JPH0298805A - Manufacture of thin film magnetic head - Google Patents
Manufacture of thin film magnetic headInfo
- Publication number
- JPH0298805A JPH0298805A JP25244388A JP25244388A JPH0298805A JP H0298805 A JPH0298805 A JP H0298805A JP 25244388 A JP25244388 A JP 25244388A JP 25244388 A JP25244388 A JP 25244388A JP H0298805 A JPH0298805 A JP H0298805A
- Authority
- JP
- Japan
- Prior art keywords
- glass
- film magnetic
- thin film
- substrate
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 47
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000011521 glass Substances 0.000 claims abstract description 84
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 238000000034 method Methods 0.000 claims abstract description 17
- 230000001681 protective effect Effects 0.000 claims description 28
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 30
- 239000010408 film Substances 0.000 description 7
- 239000004020 conductor Substances 0.000 description 6
- 239000011229 interlayer Substances 0.000 description 6
- 238000004804 winding Methods 0.000 description 5
- 238000005299 abrasion Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910001004 magnetic alloy Inorganic materials 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- SUDBRAWXUGTELR-HPFNVAMJSA-N 5-[[(2r,3r,4s,5s,6r)-3,4,5-trihydroxy-6-(hydroxymethyl)oxan-2-yl]oxymethyl]-1h-pyrimidine-2,4-dione Chemical compound O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@H]1OCC1=CNC(=O)NC1=O SUDBRAWXUGTELR-HPFNVAMJSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3103—Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing
- G11B5/3106—Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing where the integrated or assembled structure comprises means for conditioning against physical detrimental influence, e.g. wear, contamination
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Magnetic Heads (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、薄膜磁気回路を形成した基板上にガラスによ
って保護板を接合する薄膜磁気ヘッドの製造方法に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a thin-film magnetic head, in which a protective plate is bonded with glass to a substrate on which a thin-film magnetic circuit is formed.
巻線型の薄膜磁気ヘッドの製造方法を第２図に基づいて
簡単に説明する。A method for manufacturing a wire-wound thin film magnetic head will be briefly described with reference to FIG.
基板１１上に、下部磁性層１２、層間絶縁層１３、巻線
導体１４及び上部磁性１ｉ１５が薄膜成膜技術及びフォ
トリソグラフィ等により所定のパターンで順次積層され
て薄膜磁気回路が形成される。また、このようにして形
成された薄膜磁気回路は、その上方に保護板１９を接合
することにより保護する必要がある。従って、この薄膜
磁気回路上をまず絶縁保護１！１６及びガラス下地層１
７で被い、このガラス下地層１７との間隙にガラス１８
を充填することにより保護板１９が接合されることにな
る。On the substrate 11, a lower magnetic layer 12, an interlayer insulating layer 13, a winding conductor 14, and an upper magnetic layer 1i15 are sequentially laminated in a predetermined pattern using thin film forming techniques, photolithography, etc., to form a thin film magnetic circuit. Further, the thin film magnetic circuit formed in this manner needs to be protected by bonding a protective plate 19 above it. Therefore, first coat the insulation protection layer 1!16 and the glass underlayer 1 on this thin film magnetic circuit.
7 and a glass 18 in the gap with this glass base layer 17.
The protective plate 19 is joined by filling the protective plate 19.
ここで、保護板１９の接合工程においては、この接合強
度を十分に得るために、ガラス１８のガラス転移点（又
はガラス軟化点）よりもさらに数百度高い温度（以下、
「作業温度」という）で作業を行うことが望ましい。し
かし、接合工程の温度があまり高温になると、薄膜磁気
ヘッドの磁気特性が劣化するおそれがある。そこで、従
来は、十分な接合強度を得るために接合工程の温度を作
業温度まで上昇させた場合にも、薄膜磁気ヘッドの耐熱
温度を超えることなく十分な磁気特性を保持し得るよう
に、ガラス転移点の低いガラス１８を用いて作業を行っ
ていた。Here, in the bonding process of the protection plate 19, in order to obtain sufficient bonding strength, the temperature (hereinafter referred to as
It is desirable to perform work at a temperature (referred to as "working temperature"). However, if the temperature of the bonding process becomes too high, the magnetic properties of the thin film magnetic head may deteriorate. Therefore, in the past, glass was used to maintain sufficient magnetic properties without exceeding the heat-resistant temperature of the thin-film magnetic head, even when the temperature of the bonding process was raised to the working temperature in order to obtain sufficient bonding strength. The work was carried out using glass 18 with a low transition point.
