JPH025216A - Manufacture of thin film magnetic head - Google Patents
Manufacture of thin film magnetic headInfo
- Publication number
- JPH025216A JPH025216A JP15726488A JP15726488A JPH025216A JP H025216 A JPH025216 A JP H025216A JP 15726488 A JP15726488 A JP 15726488A JP 15726488 A JP15726488 A JP 15726488A JP H025216 A JPH025216 A JP H025216A
- Authority
- JP
- Japan
- Prior art keywords
- sliding surface
- head
- bonding agent
- thin film
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010409 thin film Substances 0.000 title claims description 24
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000007767 bonding agent Substances 0.000 claims abstract description 22
- 230000001681 protective effect Effects 0.000 claims description 11
- 239000011241 protective layer Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 9
- 238000005498 polishing Methods 0.000 claims description 2
- 230000008961 swelling Effects 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052593 corundum Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 1
- 239000011521 glass Substances 0.000 description 29
- 238000002844 melting Methods 0.000 description 15
- 239000010410 layer Substances 0.000 description 14
- 239000010408 film Substances 0.000 description 8
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910000859 α-Fe Inorganic materials 0.000 description 3
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3103—Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3109—Details
- G11B5/3116—Shaping of layers, poles or gaps for improving the form of the electrical signal transduced, e.g. for shielding, contour effect, equalizing, side flux fringing, cross talk reduction between heads or between heads and information tracks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Magnetic Heads (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、薄膜磁気ヘッドの製造方法に係り、詳しくは
、薄膜磁気ヘッドにおける媒体摺動面の耐摩耗性を向上
させるための薄膜磁気ヘッドの製造方法に関するもので
ある。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing a thin film magnetic head, and more particularly, to a thin film magnetic head for improving the wear resistance of a sliding surface of a medium in the thin film magnetic head. The present invention relates to a manufacturing method.
薄膜積層技術、或いは、フォトリソグラフィーなどによ
り形成される薄膜磁気ヘッドにあっては、第４図に示す
ように、基板（フェライトなどの磁性基板、若しくは、
非磁性基板）１上に形成された磁気回路２を保護する目
的で保護板３を低融点ガラスなどの接合剤４にて接合し
ている。In a thin film magnetic head formed by thin film lamination technology or photolithography, a substrate (a magnetic substrate such as ferrite, or
In order to protect the magnetic circuit 2 formed on the non-magnetic substrate 1, a protective plate 3 is bonded with a bonding agent 4 such as low melting point glass.
ところで、上記のように保護板３の接合に低融点ガラス
を用いると、同じく接合に樹脂を用いた場合に比べ、耐
環境性（耐湿性・耐薬品性等）や耐摩耗性の点で著しい
向上が見られるのであるが、かかる低融点ガラスは、一
般に基板或いは保護板として用いられるフェライトや結
晶化ガラスに比べると軟らかいため、磁気記録媒体摺動
時に、磁気記録媒体との接触部分、すなわち媒体摺動面
に偏摩耗が起こり、凹部Ｅが生じがちとなる。このよう
に凹部Ｅが生じると、ヘッドの目詰まり、更にはヘッド
・磁気記録媒体間の空隙によるスペーシング損失を誘発
し、その結果、ヘッドの出力が低下するという問題を招
来する。By the way, when low-melting glass is used to bond the protective plate 3 as described above, it has remarkable environmental resistance (humidity resistance, chemical resistance, etc.) and abrasion resistance compared to when resin is used for bonding. However, since such low-melting point glass is softer than ferrite or crystallized glass that is generally used as a substrate or protective plate, when the magnetic recording medium slides, the part that comes in contact with the magnetic recording medium, that is, the medium Uneven wear occurs on the sliding surface, and recesses E tend to occur. When such a recess E is generated, the head is clogged, and furthermore, a spacing loss due to the gap between the head and the magnetic recording medium is induced, resulting in a problem that the output of the head is reduced.
そこで、上記の接合に用いるガラスの硬度を高めること
が考えられる。Therefore, it is possible to increase the hardness of the glass used for the above bonding.
