JPH0297010U - - Google Patents

Info

Publication number
JPH0297010U
JPH0297010U JP473689U JP473689U JPH0297010U JP H0297010 U JPH0297010 U JP H0297010U JP 473689 U JP473689 U JP 473689U JP 473689 U JP473689 U JP 473689U JP H0297010 U JPH0297010 U JP H0297010U
Authority
JP
Japan
Prior art keywords
mold
semiconductor element
centering
molding machine
wire type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP473689U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0620578Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989004736U priority Critical patent/JPH0620578Y2/ja
Publication of JPH0297010U publication Critical patent/JPH0297010U/ja
Application granted granted Critical
Publication of JPH0620578Y2 publication Critical patent/JPH0620578Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP1989004736U 1989-01-19 1989-01-19 半導体射出成型機 Expired - Lifetime JPH0620578Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989004736U JPH0620578Y2 (ja) 1989-01-19 1989-01-19 半導体射出成型機

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989004736U JPH0620578Y2 (ja) 1989-01-19 1989-01-19 半導体射出成型機

Publications (2)

Publication Number Publication Date
JPH0297010U true JPH0297010U (enrdf_load_stackoverflow) 1990-08-02
JPH0620578Y2 JPH0620578Y2 (ja) 1994-06-01

Family

ID=31207512

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989004736U Expired - Lifetime JPH0620578Y2 (ja) 1989-01-19 1989-01-19 半導体射出成型機

Country Status (1)

Country Link
JP (1) JPH0620578Y2 (enrdf_load_stackoverflow)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5420086A (en) * 1977-07-15 1979-02-15 Lim Holding Sa Apparatus for casting or injection molding automobile tire
JPS57163528A (en) * 1981-04-01 1982-10-07 Daifuku Co Ltd Apparatus for holding position of reinforcing material seald in resin molded body
JPS59118517U (ja) * 1983-01-27 1984-08-10 安田　斗石 合成樹脂からなるレンズ及びレンズフレ−ム一体成形金型

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5420086A (en) * 1977-07-15 1979-02-15 Lim Holding Sa Apparatus for casting or injection molding automobile tire
JPS57163528A (en) * 1981-04-01 1982-10-07 Daifuku Co Ltd Apparatus for holding position of reinforcing material seald in resin molded body
JPS59118517U (ja) * 1983-01-27 1984-08-10 安田　斗石 合成樹脂からなるレンズ及びレンズフレ−ム一体成形金型

Also Published As

Publication number Publication date
JPH0620578Y2 (ja) 1994-06-01

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term