring conductor 6 are integrally molded, there is no risk of separation between the board 3 and the wiring conductor 6, and the reliability of performance and quality is improved. It is possible to obtain a high-quality composite molded circuit board temporary 7.
（へ）発明の効果
この発明では、以上のように、適所に可動部を備える基
台金型上に一次側成形用金型を配置し、絶縁性樹脂を注
入して樹脂絶縁基板を形成し、次いで、一次側成形用金
型に替えて二次側成形用金型を使用して絶縁基板に設け
た凹み穴、貫通孔及び基台金型の可動部の後退により設
けた対向空間に、導電性樹脂を注入して、配線導体を形
成することとしたから、絶縁性樹脂と導電性樹脂とを注
入するだけの簡易な作業で、工程数が少なく基板と配線
導体とを一体戊形し得る。また、基板と配線導体は２色
成形法により一体成形されるから、従来のように、温度
変化によって基板と配線導体が剥離する等の不利が解消
され、品質・性能の優れた複合成形回路基板を提供する
ことが出来る等、発明目的を達成した優れた効果を有す
る。(F) Effects of the Invention As described above, in this invention, a primary molding mold is placed on a base mold having a movable part at a proper location, and an insulating resin is injected to form a resin insulating substrate. Next, using a secondary molding mold instead of the primary molding mold, the recessed hole and through hole formed in the insulating substrate and the opposing space created by the retreat of the movable part of the base mold, Since we decided to form the wiring conductor by injecting conductive resin, the process is as simple as injecting insulating resin and conductive resin, and the board and wiring conductor can be integrally formed with fewer steps. obtain. In addition, since the board and wiring conductor are integrally molded using a two-color molding method, disadvantages such as the board and wiring conductor peeling off due to temperature changes are eliminated, resulting in a composite molded circuit board with excellent quality and performance. It has excellent effects that achieve the purpose of the invention, such as being able to provide the following.
第１図は、実施例複合成形回路基板の製造方法の一次成
形工程を示す断面図、第２図は、実施例複合成形回路基
板の製造方法の二次成形工程を示す断面図、第３図は、
実施例複合成形回路基板の製造方法により得られた複合
成形回路基板を示す斜視図、第４図は、復合成形回路基
板の断面図、第５図は、
従来の複合成形回路基板を示す斜視図
である。
二基台金型、
：絶縁物、
：配線導体、FIG. 1 is a cross-sectional view showing the primary forming process of the method for manufacturing the composite molded circuit board of the example, FIG. 2 is a cross-sectional view showing the secondary molding process of the method of manufacturing the composite molded circuit board of the example, and FIG. teeth,
A perspective view showing a composite molded circuit board obtained by the manufacturing method of an example composite molded circuit board, FIG. 4 is a sectional view of the composite molded circuit board, and FIG. 5 is a perspective view showing a conventional composite molded circuit board. It is. Two-base mold, : Insulator, : Wiring conductor,
Claims (1)
上部に一次側成形用金型を配備し、一次側成形用金型と
基台金型との対向空間に絶縁性樹脂を注入して所望形状
の絶縁部を形成する工程と、この一次側成形工程終了後
に、一次側成形用金型に替えて絶縁部の凹み穴開口面を
閉成する二次側成形用金型を配備すると共に、上記基本
金型の可動部を下降移動させて可動部と絶縁部との間に
対向空間を形成した後、二次側成形用金型と可動部との
間に導電性樹脂を注入して、絶縁部の両面に配線導体を
形成する工程とから成る複合成形回路基板の製造方法。(1) A primary molding mold is placed on top of a base mold with a movable part provided at the appropriate location moved upward, and an insulating resin is placed in the space facing the primary molding mold and the base mold. After this primary molding process is completed, a secondary molding mold is used to close the recessed hole opening surface of the insulation part in place of the primary molding mold. At the same time, the movable part of the basic mold is moved downward to form an opposing space between the movable part and the insulating part, and then a conductive resin is placed between the secondary molding mold and the movable part. A method for manufacturing a composite molded circuit board comprising the steps of: forming wiring conductors on both sides of an insulating part by injecting the same.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24270289A JPH03104614A (en) | 1989-09-19 | 1989-09-19 | Manufacture of composite molded circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24270289A JPH03104614A (en) | 1989-09-19 | 1989-09-19 | Manufacture of composite molded circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03104614A true JPH03104614A (en) | 1991-05-01 |
