JPH0298467U - - Google Patents

Info

Publication number

JPH0298467U

JPH0298467U JP637189U JP637189U JPH0298467U JP H0298467 U JPH0298467 U JP H0298467U JP 637189 U JP637189 U JP 637189U JP 637189 U JP637189 U JP 637189U JP H0298467 U JPH0298467 U JP H0298467U

Authority

JP

Japan

Prior art keywords

lead wire

printed circuit

circuit board

caulking

insulation coating

Prior art date

1989-01-23

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 7
• 239000011248 coating agent Substances 0.000 claims description 3
• 238000000576 coating method Methods 0.000 claims description 3
• 239000004020 conductor Substances 0.000 claims description 2
• 230000037431 insertion Effects 0.000 claims description 2
• 238000003780 insertion Methods 0.000 claims description 2
• 230000002265 prevention Effects 0.000 claims description 2
• 238000009413 insulation Methods 0.000 claims 2
• 238000005452 bending Methods 0.000 claims 1
• 239000002184 metal Substances 0.000 claims 1
• 238000005476 soldering Methods 0.000 claims 1
• 229910000679 solder Inorganic materials 0.000 description 1