ところが、ガラス１８は、そのガラス転移点の温度が低
いほど硬度が低くなる傾向にある。このため、従来は、
作業温度を低下させるために硬度の低いガラス１８を用
いていたので、このガラス１８の耐摩耗性を犠牲にして
いたことになる。即ち、第２図に示すように、基板１１
や保護板１９に比べて硬度の低いガラス１８が薄膜磁気
ヘッドのヘッド摺動面已に露出するために、このガラス
１８の露出部分Ｆだけが先に摩耗して凹みとなる、いわ
ゆる偏摩耗を生じることになる。そして、このような偏
摩耗が生じると、薄膜磁気ヘッドの使用に伴いスペーシ
ング損失が増大し、またテープ走行が不安定になるため
に、記録再生特性が劣化することになる。However, the lower the glass transition temperature, the lower the hardness of the glass 18 tends to be. For this reason, conventionally,
Since the glass 18 with low hardness was used to lower the working temperature, the abrasion resistance of the glass 18 was sacrificed. That is, as shown in FIG.
Since the glass 18, which has a lower hardness than the protective plate 19, is exposed on the head sliding surface of the thin-film magnetic head, only the exposed portion F of the glass 18 wears out first, causing so-called uneven wear. will occur. When such uneven wear occurs, spacing loss increases with the use of thin film magnetic heads, and tape running becomes unstable, resulting in deterioration of recording and reproducing characteristics.
従って、従来の薄膜磁気ヘッドの製造方法では硬度の低
いガラス１８を使用しなければならないので、製造した
薄膜磁気ヘッドの耐久性や信頼性に欠けるという問題点
が生じていた。Therefore, in the conventional method for manufacturing a thin film magnetic head, glass 18 with low hardness must be used, resulting in a problem that the manufactured thin film magnetic head lacks durability and reliability.
なお、このような問題点は、第２図に示した巻線型の薄
膜磁気ヘッドに限らず、磁気抵抗効果型等の薄膜磁気ヘ
ッドの製造方法にも共通するものである。Incidentally, such problems are not limited to the wire-wound thin film magnetic head shown in FIG. 2, but are common to methods of manufacturing thin film magnetic heads such as magnetoresistive type.
本発明は、上記課題を解決するために、薄膜磁気回路を
形成した基板上にガラスによって保護板を接合する薄膜
磁気ヘット′の製造方法において、基板と保護板との間
におけるヘッド摺動面付近に他の部分よりも硬度の高い
ガラスを配置し、このヘッド摺動面付近のガラスの作業
温度よりも低く、かつ他の部分のガラスの作業温度より
も高い温度で保護板の接合を行うごとを特徴としている
。In order to solve the above-mentioned problems, the present invention provides a method for manufacturing a thin-film magnetic head in which a protective plate is bonded with glass to a substrate on which a thin-film magnetic circuit is formed, in the vicinity of the head sliding surface between the substrate and the protective plate. A piece of glass that is harder than other parts is placed on the head, and the protective plate is bonded at a temperature that is lower than the working temperature of the glass near the head sliding surface and higher than the working temperature of the glass in other parts. It is characterized by
［作 用〕
薄ｍ磁気回路を形成した基板上と保護板との間でガラス
を軟化（又は熔融）させることにより接合が行われる。[Function] Bonding is performed by softening (or melting) the glass between the substrate on which the thin magnetic circuit is formed and the protective plate.