ところが、低融点ガラスの硬度は、その温度特性と密接
な関係を有しており、ガラス硬度を高めるためには、高
い作業温度のガラスを選ばなければならない。一方、薄
膜磁気ヘッドにおいては、その磁気的・電気的特性の確
保、および外観上の不良（クランク・剥離など）の防止
を考慮すると、その耐熱温度としては６００℃前後が限
界であるから、上記の接合に用いるガラスは、６００℃
以下の作業温度を有するガラスに限定されることになる
。従って、この６００℃以下の作業点を有する上記低融
点ガラスの硬度を上げるには自ずと限界があり、上記の
凹部Ｅの形成を阻止し得ないというのが実情であった。However, the hardness of low-melting point glass is closely related to its temperature characteristics, and in order to increase the glass hardness, it is necessary to select a glass with a high working temperature. On the other hand, in order to ensure the magnetic and electrical properties of thin-film magnetic heads and to prevent visual defects (cranking, peeling, etc.), the heat resistance temperature limit for thin-film magnetic heads is approximately 600°C. The glass used for bonding is heated to 600℃.
It will be limited to glasses with the following working temperatures: Therefore, the reality is that there is a limit to increasing the hardness of the low-melting glass having a working point of 600° C. or less, and the formation of the recess E cannot be prevented.
本発明に係る薄膜磁気ヘッドの製造方法は、上記の課題
を解決するために、磁気回路におけるヘッドギャップ部
側の盛り上がりを反映して形成される絶縁保護層におけ
る段差部の前方部分を、上記段差部上端の高さよりも高
くなるように形成する工程と、この工程の後に保護板を
接合剤にて接合する工程と、この工程の後に前記段差部
の前方部分の所定位置まで摺動面研磨を施す工程とを有
することを特徴としている。In order to solve the above-mentioned problems, the method for manufacturing a thin-film magnetic head according to the present invention improves the front part of the stepped portion of the insulating protective layer that is formed to reflect the swell on the head gap side in the magnetic circuit. After this step, a protective plate is bonded with a bonding agent. After this step, the sliding surface is polished to a predetermined position in the front part of the stepped portion. The invention is characterized in that it has a step of applying.
（作 用〕
上記の構成によれば、絶縁保護層における段差部の前方
部分は、上記段差部上端の高さよりも高くなるように形
成され、且つ、上記前方部分の所定位置まで摺動面研２
が施されるから、媒体摺動面には接合剤ではなく、上記
の絶縁保護層が露出することになる。そして、上記の絶
縁保護層として硬度の高いものを選べるから、媒体摺動
面において凹部の発生を回避することができ、この凹部
に起因するヘッドの目詰まり、更にはヘッド・磁気記録
媒体間のスペーシング損失を防止してヘッド出力の低下
防止を図ることができる。(Function) According to the above structure, the front portion of the step portion in the insulating protective layer is formed to be higher than the upper end of the step portion, and the sliding surface is polished to a predetermined position of the front portion. 2
is applied, so that the above-mentioned insulating protective layer, rather than the bonding agent, is exposed on the sliding surface of the medium. Furthermore, since a material with high hardness can be selected as the above-mentioned insulating protective layer, it is possible to avoid the formation of recesses on the sliding surface of the medium. By preventing spacing loss, it is possible to prevent head output from decreasing.
また、上記の接合剤は露出しないから、この接合剤の硬
度を考慮する必要がなくなる。従って、この接合剤とし
て樹脂を使用することが可能になるとともに、接合剤と
して低融点ガラスを使用する場合には、低融点ガラスの
作業温度を低く設定できるから、薄膜磁気ヘッドの磁気
的・電気的特性の確保、および外観上の不良（クラック
・剥離など）防止を図ることができ、且つ、この低融点
ガラスの奏する利点、例えば、樹脂に比べて耐環境性（
耐湿性・耐薬品性等）の点で優れているという利点をそ
のまま享受できることになる。Furthermore, since the above bonding agent is not exposed, there is no need to consider the hardness of this bonding agent. Therefore, it becomes possible to use resin as the bonding agent, and when low-melting point glass is used as the bonding agent, the working temperature of the low-melting point glass can be set low, so the magnetic and electrical properties of the thin-film magnetic head This low-melting point glass has the advantage of ensuring good physical properties and preventing external defects (cracks, peeling, etc.), such as environmental resistance (
This means that you can still enjoy the benefits of being excellent in terms of moisture resistance, chemical resistance, etc.
本発明の一実施例を第１図ないし第３図に基づいて説明
すれば、以下の通りである。An embodiment of the present invention will be described below with reference to FIGS. 1 to 3.