Family
ID=17092978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24270289A Pending JPH03104614A (en) | 1989-09-19 | 1989-09-19 | Manufacture of composite molded circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03104614A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015095562A (en) * | 2013-11-12 | 2015-05-18 | 日本メクトロン株式会社 | Filling method of conductive paste, and manufacturing method of multilayer printed wiring board |
| JPWO2016021618A1 (en) * | 2014-08-05 | 2017-06-01 | 株式会社江東彫刻 | Wiring circuit component manufacturing method, mold for manufacturing wiring circuit component, resin wiring circuit component |
-
1989
- 1989-09-19 JP JP24270289A patent/JPH03104614A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015095562A (en) * | 2013-11-12 | 2015-05-18 | 日本メクトロン株式会社 | Filling method of conductive paste, and manufacturing method of multilayer printed wiring board |
| JPWO2016021618A1 (en) * | 2014-08-05 | 2017-06-01 | 株式会社江東彫刻 | Wiring circuit component manufacturing method, mold for manufacturing wiring circuit component, resin wiring circuit component |
| EP3197248A4 (en) * | 2014-08-05 | 2018-03-07 | Koto Engraving Co. Ltd. | Method for making wiring circuit component, mold for making wiring circuit component, and resinous wiring circuit component |
| US10390437B2 (en) | 2014-08-05 | 2019-08-20 | Koto Engraving Co., Ltd. | Method for manufacturing wiring circuit component, mold for manufacturing wiring circuit component, and resinous wiring circuit component |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4954307A (en) | Method for manufacturing plastic encapsulated electronic semiconductor devices | |
| US5133921A (en) | Method for manufacturing plastic encapsulated electronic semiconductor devices | |
| EP0817261A1 (en) | Method for manufacturing plastic package for electronic device having a fully insulated dissipator | |
| JPS594878B2 (en) | Method of providing conductor tracks on a substrate made of insulating material | |
| JPH11185926A (en) | Connector, manufacture thereof, and mold structure employed therefor | |
| TW200507353A (en) | Electrically conductive structure formed between neighboring layers of circuit board and method for fabricating the same | |
| JPH03104614A (en) | Manufacture of composite molded circuit board | |
| JP3193194B2 (en) | Method of molding lens coating layer on LED chip mounted on substrate and substrate structure for molding the same | |
| WO2022206748A1 (en) | Semiconductor encapsulation method and semiconductor encapsulation structure | |
| JPH07335999A (en) | Production process of composite circuit board | |
| JP2654551B2 (en) | Manufacturing method of switch | |
| US7000317B1 (en) | Method for manufacturing electrical connectors for enhancing coplanarity | |
| JP2000025069A (en) | Production of insert resin molded circuit board | |
| JPH07245154A (en) | Inter-terminal shield connector and its manufacture | |
| JPH0774451A (en) | Manufacture of circuit board | |
| JPH01170088A (en) | Manufacture of molded circuit substrate | |
| CN216562853U (en) | Conductive silica gel key | |
| CN217196655U (en) | Bus cladding insulating layer injection mold | |
| CN209478782U (en) | A kind of wire bushing mold | |
| JP3722236B2 (en) | Circuit body manufacturing method | |
| WO2001048819A3 (en) | Interconnect structure and method of fabrication therefor | |
| JPH05291320A (en) | Electronic part and manufacturing method | |
| JP2002120258A (en) | Method for manufacturing molding electric circuit plate | |
| JPH03177056A (en) | Manufacture of printed-circuit board | |
| CN116945471A (en) | Plastic copper-clad forming die for high-precision EPS wiring frame |