この際、本発明では、基板と保護板との間におけるヘッ
ド摺動面付近に硬度の高いガラスを配置し、他の部分に
それよりも硬度の低いガラスを配置する。このヘッド摺
動面付近のガラスは、後の工程で薄膜磁気ヘッドのヘッ
ド摺動面に露出した際に、十分な耐摩耗性を得るような
硬度のものを用いる。他の部分のガラスは、これよりも
硬度が低いので、十分な結合強度を得るための作業温度
も低くなる。そして、この他の部分のガラスは、その作
業温度が薄膜磁気ヘッドの磁気特性を劣化させることの
ないような低い温度のものを用いる。At this time, in the present invention, glass with high hardness is arranged near the head sliding surface between the substrate and the protection plate, and glass with lower hardness is arranged in other parts. The glass near the head sliding surface is hard enough to provide sufficient abrasion resistance when exposed to the head sliding surface of the thin-film magnetic head in a later step. Since the glass in other parts has a lower hardness, the working temperature to obtain sufficient bond strength is also lower. The glass used in the other parts has a low operating temperature so as not to deteriorate the magnetic properties of the thin film magnetic head.
また、保護板の接合の際の温度は、ヘッド摺動面付近の
ガラスの作業温度よりも低く、かつ他の部分のガラスの
作業温度よりも高くする。従って、この接合の際の温度
は、薄膜磁気ヘッドの磁気特性を劣化させないような温
度とすることができる。Further, the temperature at which the protective plate is bonded is lower than the working temperature of the glass near the head sliding surface and higher than the working temperature of the glass in other parts. Therefore, the temperature during this bonding can be set to a temperature that does not deteriorate the magnetic properties of the thin film magnetic head.
この結果、ヘッド摺動面付近以外の部分については、そ
の部分のガラスの作業温度以上の温度で保護板の接合が
行われるので、十分な接合強度を得ることができる。そ
して、このヘッド摺動面付近以外の部分は、基板上で広
い面積を持ち得るので、薄膜磁気ヘッド全体における保
護板の接合強度としても十分なものとなる。As a result, the protection plate is bonded to the portion other than the vicinity of the head sliding surface at a temperature higher than the working temperature of the glass in that portion, so that sufficient bonding strength can be obtained. Since the portion other than the vicinity of the head sliding surface can have a large area on the substrate, the bonding strength of the protective plate for the entire thin-film magnetic head is sufficient.
また、ヘッド摺動面付近については、その部分のガラス
の作業温度に達しないために、保護板の接合強度として
は十分でないおそれがあるが、ガラスの硬度については
十分なものを得ることができる。このため、後の工程に
よってヘッド摺動面が研磨されその部分のガラスが露出
した場合に、基板や保護板に比べても十分な耐摩耗性を
発揮させることができる。In addition, in the vicinity of the head sliding surface, the working temperature of the glass in that area may not reach the working temperature, so there is a risk that the bonding strength of the protective plate will not be sufficient, but the hardness of the glass will be sufficient. . Therefore, when the head sliding surface is polished in a later process and the glass in that area is exposed, sufficient wear resistance can be exhibited compared to the substrate or the protective plate.
このように、本発明の薄膜磁気ヘッドの製造方法は、ヘ
ッド摺動面付近のガラスとして硬度の向上を図るために
最適なものを選択し、その他の部分のガラスとして作業
温度の低減化を図るために最適なものを選択することが
できるので、優れた耐摩耗性と強い接合強度とを共に供
えた薄膜磁気ヘッドを製造することが可能となる。As described above, in the method for manufacturing a thin film magnetic head of the present invention, the glass in the vicinity of the head sliding surface is selected to be optimal in order to improve hardness, and the glass in other parts is designed to reduce the working temperature. Therefore, it is possible to manufacture a thin film magnetic head that has both excellent wear resistance and strong bonding strength.
本発明の一実施例を第１図に基づいて説明すれば、以下
の通りである。An embodiment of the present invention will be described below based on FIG.
本実施例は、巻線型の薄膜磁気ヘッドの製造方法につい
て示す。This embodiment describes a method for manufacturing a wire-wound thin film magnetic head.
