JPH0299798U - - Google Patents
Info
- Publication number
- JPH0299798U JPH0299798U JP716589U JP716589U JPH0299798U JP H0299798 U JPH0299798 U JP H0299798U JP 716589 U JP716589 U JP 716589U JP 716589 U JP716589 U JP 716589U JP H0299798 U JPH0299798 U JP H0299798U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring boards
- board
- pillars
- boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims 1
- 239000005022 packaging material Substances 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 claims 1
- 238000012856 packing Methods 0.000 claims 1
Landscapes
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
- Packaging Frangible Articles (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第1図、第2図は本考案実施例の斜視構造を示
す図、第3図は従来例の斜視構造を示す図である
。
1……上板、1a……穴、2……下板、3……
柱、4……FPC。
1 and 2 are views showing a perspective structure of an embodiment of the present invention, and FIG. 3 is a view showing a perspective structure of a conventional example. 1... Upper plate, 1a... Hole, 2... Lower plate, 3...
Pillar, 4...FPC.
Claims (1)
するための梱包材において、プリント配線基板の
形状に対応した位置に複数の穴を有する上板と、
プリント配線基板の形状に対応した位置に立つ複
数の柱を有する下板とを有し、上記下板上の複数
の柱の間に複数枚のプリント配線基板を重ね、上
記柱に上記上板の穴を嵌合し、上板をプリント配
線基板に当接するように押し込むことにより、上
下の板及び複数の柱の間に多数枚のプリント配線
基板が梱包された構造を形成するプリント配線基
板の梱包材。 In a packaging material for packaging a large number of printed wiring boards in a stacked state, an upper plate having a plurality of holes at positions corresponding to the shape of the printed wiring boards;
a lower plate having a plurality of pillars standing at positions corresponding to the shape of the printed wiring board; a plurality of printed wiring boards are stacked between the plurality of pillars on the lower board; Packing of printed wiring boards in which a structure is formed in which multiple printed wiring boards are packed between upper and lower boards and multiple pillars by fitting the holes and pushing the top board into contact with the printed wiring board. Material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989007165U JPH0637988Y2 (en) | 1989-01-25 | 1989-01-25 | Packaging material for printed wiring boards |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989007165U JPH0637988Y2 (en) | 1989-01-25 | 1989-01-25 | Packaging material for printed wiring boards |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0299798U true JPH0299798U (en) | 1990-08-08 |
JPH0637988Y2 JPH0637988Y2 (en) | 1994-10-05 |
Family
ID=31211953
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989007165U Expired - Lifetime JPH0637988Y2 (en) | 1989-01-25 | 1989-01-25 | Packaging material for printed wiring boards |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0637988Y2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020033052A (en) * | 2018-08-29 | 2020-03-05 | 凸版印刷株式会社 | Substrate storage cassette |
JP2020086561A (en) * | 2018-11-16 | 2020-06-04 | 株式会社新来島どっく | Shockproof protective case for wireless ic tag |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6382787U (en) * | 1986-11-14 | 1988-05-31 |
-
1989
- 1989-01-25 JP JP1989007165U patent/JPH0637988Y2/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6382787U (en) * | 1986-11-14 | 1988-05-31 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020033052A (en) * | 2018-08-29 | 2020-03-05 | 凸版印刷株式会社 | Substrate storage cassette |
JP2020086561A (en) * | 2018-11-16 | 2020-06-04 | 株式会社新来島どっく | Shockproof protective case for wireless ic tag |
Also Published As
Publication number | Publication date |
---|---|
JPH0637988Y2 (en) | 1994-10-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |