JPH03100413U - - Google Patents
Info
- Publication number
- JPH03100413U JPH03100413U JP926890U JP926890U JPH03100413U JP H03100413 U JPH03100413 U JP H03100413U JP 926890 U JP926890 U JP 926890U JP 926890 U JP926890 U JP 926890U JP H03100413 U JPH03100413 U JP H03100413U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead frame
- tie bar
- component body
- molding device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP926890U JPH03100413U (nl) | 1990-01-31 | 1990-01-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP926890U JPH03100413U (nl) | 1990-01-31 | 1990-01-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03100413U true JPH03100413U (nl) | 1991-10-21 |
Family
ID=31512873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP926890U Pending JPH03100413U (nl) | 1990-01-31 | 1990-01-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03100413U (nl) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020009976A (ja) * | 2018-07-12 | 2020-01-16 | エイブリック株式会社 | 樹脂封止金型および半導体装置の製造方法 |
-
1990
- 1990-01-31 JP JP926890U patent/JPH03100413U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020009976A (ja) * | 2018-07-12 | 2020-01-16 | エイブリック株式会社 | 樹脂封止金型および半導体装置の製造方法 |