JPH03103850A - Reticle - Google Patents

Abstract

PURPOSE:To prevent the breakdown of a pattern caused by static electricity by providing the part having no Cr film along the outer periphery of a substrate. CONSTITUTION:A Cr film formed on a transparent substrate 1 is brought to pattern formation by executing exposure etching with the use of a positive resist. Also, the Cr film 2 is formed so as not to be present on the width of at least 5mm running along the outer periphery of the transparent substrate 1. That is, since the Cr film is not formed along the periphery of the transparent substrate 1, even if a washing holder 9 is electrified at the time of washing, the Cr film 2 of a reticle is not brought into contact with the washing holder 9. Accordingly, the pattern 5 of the reticle is not influenced by static electricity of the washing holder. Also, at the time of handling the reticle, since a person handles the outer periphery, the flow of an electron by static electricity is not generated. In such a manner, the breakdown of the pattern caused by static electricity can be prevented.

Description

[Detailed Description of the Invention] [Summary] With regard to reticles used during exposure for manufacturing semiconductor devices, a Cr film formed on a transparent substrate is used to prevent the pattern of the reticle from being destroyed by static electricity. In a reticle with a pattern formed by exposure etching using a positive resist,
The Cr film has a thickness of at least 5+nm along the outer periphery of the transparent substrate.
TECHNICAL FIELD The present invention relates to a reticle used during exposure for manufacturing semiconductor devices.

In recent years, as the performance of semiconductor devices has improved, there has been a demand for reticles of excellent quality, but one of the major problems when manufacturing reticles is the problem of pattern loss due to static electricity.

[Conventional technology]

A reticle in which a pattern is formed by etching a Cr film using a conventional positive resist is produced as shown in FIG. In this method, first, as shown in figure (a), a Cr film 2 is formed on a transparent substrate 1 such as glass, and then (
b) A positive resist film 3 is applied as shown in the figure, and this positive resist film 3 is developed with i-light to form a resist pattern 4 as shown in the figure (C). Finally, as shown in (d), the Cr film 2 is etched using the resist pattern 4 as a mask.
) (2> The film pattern 5 is formed. At this time, the outer peripheral Cr
The film 2 is left for light shielding during exposure. Note that (e) is (d)
) is a plan view of the figure, in which the Cr film is shown with hatching. Further, in the same figure, 6 is a scribe line, and 7 is a symbol portion in which alignment information and the like are recorded.

[Problem to be solved by the invention]

The conventional reticle described above has a problem in that pattern destruction occurs due to static electricity during cleaning or when the outer periphery is touched by hand.

SUMMARY OF THE INVENTION In view of the above conventional problems, it is an object of the present invention to provide a reticle that can prevent pattern destruction due to static electricity.

[Means to solve the problem]

In order to achieve the above object, the reticle of the present invention is a reticle in which a pattern is formed by exposing and etching a Cr film formed on a transparent substrate 1 using a positive resist.
The Cr film 2 extends at least 5 m along the outer periphery of the transparent substrate 1.
It is characterized in that it is formed so that it does not exist in the width of n+.

[For production]

C in a width of at least 5+nm along the periphery of the transparent substrate 1
By not forming the r film, even if the cleaning holder 9 is charged during cleaning, the Cr film 2 of the reticle does not come into contact with the cleaning holder 9, so the pattern 5 of the reticle is not affected by the static electricity of the cleaning holder. Furthermore, when handling the reticle, a person holds the outer periphery without a Cr film, so no flow of electrons occurs due to static electricity, and the pattern 5 is not destroyed.

〔Example〕

FIG. 1 is a diagram showing an embodiment of the present invention, in which (a) is a plan view and (b) is a sectional view taken along the line bb in FIG.

In the figure, 1 is a transparent substrate made of glass or the like, 5 is a Cr film pattern for chip exposure, 6 (the part without the Cr film) is a scribe line, and 7 is the scrubber (3) (4)? A symbol portion 2 showing symbols such as alignment information formed in the brine is a Cr film left to block excess light during exposure. The main point of this embodiment is that the outer Cr film 2 is coated for at least 5 m along the outer periphery of the transparent substrate 1.
The reason is that it is not formed in an m-wide area. Note that as a method for not forming a Cr film in this 5 mm wide area, it is possible to remove the Cr film by etching the Cr film formed on the entire surface of the transparent substrate at the same time as forming the chip exposure pattern 5, or to remove the Cr film on the transparent substrate. When sputtering or vapor depositing a film, a jig may be used to cover the outer peripheral part so that the Cr film is not formed on the peripheral part.

The operation of this embodiment thus constructed will now be described.

FIG. 3 shows a case in which a conventional reticle 8 is placed in a cleaning holder 9 for cleaning. In this case, since the cleaning holder 9 is negatively charged by cleaning, this static electricity is transferred to the Cr film on the outer periphery of the reticle 8. 2 and becomes negatively charged. (b)
As shown in the figure, when a person's hand or the ground 10 touches the inner pattern 5, an electric discharge occurs and the pattern 5 is destroyed. (C) As shown in the figure, electrons e are transferred from the outer Cr film 2 to the inner pattern 5.
and causes destruction in that area. Further, when the reticle 8 is positively charged due to the environment as shown in FIG. 3(d), when a person touches the Cr film 2 on the outer periphery, electrons e will fly to the inner pattern 5 and cause the pattern 5 to be destroyed.

On the other hand, in the embodiment of the present invention, when the transparent substrate is placed in the cleaning holder 9 as shown in FIG. The Cr film 2 does not contact the cleaning holder 9. For this reason, static electricity is not transmitted to the Cr film 2 on the outer periphery, so even if something like earth approaches the pattern, no discharge will occur, and therefore, the pattern 5 will not be destroyed.

Also, as shown in Figure 3(d), depending on the environment, the reticle 8
If the reticle is positively charged, in this embodiment, even if a person handles the reticle by the outer periphery, no discharge will occur because there is no Cr film on the outer periphery, and the pattern will not be destroyed.

(5) (6) [Effects of the Invention] As explained above, according to the present invention, by providing a portion without a Cr film along the outer periphery of the substrate, pattern destruction due to static electricity can be prevented. , it can contribute to improving the yield of reticles.

[Brief explanation of drawings]

FIG. 1 is a diagram showing an embodiment of the present invention, FIG. 2 is a diagram for explaining the operation of the embodiment of the present invention, and FIG. 3 is a diagram for explaining electrostatic damage of a pattern in a conventional reticle. FIG. 4 is a diagram for explaining a conventional reticle manufacturing method. In the figure, 1 is a transparent substrate, 2 is a Cr film on the outer periphery, 5 is a pattern, 6 is a scribe line, 7 is a symbol part, 8 is a reticle, and 9 is a cleaning holder.

Claims (1)

[Claims] 1. In a reticle in which a pattern is formed by exposing and etching a Cr film formed on a transparent substrate (1) using a positive resist, the Cr film (2) is formed on the outer periphery of the transparent substrate (1). A reticle characterized in that it is formed so that it does not exist in a width of at least 5 mm along the reticle.