本発明に係る薄膜磁気へラドの製造方法により製造され
る例えば巻線型の薄膜磁気へラド１１は、第１図（ｄ）
に示すように、磁性基板１２、下部磁性層１３、層間絶
縁［１４、電ｆｆｆ誘導により図示しない磁気記録媒体
の（３号磁界を検出する巻線導体１５、前記の下部磁性
層１３とで磁気回路２１を構成する上部磁性層１６、絶
縁保護層１７、ガラス下地層１８、接合剤１９、および
保護板２０などにより構成されている。For example, a wire-wound thin film magnetic heald 11 manufactured by the method for manufacturing a thin film magnetic held according to the present invention is shown in FIG. 1(d).
As shown in FIG. The circuit 21 is composed of an upper magnetic layer 16, an insulating protective layer 17, a glass base layer 18, a bonding agent 19, a protective plate 20, and the like.
上記の薄膜磁気へラド１１を製造するには、同図（ａ）
に示すように、フェライトなどの磁性基板１２上にＦｅ
−Ａｌ−３ｉ或いはＦｅ−Ｎｉなとの磁性金属からなる
下部磁性層１３をスパッタ法、蒸着法、若しくは電着法
などにより形成する。次いで、ＳｉＯ□やＡ ｌ ｚ
Ｏｉなどからなる層間絶縁層１４を何層かに分けて形成
する間に、Ａｇ ％ Ａ ｕ ｓ Ａ １、Ｃｕなどの
金属をスパッタ法或いは蒸着法により被着し、これを所
定のパターンに加工して巻ｖＡ遵体１５を得る。そして
、この巻線導体１５の起伏に起因する層間絶縁層１４の
上面の凹凸を平ｌｕ化するとともに、フロントギャップ
部Ａおよびバックギャップ部Ｂのためのテーバエツチン
グを行った後、上部磁性層１６としてＦｅ−Ａｊ７−３
ｔ或いはＦｅ−Ｎｉなどの磁性金属を積層し、これを所
定のパターンに加工して磁気回路２１を得る。In order to manufacture the above thin film magnetic helad 11, as shown in FIG.
As shown in FIG.
- The lower magnetic layer 13 made of a magnetic metal such as Al-3i or Fe-Ni is formed by sputtering, vapor deposition, electrodeposition, or the like. Next, SiO□ and Alz
While forming the interlayer insulating layer 14 made of Oi etc. in several layers, a metal such as Ag% Aus A1, Cu is deposited by sputtering or vapor deposition, and this is processed into a predetermined pattern. and obtain Volume vA Juntai 15. Then, after flattening the unevenness on the upper surface of the interlayer insulating layer 14 caused by the undulations of the winding conductor 15 and performing Taber etching for the front gap part A and the back gap part B, the upper magnetic layer 16 As Fe-Aj7-3
A magnetic circuit 21 is obtained by laminating magnetic metals such as T or Fe-Ni and processing them into a predetermined pattern.
次に、同図（ｂ）に示すように、上部磁性層１６上に、
スパッタ法若しくはＣＶＤ （Ｃｈｅｍｔｃａｌ Ｖ
ａｐｏｒ Ｄｅｐｏｓｉｔｉｏｎ）法などによりＳ
ｉ Ｏ，やＡ７！ｚｏ３などの耐摩耗性に優れた無機材
料を成膜することにより絶縁保護層１７を得る。なお、
このとき、前記の磁気回路２１におけるヘッドギャップ
部Ａ側の盛り上がりを反映して形成された上記絶縁保護
層１７における段差部Ｃの前方部分Ｄ（幅Ｘは１０μｍ
〜５００μｍ程度）を、上記段差部Ｃ上端の高さよりも
高くなるように形成する。Next, as shown in FIG. 2(b), on the upper magnetic layer 16,
Sputtering method or CVD (Chemtcal V
S by the apor deposition method etc.
i O, Ya A7! The insulating protective layer 17 is obtained by depositing an inorganic material with excellent wear resistance such as ZO3. In addition,
At this time, a front portion D (width X is 10 μm
~500 μm) is formed to be higher than the height of the upper end of the stepped portion C.
