JPH03100687U - - Google Patents
Info
- Publication number
- JPH03100687U JPH03100687U JP951690U JP951690U JPH03100687U JP H03100687 U JPH03100687 U JP H03100687U JP 951690 U JP951690 U JP 951690U JP 951690 U JP951690 U JP 951690U JP H03100687 U JPH03100687 U JP H03100687U
- Authority
- JP
- Japan
- Prior art keywords
- tube
- cylinder
- coming
- rotating
- prevented
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Joints With Pressure Members (AREA)
- Joints That Cut Off Fluids, And Hose Joints (AREA)
- Quick-Acting Or Multi-Walled Pipe Joints (AREA)
Description
第１図は本考案実施例の分解斜視図、第２図は
蛇腹管非接続状態に於けるローラ７３部分の断面
図、第３図はローラ７３装着部の要部拡大断面図
、第４図は蛇腹管非接続状態の断面図、第５図、
第６図は蛇腹管接続状態の断面図、第７図は従来
例の説明図であり、図中、
２……蛇腹管、７……回動筒、２２……継手主
体、２５……筒部、４２……カム凸部。
Fig. 1 is an exploded perspective view of an embodiment of the present invention, Fig. 2 is a sectional view of the roller 73 portion in a state where the bellows pipe is not connected, Fig. 3 is an enlarged sectional view of the main part of the roller 73 attachment part, and Fig. 4 Figure 5 is a cross-sectional view of the bellows pipe in its unconnected state.
Fig. 6 is a cross-sectional view of the bellows pipe connected state, and Fig. 7 is an explanatory diagram of a conventional example. Part, 42...Cam convex part.
Claims (1)
管２を係合抜け止め状態にしてこれら両者を結合
するようにした配管端末接続構造に於いて、筒部
２５に抜け止め状態に内挿され且つ蛇腹管２の外
径より大きな内径を有する回動筒７と、該回動筒
７の側壁に貫設された開口部と、上記回動筒７の
側壁を内外に貫通し且つ前記開口部に収容保持さ
れた移動子と、筒部２５の内面に形成され且つ上
記回動筒７に保持された移動子の移動軌跡に臨む
領域の一部に位置するように配設されたカム突部
を設け、回動筒７を回動操作させたときには上記
移動子が前記カム凸部でその内側に押し出されて
これが蛇腹管２の外周凹凸部に係合するようにし
た配管端末接続構造。 In a piping terminal connection structure in which the cylindrical portion 25 of the joint main body 22 and the bellows pipe 2 inserted therein are engaged and prevented from coming off, and the two are connected, the tube portion 25 is inserted into the cylindrical portion 25 in a state where they are prevented from coming off. a rotating tube 7 having an inner diameter larger than the outer diameter of the bellows tube 2; an opening extending through the side wall of the rotating tube 7; a moving element housed and held in the rotary cylinder 7, and a cam protrusion formed on the inner surface of the cylinder part 25 and positioned in a part of the area facing the movement locus of the moving element held in the rotating cylinder 7. The piping end connection structure is provided with a section, and when the rotary tube 7 is rotated, the movable element is pushed inward by the cam convex part and engages with the uneven part of the outer circumference of the bellows pipe 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP951690U JPH081354Y2 (en) | 1990-01-31 | 1990-01-31 | Piping terminal connection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP951690U JPH081354Y2 (en) | 1990-01-31 | 1990-01-31 | Piping terminal connection structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03100687U true JPH03100687U (en) | 1991-10-21 |
| JPH081354Y2 JPH081354Y2 (en) | 1996-01-17 |
Family
ID=31513115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP951690U Expired - Lifetime JPH081354Y2 (en) | 1990-01-31 | 1990-01-31 | Piping terminal connection structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH081354Y2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008258620A (en) * | 2007-03-30 | 2008-10-23 | Seoul Semiconductor Co Ltd | Light emitting diode lamp with low thermal resistance |
| JP2009224752A (en) * | 2008-03-14 | 2009-10-01 | Silitek Electronic (Guangzhou) Co Ltd | Semiconductor package structure, lead frame and conductive assembly for the same |
| JP2010147422A (en) * | 2008-12-22 | 2010-07-01 | Seiwa Electric Mfg Co Ltd | Semiconductor device and surface mounting method of semiconductor device |
-
1990
- 1990-01-31 JP JP951690U patent/JPH081354Y2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008258620A (en) * | 2007-03-30 | 2008-10-23 | Seoul Semiconductor Co Ltd | Light emitting diode lamp with low thermal resistance |
| JP2009224752A (en) * | 2008-03-14 | 2009-10-01 | Silitek Electronic (Guangzhou) Co Ltd | Semiconductor package structure, lead frame and conductive assembly for the same |
| JP2010147422A (en) * | 2008-12-22 | 2010-07-01 | Seiwa Electric Mfg Co Ltd | Semiconductor device and surface mounting method of semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH081354Y2 (en) | 1996-01-17 |