第１図（ａ）に示すように、基板１上には、まず下部磁
性層２が形成される。基板ｌは、フェライト等の磁性基
板又は非磁性体の基板からなる。As shown in FIG. 1(a), a lower magnetic layer 2 is first formed on a substrate 1. As shown in FIG. The substrate l is made of a magnetic substrate such as ferrite or a nonmagnetic substrate.
また、下部磁性層２は、Ｆｅ−Ａｌ−３ｔ又はＦｅ−Ｎ
ｉ等の磁性合金からなり、スパッタリング、蒸着又は電
着等によって成膜される。Further, the lower magnetic layer 2 is made of Fe-Al-3t or Fe-N
It is made of a magnetic alloy such as I, and is formed into a film by sputtering, vapor deposition, electrodeposition, or the like.
次に、この下部磁性層２上に層間絶縁層３の下層部を成
膜した後、巻線導体４をパターン形成する。層間絶縁Ｎ
３は、ＳｉＯ□又はＡ１．Ｏｈ等からなる絶縁膜である
。また、巻線導体４は、Ａｇ、Ａｕ、ＡＩ又はＣｕ等の
金属をスパッタリング又は蒸着等によって成膜し、巻線
状の所定パターンに加工したものである。Next, after forming the lower part of the interlayer insulating layer 3 on the lower magnetic layer 2, the winding conductor 4 is patterned. Interlayer insulation N
3 is SiO□ or A1. This is an insulating film made of Oh or the like. The wire-wound conductor 4 is formed by forming a film of a metal such as Ag, Au, AI, or Cu by sputtering or vapor deposition, and processing the film into a predetermined wire-like pattern.
巻線導体４が形成されると、その上面を層間絶縁層３の
上層部で被った後に、フロントギャップ部Ｂとバックギ
ャップ部Ｃの層間絶縁層３をテーバエツチングする。フ
ロントギャップ部Ｂは、薄膜磁気ヘッドにおける磁気ギ
ャップを構成する部分であり、後の研磨工程によって側
面にヘッド摺動面Ａが形成されることになる。従って、
このフロントギャップ部Ｂでは、テーバエツチングによ
り一旦下部磁性Ｎ２が露出すると、再び上面を薄い層間
絶縁層３で被い、次工程で形成される上部磁性層５との
間に所定のギャップ長が得られるようにしている。バッ
クギャップ部Ｃは、巻線導体４０巻線状の中心部に位置
する部分であり、下部磁性Ｎ２が露出するまでテーバエ
ツチングされる。After the winding conductor 4 is formed, its upper surface is covered with the upper layer of the interlayer insulating layer 3, and then the interlayer insulating layer 3 in the front gap portion B and the back gap portion C is subjected to Taber etching. The front gap portion B is a portion constituting a magnetic gap in the thin film magnetic head, and a head sliding surface A will be formed on the side surface in a later polishing process. Therefore,
In this front gap part B, once the lower magnetic N2 is exposed by Taber etching, the upper surface is covered again with a thin interlayer insulating layer 3, and a predetermined gap length is obtained between it and the upper magnetic layer 5 to be formed in the next step. I'm trying to be able to do that. The back gap portion C is a portion located at the center of the winding conductor 40, and is subjected to Taber etching until the lower magnetic N2 is exposed.
テーバエツチングが完了しフロントギャップ部Ｂが薄い
眉間絶縁層３で被われると、その上に上部磁性層５をパ
ターン形成する。上部磁性１１５は、下部磁性Ｎ２と同
様の磁性合金からなり、スパッタリング等によって成膜
された後に、所定のパターンに形成される。そして、バ
ックギャップ部Ｃと薄い眉間絶縁層３を介したフロント
ギャップ部Ｂとで下部磁性層２に磁気的に接続されて、
巻線導体４と鎖交する薄膜磁気回路が構成されることに
なる。After the Taber etching is completed and the front gap B is covered with the thin glabellar insulating layer 3, the upper magnetic layer 5 is patterned thereon. The upper magnetic layer 115 is made of the same magnetic alloy as the lower magnetic layer N2, and is formed into a predetermined pattern after being deposited by sputtering or the like. Then, it is magnetically connected to the lower magnetic layer 2 through the back gap portion C and the front gap portion B via the thin glabella insulating layer 3.
