JPH03101083A - Connector fixing structure for surface mounting type board - Google Patents

Abstract

PURPOSE:To prevent any disconnection in insertion or removal of a connector or caused by solder fatigue by forming engagement projections on the insulating layer side of a circuit board, engaging them with an engagement portion formed in a connector pin, and joining the end on the board side of the connector pin with a conductor pattern. CONSTITUTION:A notch is formed at a part of a circuit board 10 where a conductor pattern 10C is not formed, to be raised on an insulating layer 10B side, and engagement projections 102, 103 are formed. An engagement portion 241a engaged with the engagement projections 102, 103 is formed in a connector pin 241. Faces of the insulating layer 10B side in the engagement projections 102, 103 are engaged with the engagement portion 241a in such a manner as to support a load in insertion or removal of a connector. The end of the board side of the connector pin 241 is joined with the conductor pattern 10C. Therefore, the insertion or removal force of the connector is not exerted directly on a soldered joint, to prevent any disconnection as well as any solder fatigue caused by vibration.

Description

DETAILED DESCRIPTION OF THE INVENTION A. Field of Industrial Application The present invention relates to a structure for attaching a connector to a surface-mounted board.

B. Prior art Conventionally, for example, a metal plate 10A as shown in FIG.
The insulating layer 10B formed on the surface and the insulating layer 10
A wiring board 10 having a three-layer structure including a wiring conductor pattern 10C formed on a wiring board B is known. In this type of wiring board 10, since the metal plate 10A is a conductor, the connector 21. Resistance 22. IC23 etc. are conductive pattern IO
It is surface mounted on C by, for example, soldering using a reflow method.

Here, the connector 21 is formed by integrally providing a plurality of connector bins 211 at predetermined intervals in a case 212, and the rear end of the connector bin 211 protrudes from the case 21 and is soldered to the conductor pattern IOC at a solder joint 24. There is.

C6 Problems to be Solved by the Invention However, the connector 21 is only connected to the wiring board 10 at the solder joint 24, and the load when inserting and removing the connector 21 acts directly on the solder joint 24, causing wire breakage. There is a risk of Furthermore, there is also a risk that the solder joint portion 24 may suffer solder fatigue and break due to vibration of the unit in which the wiring board 10 is provided. Furthermore, when soldering the connector 21, it is difficult to fix the position of the connector 21 on the board 10, and there is a risk that the connector 21 may be misaligned during the reflow soldering process.

The present invention solves the above-mentioned problems by mechanically positioning a connector on a single-sided mounting type board.

The present invention will be explained in conjunction with FIG. 1 showing an embodiment of the invention.The present invention is a wiring structure in which a conductive pattern 10C is disposed on the surface of a metal plate 10A via an insulating layer 10B. It is applied to a structure in which a connector is attached to the board 10.

As shown in FIG. 1, in the present invention, a part of the wiring board 10 where the conductor pattern 10C is not formed is cut and raised to the insulating layer side to form engaging protrusions 102, 103, and the connector The pin 241 has the engagement protrusion 102,1
03, and the surface of the insulating layer 10B of the engaging protrusions 102, 103 is engaged with the engaging part 241a so as to support the load when the connector is inserted or removed. The above problem is solved by joining the substrate side end of 241 to the conductor pattern IOC.

Since the E0 action connector pin 241 mechanically engages with the engagement protrusions 102, 103 and the engagement portion 241a, the connector insertion/removal force does not directly act on the solder joint, preventing wire breakage.
Solder fatigue due to vibration is also prevented, and positioning during soldering becomes reliable.

In the above-mentioned sections and section E, which describe the present invention in detail, figures of embodiments are used to make the present invention easier to understand, but the present invention is not limited to the embodiments.

F. Embodiment A first embodiment will be explained with reference to FIGS. 1(a) and 1(b). FIG. 1(a) is a plan view, and FIG. 1(b) is a perspective view of the main part.