前方部分りを、上記段差部Ｃ上端の高さよりも高くなる
ように形成するには、第２図に示すように、スリン）２
２ａ・・・を上記の前方部分りに対応する箇所に有する
メタルマスク２２を用いて選択的に上記の前方部分りが
高くなるように成膜する。この成膜時の絶縁保護層１７
における前方部分りの膜厚は、例えば、１０〜３０μｍ
に設定され、またその成膜方法としては、スパッタ法や
ＰＣＶＤ法などが用いられる。In order to form the front part so that it is higher than the upper end of the stepped part C, as shown in FIG.
Using a metal mask 22 having 2a . Insulating protective layer 17 during this film formation
The thickness of the front part of the film is, for example, 10 to 30 μm.
The film is formed using a sputtering method, a PCVD method, or the like.
次いで、第１図（ｃ）に示すように、絶縁保護層１７上
に、接合剤１９の下地層となるＣｒ膜のガラス下地Ｎ１
８を０．１〜１．０μｍの膜厚で積層する。その後、こ
のガラス下地層１８上に接合剤１９となるガラスロラド
、ガラス平反若しくはフリットなどの低融点ガラス材料
を介在させてフェライト若しくは結晶化ガラスからなる
保護板２０を載置した後、加熱および加圧処理を施して
この保護板２０を接合する。Next, as shown in FIG. 1(c), a glass base N1 of a Cr film, which is a base layer of the bonding agent 19, is placed on the insulating protective layer 17.
8 is laminated with a film thickness of 0.1 to 1.0 μm. After that, a protective plate 20 made of ferrite or crystallized glass is placed on this glass base layer 18 with a low melting point glass material such as glass RORAD, glass flat sheet or frit interposed as a bonding agent 19, and then heated and pressed. This protective plate 20 is bonded by processing.
そして、同図（ｄ）に示すように、前方部分りの所定位
置まで摺動面研磨を施す。Then, as shown in FIG. 3(d), the sliding surface is polished up to a predetermined position on the front edge.
このように、本発明に係る薄膜磁気ヘッドの製造方法に
よれば、絶縁保護ＪＷ１７における段差部Ｃの前方部分
りを、上記段差部Ｃ上端の高さよりも高くなるように形
成し、且つ、上記前方部分りの所定位置まで摺動面研磨
を施すから、媒体摺動面には接合剤１９ではなく、上記
の絶縁保護層１７が露出することになる。そして、上記
の絶縁保護Ｆ！Ｊ １７ トシ７硬度０）高イＳ ｉ
Ｏｚ ヤＡ ｌ ｚ ０３などを選べるから、媒体摺動
面において凹部が発生するのを回避することができ、こ
の凹部に起因するヘッドの目詰まり、更にはヘッド・磁
気記録媒体間の空隙によるスペーシング損失を低減して
ヘッドの出力の低下防止を図ることができる。As described above, according to the method of manufacturing a thin film magnetic head according to the present invention, the front portion of the stepped portion C in the insulation protection JW17 is formed to be higher than the height of the upper end of the stepped portion C, and Since the sliding surface is polished up to a predetermined position on the front side, the above-mentioned insulating protective layer 17, rather than the bonding agent 19, is exposed on the medium sliding surface. And the above insulation protection F! J 17 Toshi 7 Hardness 0) High S i
Since it is possible to choose from a variety of colors such as OZYA, ALZ03, etc., it is possible to avoid the occurrence of recesses on the sliding surface of the medium, and prevent head clogging caused by these recesses, as well as scratches caused by gaps between the head and the magnetic recording medium. It is possible to reduce pacing loss and prevent a decrease in head output.
また、上記の接合剤１９は媒体摺動面に露出することは
ないから、この接合剤１９の硬度を考慮する必要がなく
なる。従って、この接合剤１９として樹脂を使用するこ
とが可能になるとともに、この接合剤１９として低融点
ガラスを使用する場合には、低融点ガラスの作業温度を
低（設定できるから、薄膜磁気ヘッド１１の磁気的・電
気的特性の確保、および外観上の不良（クランク・剥離
など）の防止を図ることができ、且つ、この低融点ガラ
スの奏する利点、例えば、樹脂に比べて耐環境性（耐湿
性・耐薬品性等）の点で優れているという利点をそのま
ま享受できることになる。Further, since the above-mentioned bonding agent 19 is not exposed on the medium sliding surface, there is no need to consider the hardness of this bonding agent 19. Therefore, it is possible to use resin as the bonding agent 19, and when low-melting glass is used as the bonding agent 19, the working temperature of the low-melting point glass can be set to a low temperature. It is possible to secure the magnetic and electrical properties of the glass and prevent appearance defects (cranking, peeling, etc.).In addition, the advantages of this low melting point glass include, for example, environmental resistance (moisture resistance) compared to resin. This means that you can enjoy the benefits of being superior in terms of durability, chemical resistance, etc.).
