JPH0296747U - - Google Patents

Info

Publication number
JPH0296747U
JPH0296747U JP1989006104U JP610489U JPH0296747U JP H0296747 U JPH0296747 U JP H0296747U JP 1989006104 U JP1989006104 U JP 1989006104U JP 610489 U JP610489 U JP 610489U JP H0296747 U JPH0296747 U JP H0296747U
Authority
JP
Japan
Prior art keywords
semiconductor substrate
compound semiconductor
slit
integrated circuit
microwave integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989006104U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989006104U priority Critical patent/JPH0296747U/ja
Publication of JPH0296747U publication Critical patent/JPH0296747U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/884Die-attach connectors and bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

Landscapes

  • Semiconductor Integrated Circuits (AREA)
JP1989006104U 1989-01-23 1989-01-23 Pending JPH0296747U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989006104U JPH0296747U (enExample) 1989-01-23 1989-01-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989006104U JPH0296747U (enExample) 1989-01-23 1989-01-23

Publications (1)

Publication Number Publication Date
JPH0296747U true JPH0296747U (enExample) 1990-08-01

Family

ID=31210051

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989006104U Pending JPH0296747U (enExample) 1989-01-23 1989-01-23

Country Status (1)

Country Link
JP (1) JPH0296747U (enExample)

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