In FIG. 1, as described above, the wiring board 10 is formed by forming an insulating layer 10B on a metal plate 10A, and forming a conductive pattern 10C thereon. An opening-shaped cut is made in a region R1 at the end of the wiring board 10 where no conductor pattern is formed, and a pair of engaging protrusions 102 and 103 are raised. On the other hand, the connector pin 241 is formed into a crank shape as shown in the figure, and the crank portion 241a is connected to the engaging protrusions 102, 103.
sandwiched between. Since the insulating WJ10B is formed on the surfaces of the engaging protrusions 102 and 103, the connector pin 2
41 is insulated from the wiring board 10. Further, the end portion of the connector pin 241 is electrically connected to the conductor pattern 10C at the solder joint portion 35.

In this first embodiment, the connector pin 241 is connected to the engagement protrusion 102. Since it is mechanically connected to the wiring board 10 by -103, the load that is applied when the connector is inserted and removed is supported by the engaging protrusions 102 and 103 and does not act on the solder joint 35, so that disconnection accidents do not occur. Also, since the wiring board 10 and the connector pin 4 241 vibrate in the same vibration mode, the solder joint 35
This also prevents wire breakage due to fatigue. Furthermore, half-III attachment by the reflow method ensures that the position is determined even during the process.

Second Embodiment A second embodiment will be described with reference to FIGS. 2(a) and 2(b). FIG. 2(a) is a plan view, and FIG. 2(b) is a perspective view of the main part.

Three engaging protrusions 10 are formed by making a mouth-shaped cut in a region R1 at the end of the wiring board 10 where no conductor pattern is formed.
Launch 4,105,106.

On the other hand, the connector pin 251 is formed with a chevron-shaped engaging portion 251a as shown in the figure, and the engaging portion 251a is connected to the engaging protrusion 1.
04-106 as shown. Engagement protrusion 104
Since the insulating layer 10B is formed on the surfaces of the connector pins 251 to 106, the connector pins 251 are attached to the wiring board 10 in an insulated state.

One end of the connector pin 251 is electrically connected to the conductive pattern IOC at the solder joint 36.

Also in this second embodiment, the connector pin 251 is connected to the engagement protrusion 1.
Since it is mechanically connected to the wiring board 10 by 04 to 106, the load that is applied when inserting and removing the connector is transferred to the engaging protrusion 1.
No. 04 to 106 are supported, and breakage accidents at the solder joints 36 do not occur. In addition, the wiring board 10 and the connector pin 251
Since they vibrate in the same vibration mode, disconnection due to fatigue of the solder joint 36 is also prevented. Furthermore, soldering also ensures reliable positioning.

The second embodiment can be modified as shown in FIG.

A hemispherical engaging portion 261a is provided protrudingly on the connector pin 261, and this engaging portion 261a is connected to a pair of engaging protrusions 104, 10.
It engages between 6 and 6. Similar effects can also be obtained by this.

- Third Embodiment The third embodiment will be described with reference to FIGS. 4(a) and 4(b). FIG. 4(a) is a plan view, and FIG. 4(b) is a perspective view of the main part.

A U-shaped cut is made in a region R1 at the end of the wiring board 10 where no conductor pattern is formed, and three engaging protrusions 10 are formed.
Launch 7,108,109.

The engaging protrusions 107 and 108 are arranged opposite to each other.

On the other hand, the connector pin 271 is formed with a chevron-shaped engaging portion 271a as shown in the figure, and the engaging protrusion 109 is engaged with the inner side of the engaging portion 271a as shown in the figure. In addition, the engaging protrusion 1
A connector pin 271 is sandwiched between 07 and 108. Since the insulating layer 10B is formed on the surfaces of the engaging projections 107 to 109, the connector pin 271 is held in an insulated state on the wiring board 10. The end of the connector pin 271 is electrically connected to the conductor pattern IOC at the solder joint 39.

This third embodiment also provides the same effects as described above. Note that FIGS. 5 and 6 show other methods for solving the problems of the present invention.