なお、上記の実施例では、前方部分りを、上記段差部Ｃ
上端の高さよりも高くなるように形成するのにメタルマ
スク２２を用いたが、これ以外の方法として、第３図（
ａ）に示すように、上記絶縁保護Ｎ１７における膜厚ａ
を、仮想線で示す最終的に必要な上記段差部Ｃ上端の高
さｂよりも厚くなるように、例えば１０〜３０μｍの厚
みで形成し、次いで、同図（ｂ）に示すように、前方部
分りに対応する箇所にフォトレジスト２３を形成した後
、露光・現像を行い、同図（ｃ）に示すように、ＲＩＥ
（Ｒｅａｃｔｉｖｅ Ｉｏｎ Ｅｔｃｈｉｎｇ）
法により、上記前方部分り以外の箇所を最終的に膜厚が
１〜５μｍとなるように選択的に除去すれば良い。In addition, in the above embodiment, the front portion is set to the step portion C.
Although the metal mask 22 was used to form the film to be higher than the height of the upper end, there is an alternative method as shown in FIG.
As shown in a), the film thickness a in the insulation protection N17
is formed to have a thickness of 10 to 30 μm, for example, so that it is thicker than the ultimately required height b of the upper end of the stepped portion C shown by the imaginary line, and then, as shown in FIG. After forming a photoresist 23 at a location corresponding to the partial fill, exposure and development are performed, and as shown in FIG.
(Reactive Ion Etching)
By using a method, parts other than the front part may be selectively removed so that the final film thickness is 1 to 5 μm.
また、上記の実施例では、薄膜磁気ヘッドとして巻線型
の薄膜磁気ヘッドを挙げたが、その他の薄膜磁気ヘッド
、例えば、ヨーク型の磁気抵抗効果素子型薄膜磁気ヘッ
ドなどにおいても通用できることは勿論である。Further, in the above embodiment, a wire-wound thin film magnetic head is used as the thin film magnetic head, but it is of course applicable to other thin film magnetic heads, such as a yoke type magnetoresistive element type thin film magnetic head. be.
本発明にかかる薄膜磁気ヘッドの製造方法は、以上のよ
うに、磁気回路におけるヘッドギャップ部側の盛り上が
りを反映して形成される絶縁保護層における段差部の前
方部分を、上記段差部−１一端の高さよりも高くなるよ
うに形成する工程と、この工程の後に保護板を接合剤に
て接合する工程と、この工程の後に前記段差部の前方部
分の所定位置まで摺動面研磨を施す工程とを有する構成
である。As described above, in the method for manufacturing a thin film magnetic head according to the present invention, the front part of the step part in the insulating protective layer that is formed to reflect the swell on the head gap side in the magnetic circuit is formed at one end of the step part-1. a step of bonding the protective plate with a bonding agent after this step, and a step of polishing the sliding surface to a predetermined position in the front part of the stepped portion after this step. This is a configuration having the following.
これにより、媒体摺動面において凹部の発生を回避する
ことができ、この凹部に起因するヘッドの目詰まり、更
にはヘッド・磁気記録媒体間のスペーシング損失を防止
してヘッドの出力が低下するという問題を解消すること
ができる。This makes it possible to avoid the formation of recesses on the media sliding surface, and prevent head clogging caused by these recesses, as well as spacing loss between the head and the magnetic recording medium, thereby reducing head output. This problem can be solved.
