JPH03101040U - - Google Patents
Info
- Publication number
- JPH03101040U JPH03101040U JP1042890U JP1042890U JPH03101040U JP H03101040 U JPH03101040 U JP H03101040U JP 1042890 U JP1042890 U JP 1042890U JP 1042890 U JP1042890 U JP 1042890U JP H03101040 U JPH03101040 U JP H03101040U
- Authority
- JP
- Japan
- Prior art keywords
- base
- resonant element
- acoustic wave
- piezoelectric substrate
- lead terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010897 surface acoustic wave method Methods 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
第1図は本考案に係る弾性表面波共振子の一実
施例を示す構造説明図、第2図は同実施例におけ
るSAW共振素子の正面図、第3図は同実施例の
共振素子保持構造の側断面図、第4図は共振素子
の変形例を示す正面図、第5図は共振素子保持構
造の変形例を示す断面図、第6図は従来例を一部
破断状態を示す斜視図である。
1……SAW共振素子、2……ベース、3……
気密キヤツプ、4……絶縁材料、5……リード端
子、5A……凹部、6及び8……導電性接着剤、
7……非導電性接着剤、11……圧電基板、12
……電極パターン、13及び13′……電極引出
し部、13A及び13A′……接続部。
Fig. 1 is a structural explanatory diagram showing one embodiment of a surface acoustic wave resonator according to the present invention, Fig. 2 is a front view of a SAW resonant element in the same embodiment, and Fig. 3 is a resonant element holding structure of the same embodiment. 4 is a front view showing a modified example of the resonant element, FIG. 5 is a sectional view showing a modified example of the resonant element holding structure, and FIG. 6 is a perspective view showing a conventional example in a partially broken state. It is. 1...SAW resonant element, 2...Base, 3...
Airtight cap, 4... Insulating material, 5... Lead terminal, 5A... Recess, 6 and 8... Conductive adhesive,
7... Non-conductive adhesive, 11... Piezoelectric substrate, 12
. . . Electrode pattern, 13 and 13' . . . Electrode extraction portions, 13A and 13A’ .
Claims (1)
の少なくとも一方に延在する電極引出し部とを形
成したSAW共振素子を、ベースを貫通したリー
ド端子の内側端面に片持ちで固着するとともに電
気的に接続し、前記ベースに気密キヤツプを取付
けたことを特徴とする弾性表面波装置。 A SAW resonant element in which an electrode pattern and an electrode extension extending in at least one of the longitudinal directions are formed on a rectangular piezoelectric substrate is cantilevered and fixed to the inner end surface of a lead terminal that penetrates the base, and is electrically connected. A surface acoustic wave device characterized in that an airtight cap is attached to the base.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1042890U JPH03101040U (en) | 1990-02-05 | 1990-02-05 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1042890U JPH03101040U (en) | 1990-02-05 | 1990-02-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03101040U true JPH03101040U (en) | 1991-10-22 |
Family
ID=31513998
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1042890U Pending JPH03101040U (en) | 1990-02-05 | 1990-02-05 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03101040U (en) |
-
1990
- 1990-02-05 JP JP1042890U patent/JPH03101040U/ja active Pending
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