In FIG. 5, one end of the wiring board 10 is raised up into an L-shape to form a wall 11, and this wall 11 is provided with a plurality of through holes 11a at predetermined intervals. An annular insulating bushing 31 made of rubber or resin, for example, is fitted into the through hole 11a, and a connector pin 221 is fitted and held in the insulating bushing 31.

- The end of the connector pin 221 on the board side is processed into a thin flexible lead 221a, which is soldered to the conductor pattern 10C at the solder joint 38.

According to the structure of such a connector installation, the load acting on the connector pin 221 when the connector is inserted or removed is supported by the frictional resistance between the connector pin 221 and the insulating bushing 31, and does not act directly on the solder joint 38. Also, even if the connector pin 221 moves a little at that time, the connector pin 22
Since a deformable dome 221a is formed at one end of the solder joint 38, no large load is applied to the solder joint 38, and there is little risk of wire breakage. Furthermore, the flexible leads 221a prevent solder fatigue due to vibration, making it possible to provide a wiring board with higher durability than conventional wiring boards.

Furthermore, soldering by the flow method in which the connector pins 221 are reliably positioned eliminates the risk of the connector pins 221 being misaligned during the process, making it possible to provide a wiring board with high dimensional accuracy.

Other methods will be explained with reference to FIGS. 6(a) to 6(c).

6(a) is a side view, FIG. 6(b) is a front view of the main part of 8, and FIG. 6(c) is a plan view of (b).

The wiring board 10 is bent into a substantially U-shape as shown, and a cut 101 is formed in each of the vertically opposing bent ends. Each notch 101 has an insulating bushing 32.3.
3 is fitted, and the connector pin 231 is held between the insulating bushings 32 and 33. The electrical connection between the connector pin 231 and a conductor pattern (not shown) is made by a flexible solder wire.

The lead 34 is made of a conductive material such as copper wire or aluminum wire, and one end of the lead 34 is connected to a solder joint 35.
It is soldered to the conductor pattern.

In this method as well, the same effects as explained in FIG. 5 can be obtained, and it is possible to prevent wire breakage when inserting and removing the connector and wire breakage due to solder fatigue, and also prevent positional shift when attaching a half-ITJ.

G0 Effects of the Invention According to the present invention, since the connector pins are mechanically attached to the wiring board in an insulated state, the load when inserting and removing the connector does not act on the solder joints, preventing wire breakage and reducing vibration. This also prevents solder fatigue.

Furthermore, soldering allows for reliable positioning and provides a wiring board with high dimensional accuracy.

[Brief explanation of drawings]

Figure 1 (a) is a plan view of the first embodiment, (b) is a perspective view of its main parts, Figure 2 (,) is a plan view of the second embodiment, (b)
) is a perspective view of the main part, FIG. 3(a) is a plan view showing a modification of the second embodiment, FIG. 4(b) is a perspective view of the main part, and FIG.
a) is a plan view of the third embodiment, (b) is a perspective view of the main parts thereof, FIG. 5 is a perspective view showing another connector mounting structure, and FIG. 6(a) is a further diagram of another connector mounting structure. Side view, (b) is a front view of the main part, (c) is a plan view of (b),
FIG. 7 is a side view of a wiring board illustrating a conventional example. 10: Wiring board 10A: Metal plate 10B: Insulating layer 10C: Conductor pattern 11: Standing wall 31-33: Insulating bush 34: Flexible lead 35-39: Solder joint 102-109: Engaging protrusion 221.231 , 241, 251, 261, 271: Connector pin 221a: Flexible lead 241a, 251a, 271a: Crank part 261a
: Hemispherical engagement part

Claims (1)

[Claims] In a structure for attaching a connector to a wiring board in which a conductor pattern is disposed on the surface of a metal plate via an insulating layer, a cut is made in a part of the wiring board where the conductor pattern is not formed. An engaging protrusion is formed on the side of the insulating layer, and an engaging portion that engages with the engaging protrusion is formed on the connector pin. 1. A connector mounting structure for a surface-mounted board, characterized in that a surface of an insulating layer and an engaging portion are engaged, and an end of the connector pin on the board side is joined to the conductor pattern.