JPH03100687U - - Google Patents
Info
- Publication number
- JPH03100687U JPH03100687U JP951690U JP951690U JPH03100687U JP H03100687 U JPH03100687 U JP H03100687U JP 951690 U JP951690 U JP 951690U JP 951690 U JP951690 U JP 951690U JP H03100687 U JPH03100687 U JP H03100687U
- Authority
- JP
- Japan
- Prior art keywords
- tube
- cylinder
- coming
- rotating
- prevented
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Joints With Pressure Members (AREA)
- Joints That Cut Off Fluids, And Hose Joints (AREA)
- Quick-Acting Or Multi-Walled Pipe Joints (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP951690U JPH081354Y2 (ja) | 1990-01-31 | 1990-01-31 | 配管端末接続構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP951690U JPH081354Y2 (ja) | 1990-01-31 | 1990-01-31 | 配管端末接続構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03100687U true JPH03100687U (zh) | 1991-10-21 |
| JPH081354Y2 JPH081354Y2 (ja) | 1996-01-17 |
Family
ID=31513115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP951690U Expired - Lifetime JPH081354Y2 (ja) | 1990-01-31 | 1990-01-31 | 配管端末接続構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH081354Y2 (zh) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008258620A (ja) * | 2007-03-30 | 2008-10-23 | Seoul Semiconductor Co Ltd | 低い熱抵抗を有する発光ダイオードランプ |
| JP2009224752A (ja) * | 2008-03-14 | 2009-10-01 | Silitek Electronic (Guangzhou) Co Ltd | 半導体パッケージ構造と、これのためのリードフレーム及び伝導性組立品 |
| JP2010147422A (ja) * | 2008-12-22 | 2010-07-01 | Seiwa Electric Mfg Co Ltd | 半導体装置及び半導体装置の表面実装方法 |
-
1990
- 1990-01-31 JP JP951690U patent/JPH081354Y2/ja not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008258620A (ja) * | 2007-03-30 | 2008-10-23 | Seoul Semiconductor Co Ltd | 低い熱抵抗を有する発光ダイオードランプ |
| JP2009224752A (ja) * | 2008-03-14 | 2009-10-01 | Silitek Electronic (Guangzhou) Co Ltd | 半導体パッケージ構造と、これのためのリードフレーム及び伝導性組立品 |
| JP2010147422A (ja) * | 2008-12-22 | 2010-07-01 | Seiwa Electric Mfg Co Ltd | 半導体装置及び半導体装置の表面実装方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH081354Y2 (ja) | 1996-01-17 |