A thin film magnetic circuit interlinking with the winding conductor 4 is constructed.
このようにして薄膜磁気回路が形成された基板１上を、
まず絶縁保護層６で被い、さらにガラス下地層７で被う
ことによって、第１図（ａ）に示す状態となる。絶縁層
３１層６は、ＳｉＯ□等からなる絶縁膜であり、スパッ
タリングやＣＶＤ［ｃｈｅｍｉｃａｌ ｖａｐｏｕｒ
ｄｅｐｏｓｉｔｉｏｎｌ等によって形成される。ガラス
下地Ｊ！７は、Ｃｒ又はＴｉ等の金属膜であり、次工程
で接合に用いるガラス８ａ・８ｂと絶縁層３１層６との
間の化学反応によって発泡が生じるのを防止するために
形成されるものである。On the substrate 1 on which the thin film magnetic circuit was formed in this way,
First, it is covered with an insulating protective layer 6, and then covered with a glass base layer 7, resulting in the state shown in FIG. 1(a). The insulating layer 31 layer 6 is an insulating film made of SiO□, etc., and is processed by sputtering or CVD [chemical vapor
It is formed by deposition, etc. Glass base J! 7 is a metal film such as Cr or Ti, which is formed to prevent foaming from occurring due to a chemical reaction between the glasses 8a and 8b used for bonding in the next step and the insulating layer 31 layer 6. be.
基板１上に絶縁保護層６及びガラス下地層７が形成され
ると、ガラス８ａ・８ｂによる保護板９の接合を行う。After the insulating protective layer 6 and the glass base layer 7 are formed on the substrate 1, the protective plate 9 is bonded to the glasses 8a and 8b.
この保護板９は、基板１上に形成された薄膜磁気回路を
保護するためのものである。この接合のためには、まず
基板１のガラス下地層７上又は保護板９上にガラスフリ
ット、ガラス下地層又は仮ガラスの状態となったガラス
８ａ・８ｂを付着させる。この際、フロントギャップ部
Ｂ上（ヘッド摺動面Ａ付近）には、硬度の高いガラス８
ａを配置し、バックギャップ部Ｃを含むそれ以外の部分
には、硬度の低いガラス８ｂを配置する。硬度の高いガ
ラス８ａは、後の工程でヘッド摺動面Ａに露出した際に
、十分な耐摩耗性を発揮できるような硬度のガラスを用
いる。また、硬度の低いガラス８ｂは、その作業温度が
薄膜磁気回路の磁気特性を劣化させるようなことのない
十分に低い温度のガラスを用いる。そして、これらのガ
ラスとしては、低融点ガラスが適当である。This protective plate 9 is for protecting the thin film magnetic circuit formed on the substrate 1. For this bonding, first, glasses 8a and 8b in the state of glass frit, glass base layer, or temporary glass are attached onto the glass base layer 7 of the substrate 1 or the protective plate 9. At this time, a glass 8 with high hardness is placed on the front gap B (near the head sliding surface A).
glass 8b with low hardness is placed in the other portions including the back gap portion C. The glass 8a having high hardness is a glass having a hardness that can exhibit sufficient abrasion resistance when exposed to the head sliding surface A in a later step. Further, as the glass 8b having low hardness, a glass having a sufficiently low working temperature that does not deteriorate the magnetic properties of the thin film magnetic circuit is used. As these glasses, low melting point glasses are suitable.
そして、保護板９をガラス８ａ・８ｂを介して基板ｌ上
に加圧しながら、ガラス８ａの作業温度よりも低く、か
つガラス８ｂの作業温度よりも高い温度まで加熱する。Then, while pressing the protective plate 9 onto the substrate l via the glasses 8a and 8b, it is heated to a temperature lower than the working temperature of the glass 8a and higher than the working temperature of the glass 8b.