その上、上記の接合剤として樹脂を使用することが可能
になるとともに、接合剤として低融点ガラスを使用する
場合には、低融点ガラスの作業温度を低（設定できるか
ら、薄膜磁気ヘッドの磁気的・電気的特性の確保、およ
び外観上の不良防止を図ることができ、且つ、この低融
点ガラスの奏する利点、例えば、樹脂１こ比べて耐環境
性の点で優れているという利点をそのまま享受できると
いう効果も併せ°ζ奏する。In addition, it becomes possible to use resin as the bonding agent mentioned above, and when using low-melting point glass as the bonding agent, the working temperature of the low-melting point glass can be set to a low temperature. It is possible to secure physical and electrical properties and prevent defects in appearance, while maintaining the advantages of this low melting point glass, such as superior environmental resistance compared to resin. It also has the effect of being able to enjoy it.
第１図ないし第３図は本発明の一実施例を示すものであ
って、第１図（ａ）ないしくｄ）はそれぞれ薄膜磁気ヘ
ッドの製造工程の各段階を示す断面図、第２図はメタル
マスクの平面図、第３図（ａ）ないしくｃ）は段差部の
前方部分を段差部上端の高さよりも高くなるように形成
するための工程の変形例の各段階を示す断面図、第４図
は従来の製造方法により製造される薄膜磁気ヘッドの断
面図である。
１１は巻線型の薄膜磁気ヘッド、１２は磁性基板、１３
は下部磁性層、１４は層間絶縁層、１５は巻線導体、１
６は上部磁性層、１７は絶縁保護筋、１８はガラス下地
層、１９は接合剤、２０は保護板、２１は磁気回路、２
２はメタルマスク、２３はフォトレジストである。
特許出願人 シャープ 株式会社第１図（ａ）
箔 １図（ｂ）
嘉 １ ＋４（ｃ）
第 ｌ 囚（ｄ）1 to 3 show an embodiment of the present invention, in which FIGS. 1(a) to d) are cross-sectional views showing each stage of the manufacturing process of a thin film magnetic head, and FIG. 3 is a plan view of the metal mask, and FIGS. 3(a) to 3(c) are cross-sectional views showing each stage of a modification of the process for forming the front part of the stepped portion to be higher than the height of the upper end of the stepped portion. , FIG. 4 is a sectional view of a thin film magnetic head manufactured by a conventional manufacturing method. 11 is a wire-wound thin film magnetic head; 12 is a magnetic substrate; 13 is a wire-wound thin film magnetic head;
1 is a lower magnetic layer, 14 is an interlayer insulating layer, 15 is a winding conductor, 1
6 is an upper magnetic layer, 17 is an insulation protective strip, 18 is a glass base layer, 19 is a bonding agent, 20 is a protective plate, 21 is a magnetic circuit, 2
2 is a metal mask, and 23 is a photoresist. Patent applicant Sharp Co., Ltd. Figure 1 (a) Foil Figure 1 (b) Ka 1 +4 (c) Prisoner I (d)
Claims (1)
を反映して形成される絶縁保護層における段差部の前方
部分を、上記段差部上端の高さよりも高くなるように形
成する工程と、この工程の後に保護板を接合剤にて接合
する工程と、この工程の後に前記段差部の前方部分の所
定位置まで摺動面研磨を施す工程とを有することを特徴
とする薄膜磁気ヘッドの製造方法。1. A step of forming the front part of the stepped portion in the insulating protective layer, which is formed to reflect the swelling on the head gap side in the magnetic circuit, to be higher than the height of the upper end of the stepped portion, and after this step. A method for manufacturing a thin-film magnetic head, comprising the steps of bonding the protective plate with a bonding agent, and after this step, polishing the sliding surface to a predetermined position in the front portion of the stepped portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15726488A JPH073686B2 (en) | 1988-06-23 | 1988-06-23 | Method of manufacturing thin film magnetic head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15726488A JPH073686B2 (en) | 1988-06-23 | 1988-06-23 | Method of manufacturing thin film magnetic head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH025216A true JPH025216A (en) | 1990-01-10 |
| JPH073686B2 JPH073686B2 (en) | 1995-01-18 |
Family
ID=15645855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15726488A Expired - Lifetime JPH073686B2 (en) | 1988-06-23 | 1988-06-23 | Method of manufacturing thin film magnetic head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH073686B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007057169A (en) * | 2005-08-25 | 2007-03-08 | Kajiwara Kogyo Kk | Exhaust hood |
-
1988
- 1988-06-23 JP JP15726488A patent/JPH073686B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007057169A (en) * | 2005-08-25 | 2007-03-08 | Kajiwara Kogyo Kk | Exhaust hood |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH073686B2 (en) | 1995-01-18 |
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