JPH03102766U - - Google Patents
Info
- Publication number
- JPH03102766U JPH03102766U JP1167690U JP1167690U JPH03102766U JP H03102766 U JPH03102766 U JP H03102766U JP 1167690 U JP1167690 U JP 1167690U JP 1167690 U JP1167690 U JP 1167690U JP H03102766 U JPH03102766 U JP H03102766U
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- ground plane
- wiring board
- film wiring
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010409 thin film Substances 0.000 claims description 7
- 239000004642 Polyimide Substances 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990011676U JPH085579Y2 (ja) | 1990-02-08 | 1990-02-08 | 薄膜配線基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990011676U JPH085579Y2 (ja) | 1990-02-08 | 1990-02-08 | 薄膜配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03102766U true JPH03102766U (US07534539-20090519-C00280.png) | 1991-10-25 |
| JPH085579Y2 JPH085579Y2 (ja) | 1996-02-14 |
Family
ID=31515197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990011676U Expired - Lifetime JPH085579Y2 (ja) | 1990-02-08 | 1990-02-08 | 薄膜配線基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH085579Y2 (US07534539-20090519-C00280.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004214412A (ja) * | 2002-12-27 | 2004-07-29 | Tohoku Ricoh Co Ltd | ノイズシールド板及びプリント配線板 |
| JP2007116010A (ja) * | 2005-10-24 | 2007-05-10 | Sumitomo Bakelite Co Ltd | 回路基板 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015083216A1 (ja) * | 2013-12-02 | 2015-06-11 | 山一電機株式会社 | 多層基板、及び、その製造方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59119797A (ja) * | 1982-12-25 | 1984-07-11 | 京セラ株式会社 | 多層配線基板 |
| JPS60211897A (ja) * | 1984-04-05 | 1985-10-24 | 日本電気株式会社 | 多層配線基板 |
| JPS6423598A (en) * | 1987-07-20 | 1989-01-26 | Sony Corp | Multilayer circuit board |
| JPS6482694A (en) * | 1987-09-25 | 1989-03-28 | Toshiba Corp | Wiring substrate |
-
1990
- 1990-02-08 JP JP1990011676U patent/JPH085579Y2/ja not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59119797A (ja) * | 1982-12-25 | 1984-07-11 | 京セラ株式会社 | 多層配線基板 |
| JPS60211897A (ja) * | 1984-04-05 | 1985-10-24 | 日本電気株式会社 | 多層配線基板 |
| JPS6423598A (en) * | 1987-07-20 | 1989-01-26 | Sony Corp | Multilayer circuit board |
| JPS6482694A (en) * | 1987-09-25 | 1989-03-28 | Toshiba Corp | Wiring substrate |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004214412A (ja) * | 2002-12-27 | 2004-07-29 | Tohoku Ricoh Co Ltd | ノイズシールド板及びプリント配線板 |
| JP4494714B2 (ja) * | 2002-12-27 | 2010-06-30 | 東北リコー株式会社 | プリント配線板 |
| JP2007116010A (ja) * | 2005-10-24 | 2007-05-10 | Sumitomo Bakelite Co Ltd | 回路基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH085579Y2 (ja) | 1996-02-14 |