また、この加熱温度は、薄膜磁気回路の磁気特性を劣化
させない程度の温度とする。すると、ガラス８ａ・８ｂ
が軟化又は熔融し、基板１上に保護板９が接合されるこ
とになる。ここで、硬度の低いガラス８ｂについては、
作業温度以上の温度によって接合を行うので、十分な接
合強度を得ることができる。Further, this heating temperature is set to a temperature that does not deteriorate the magnetic properties of the thin film magnetic circuit. Then, the glasses 8a and 8b
is softened or melted, and the protective plate 9 is bonded onto the substrate 1. Here, regarding the glass 8b with low hardness,
Since the bonding is performed at a temperature higher than the working temperature, sufficient bonding strength can be obtained.
保護板９が接合されると、第１図（ｂ）に示すように、
ガラス８ａ・８ｂは、境界線りを境としてフロントギャ
ップ部Ｂ側に硬度の高いガラス８ａが充填され、パック
ギャップ部Ｃを含むそれ以外の部分に硬度の低いガラス
８ｂが充填されることになる。そして、フロントギャッ
プ部Ｂにおける図示１点鎖線に示す位置まで側面を研磨
してヘッド摺動面Ａを形成すると、第１図（ｃ）に示す
ような薄膜磁気ヘッドが完成する。When the protection plate 9 is joined, as shown in FIG. 1(b),
Regarding the glasses 8a and 8b, the glass 8a with high hardness is filled on the front gap part B side with the boundary line as a boundary, and the glass 8b with low hardness is filled in the other parts including the pack gap part C. . Then, by polishing the side surface of the front gap portion B to the position shown by the dashed line in the figure to form the head sliding surface A, a thin film magnetic head as shown in FIG. 1(c) is completed.
この薄膜磁気ヘッドは、基板１上の大部分に充填された
硬度の低いガラス８ｂによって保護板９が強固に接合さ
れる。また、ヘッド摺動面Ａには、硬度の高いガラス８
ａが露出するので、優れた耐摩耗性を発揮することがで
きる。In this thin film magnetic head, a protective plate 9 is firmly bonded to a glass 8b having a low hardness, which is filled in most of the substrate 1. In addition, the head sliding surface A is made of glass 8 with high hardness.
Since a is exposed, excellent wear resistance can be exhibited.
なお、上記境界線りは、ヘッド摺動面Ａにガラス８ａが
露出し、かつガラス８ｂが基板１上の大部分に充填され
るならば、必ずしも図示の位置に限らず、しかも、明確
な境界線が現れる必要もない。Note that the above boundary line is not necessarily limited to the illustrated position, but may be a clear boundary if the glass 8a is exposed on the head sliding surface A and the glass 8b is filled in most of the substrate 1. There is no need for lines to appear.
また、ガラス８ａ・８ｂを基板１又は保護板９に付着さ
せるには、スクリーン印刷法によりそれぞれのガラスフ
リットを所定の位置に塗布することもできる。Further, in order to attach the glasses 8a and 8b to the substrate 1 or the protection plate 9, the respective glass frits can be applied to predetermined positions by screen printing.
さらに、このガラス８ａ・８ｂによる接合の際には、保
護板９を加熱加圧する他に、治具を用いてこの保護板９
を基板１上に固定した状態で加熱するようにしてもよい
。Furthermore, when bonding the glasses 8a and 8b, in addition to heating and pressurizing the protective plate 9, a jig is used to bond the protective plate 9.
It is also possible to heat the substrate 1 while it is fixed on the substrate 1.
本実施例では、巻線型の薄膜磁気ヘッドの製造方法につ
いて説明したが、磁気抵抗効果型の薄膜磁気ヘッドの製
造方法に同様に適用できることは明らかである。In this embodiment, a method for manufacturing a wire-wound thin film magnetic head has been described, but it is clear that the method can be similarly applied to a method for manufacturing a magnetoresistive thin film magnetic head.
