JPH03104611A - Manufacture of roll-type stamper - Google Patents

Abstract

PURPOSE:To uniformize bonding layer and prevent air bubbles from mixing in the layer by a method wherein adhesive, which is placed between a stamper and a die set, is sucked by vacuum before its solidification. CONSTITUTION:Firstly, a nickel stamper, at the center on the rear face of which adhesive 4 arranged, is placed upon a die set 1. The adhesive 4 is spread wholly by bending a stamper master and the stamper along the die set. At this time, overflown adhesive is removed. Next, the die set 1, upon which the stamper master and the stamper are placed, is set on a heating plate 7 and its bond edge face is sealed and, after that, the stamper and the die set are adherently fixed to each other with a stamper edge face hold-down jig 5. Adhesive is fully softened by being heated up to its softening temperature with the heating plate 7 and squeezed out of the rear face of the stamper master so as to remove air bubbles or the like left between the stamper and the die set in order to strengthen the adherence between the stamper and the die set. By sucking the adhesive through suction ports arranged on the surface of the die set, excess adhesive is removed. Under the state just mentioned above, the adhesive is hardened by elevating the temperature of the die set.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for manufacturing a roll-type stamper for continuous molding of substrates for optical recording media, and more particularly to a method for bonding a stamper to a gusset using an adhesive. ．． [Prior Art] As shown in FIG. 4, a conventional roll-type stamper applies an adhesive 4 onto a forming roll 13, and then places a stamper 2 on top of the adhesive 4.
They were piled up and pressed together using a heated press plate l5 via silicone rubber l4. [Problems to be solved by the invention] However, it is difficult to uniformly transmit pressure from the press plate to the stamper, resulting in uneven adhesion, air bubbles getting into the adhesive layer between the stamper and the roll, and problems with the heating body. Because silicone rubber, etc. is interposed between a certain press plate and the stamper to relieve pressure distribution, heat conductivity is poor and it takes time to harden.Furthermore, by pressing the uneven surface of the stamper with silicone rubber, The problem was that defects could occur.

In addition, the method of attaching the stamper to the die set instead of the roll itself and setting the die set to the roll simplifies the bonding work, but it also reduces the uniformity of the adhesive layer.
No measures have been taken to prevent air bubbles from entering. [Means for Solving the Problems] As a result of intensive studies to solve the above problems, the inventors have found that:
A roll type stamper for continuous molding of a resin substrate, comprising a die set to which a stamper is bonded, arranged on a roll core, the roll being characterized in that the adhesive between the stamper and the die set is vacuum-suctioned before solidifying. We have discovered a method for manufacturing mold stampers. The present invention will be explained in detail below. FIG. 1 shows how the stamper 2 is connected to the die set 1 in the present invention.
3 is a diagram showing the configuration of a device for fixing the stamper, 3 is a stamper master disk, 5 is a stamper end face pressing jig, 6 is a silicone sealant, 7 is a heating plate, 8 is a vacuum bomb connection port,
9 is a vacuum chamber. FIG. 2 is a diagram showing the structure of the die set used in the present invention, in which a die set 10 is provided at a position that does not affect the group pattern of stampers to be pasted together, and an adhesive suction hole 1l is provided at an arbitrary location. The adhesive suction hole 11 is connected to the vacuum chamber connection port l2 on the back of the glue set, and the connection port l
2 is connected to the vacuum chamber 9. FIG. 3 is a diagram showing the bonding process. Here, a stamper master made of resin or a resin-supplementary material is used as the stamper master, and Ni electroforming is performed on this to create a Ni stamper on which the irregularities of the stamper master are transferred. do. Since the electroformed surface of the Ni stamper is rough, it is lapped to form a flat surface that is parallel to the uneven surface. The wrap surface and the adhesive surface of the Guiset may be surface-treated to improve the wettability of the adhesive. First, place adhesive 4 at the center of the back of the Ni stamper and overlap it with glue set 1. Bend the stamper master and the stamper along the guide set so that the adhesive 4 is spread all over. At this time, remove any overflowing adhesive. Next, as shown in FIG. 1, the die set 1 in which the stamper master and the stamper are stacked is placed on the heating plate 7, and the adhesive end surfaces of the die set and the stamper are sealed with a silicone sealant. Fix the stamper and the grip set tightly using the stamper end face holding jig 5. The heating plate 7 can be heated to the softening temperature of the adhesive to sufficiently soften the adhesive, and then squeezed from the back side of the stamper master to remove any air bubbles remaining between the stamper and the die set to strengthen the adhesion. can. After the adhesive has been sufficiently spread in this way, the adhesive is sucked through the adhesive suction hole placed on the surface of the gusset to remove excess adhesive, and in this state, the temperature is further raised to remove the adhesive. Let it harden, take it out from the sticky jig, set it on a roll,
By peeling off the stamper master on the surface of the stamper, the roll-type stamper of the present invention can be obtained. C Example The present invention will be explained below based on an example. Example 1 As shown in Fig. 2, a die set having an adhesive suction hole and a Kuko chamber connection port was made of copper alloy, treated with a tJV coating, and heated to 60°C. The stamper exposes a glass substrate coated with resist to light through a photomask and casts it onto the master disc.
After laminating the Ni film by sputtering and performing conductive treatment,
A Ni film was formed to a thickness of 0.2 by electroforming. After wrapping and cleaning the back side of the stamper produced in this way, silicone adhesive (TSE 322, manufactured by Toshiba Silicone) was applied, and the die set was placed in a predetermined position, and the die set was heated to 60°C. Use a squeegee to perform vacuum suction. After excess adhesive has been thoroughly removed, 150
The adhesive was cured by heating at ℃ for 2 hours. After cooling, the die set was assembled into a roll to produce a substrate for optical recording media, and there was almost no unevenness in the thickness of the formed substrate. [Effects of the Invention] As explained above, by solidifying the adhesive while vacuum suctioning the stamper from the back side of the die set, it is possible to suppress unevenness in the thickness of the hollow-shaped substrate. The adhesion of the die set has been improved, and there is no peeling of the stamper end face or adhesive protruding from the end face, simplifying the work.

[Brief explanation of drawings]

Fig. 1 is a schematic diagram showing the configuration of a vine bonding device used in the method of the present invention, Fig. 2 is a plan view and sectional view of a vine die set used in the present invention, and Fig. 3 is a schematic diagram of the manufacturing process of the present invention. figure,
Figure 4 shows the conventional manufacturing process. 1...Die set 2...Stamper 3...
Stamper master 4... Adhesive 5... Stamper holding jig 6... Silicone sealing material 7... Heating plate 8... Vacuum bomb connection port 9... Vacuum chamber 10... Groove 1l.・Adhesive suction hole 12 ・Vacuum chamber connection port

Claims (1)

[Claims] 1. In a roll-type stamper for continuous molding of a resin substrate, which has a die set to which a stamper is bonded and arranged on a roll core, the adhesive between the stamper and the die set is bonded before solidifying. A method for manufacturing a roll stamper characterized by vacuum suction. 2. The manufacturing method according to claim 1, wherein the die set is provided with grooves and holes for vacuum suction of the adhesive. 3. Claim 1 or 2, characterized in that the stamper is adhesively fixed to the die set without peeling off the stamper master formed from a resin or a composite material of resin and auxiliary material from the stamper.
The manufacturing method described in.