JPH03101541U - - Google Patents
Info
- Publication number
- JPH03101541U JPH03101541U JP1990009189U JP918990U JPH03101541U JP H03101541 U JPH03101541 U JP H03101541U JP 1990009189 U JP1990009189 U JP 1990009189U JP 918990 U JP918990 U JP 918990U JP H03101541 U JPH03101541 U JP H03101541U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- heat sink
- hybrid integrated
- thick film
- film substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/5363—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990009189U JPH03101541U (enExample) | 1990-02-01 | 1990-02-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990009189U JPH03101541U (enExample) | 1990-02-01 | 1990-02-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03101541U true JPH03101541U (enExample) | 1991-10-23 |
Family
ID=31512794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990009189U Pending JPH03101541U (enExample) | 1990-02-01 | 1990-02-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03101541U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110071088A (zh) * | 2018-01-22 | 2019-07-30 | 松下知识产权经营株式会社 | 半导体装置 |
| JP2019129311A (ja) * | 2018-01-22 | 2019-08-01 | パナソニックＩｐマネジメント株式会社 | 半導体装置 |
-
1990
- 1990-02-01 JP JP1990009189U patent/JPH03101541U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110071088A (zh) * | 2018-01-22 | 2019-07-30 | 松下知识产权经营株式会社 | 半导体装置 |
| JP2019129311A (ja) * | 2018-01-22 | 2019-08-01 | パナソニックＩｐマネジメント株式会社 | 半導体装置 |
| CN110071088B (zh) * | 2018-01-22 | 2023-03-17 | 松下知识产权经营株式会社 | 半导体装置 |