（発明の効果）
本発明に係る薄膜磁気ヘッドの製造方法は、以上のよう
に、薄膜磁気回路を形成した基板上にガラスによって保
護板を接合する薄膜磁気ヘッドの製造方法において、基
板と保護板との間におけるヘッド摺動面付近に他の部分
よりも硬度の高いガラスを配置し、このヘッド摺動面付
近のガラスの作業温度よりも低く、かつ他の部分のガラ
スの作業温度よりも高い温度で保護板の接合を行う構成
をなしている。(Effects of the Invention) As described above, the method for manufacturing a thin film magnetic head according to the present invention includes a method for manufacturing a thin film magnetic head in which a protective plate is bonded with glass to a substrate on which a thin film magnetic circuit is formed. A piece of glass that is harder than other parts is placed near the head sliding surface between the head and the working temperature of the glass is lower than the working temperature of the glass near the head sliding surface and higher than the working temperature of the glass of other parts. The structure is such that the protection plates are bonded using temperature.
これにより、ヘッド摺動面に露出したガラスの耐摩耗性
が優れ、かつ保護板の接合強度が強い薄１！［気ヘッド
を製造することができる。As a result, the glass exposed on the head sliding surface has excellent abrasion resistance, and the protective plate has a strong bonding strength. [It is possible to manufacture air heads.
従って、本発明は、耐久性や信転性の高い薄膜磁気ヘッ
ドを製造することができるという効果を奏する。Therefore, the present invention has the effect that a thin film magnetic head with high durability and reliability can be manufactured.
第１図は本発明の一実施例を示すものであって、同図（
ａ）はｙｉ膜磁気回路を形成した基板の要部縦断面図、
同図（ｂ）は基板上に保護板を接合した際の要部縦断面
図、同図（Ｃ）はへラド摺動面を研磨後の薄膜磁気ヘッ
ドの要部縦断面図である。第２図は従来例を説明するた
めのものであって、薄膜磁気ヘッドの要部縦断面図であ
る。
１は基板、２は下部磁性層（薄膜磁気回路）、５は上部
磁性Ｎ（薄膜磁気回路）、８ａは硬度の高いガラス、８
ｂは硬度の低いガラス、９は保護板である。
特許出願人 シャープ 株式会社第２図
第
】
図（ａ）
第
図（Ｃ）
第
図（ｂ）FIG. 1 shows an embodiment of the present invention.
a) is a vertical cross-sectional view of the main part of the substrate on which the yi film magnetic circuit is formed;
FIG. 5B is a vertical cross-sectional view of the main part when the protective plate is bonded to the substrate, and FIG. FIG. 2 is a longitudinal sectional view of a main part of a thin film magnetic head for explaining a conventional example. 1 is a substrate, 2 is a lower magnetic layer (thin film magnetic circuit), 5 is an upper magnetic layer (thin film magnetic circuit), 8a is a glass with high hardness, 8
b is glass with low hardness, and 9 is a protective plate. Patent applicant Sharp Co., Ltd. Figure 2] Figure (a) Figure (C) Figure (b)
Claims (1)
護板を接合する薄膜磁気ヘッドの製造方法において、基
板と保護板との間におけるヘッド摺動面付近に他の部分
よりも硬度の高いガラスを配置し、このヘッド摺動面付
近のガラスの作業温度よりも低く、かつ他の部分のガラ
スの作業温度よりも高い温度で保護板の接合を行うこと
を特徴とする薄膜磁気ヘッドの製造方法。1. In a method of manufacturing a thin-film magnetic head in which a protective plate is bonded with glass to a substrate on which a thin-film magnetic circuit is formed, glass having a higher hardness than other parts is placed near the head sliding surface between the substrate and the protective plate. A method for manufacturing a thin-film magnetic head, characterized in that the protective plate is bonded at a temperature lower than the working temperature of the glass near the head sliding surface and higher than the working temperature of the glass in other parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25244388A JPH0298805A (en) | 1988-10-05 | 1988-10-05 | Manufacture of thin film magnetic head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25244388A JPH0298805A (en) | 1988-10-05 | 1988-10-05 | Manufacture of thin film magnetic head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0298805A true JPH0298805A (en) | 1990-04-11 |
Family
ID=17237449
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25244388A Pending JPH0298805A (en) | 1988-10-05 | 1988-10-05 | Manufacture of thin film magnetic head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0298805A (en) |
-
1988
- 1988-10-05 JP JP25244388A patent/JPH0298805A/en active Pending
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