JPH029556Y2 - - Google Patents

Info

Publication number
JPH029556Y2
JPH029556Y2 JP19936484U JP19936484U JPH029556Y2 JP H029556 Y2 JPH029556 Y2 JP H029556Y2 JP 19936484 U JP19936484 U JP 19936484U JP 19936484 U JP19936484 U JP 19936484U JP H029556 Y2 JPH029556 Y2 JP H029556Y2
Authority
JP
Japan
Prior art keywords
frame
presser
lead frame
bonding
coil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP19936484U
Other languages
English (en)
Japanese (ja)
Other versions
JPS61114832U (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19936484U priority Critical patent/JPH029556Y2/ja
Publication of JPS61114832U publication Critical patent/JPS61114832U/ja
Application granted granted Critical
Publication of JPH029556Y2 publication Critical patent/JPH029556Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78344Eccentric cams

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP19936484U 1984-12-28 1984-12-28 Expired JPH029556Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19936484U JPH029556Y2 (enrdf_load_stackoverflow) 1984-12-28 1984-12-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19936484U JPH029556Y2 (enrdf_load_stackoverflow) 1984-12-28 1984-12-28

Publications (2)

Publication Number Publication Date
JPS61114832U JPS61114832U (enrdf_load_stackoverflow) 1986-07-19
JPH029556Y2 true JPH029556Y2 (enrdf_load_stackoverflow) 1990-03-09

Family

ID=30759218

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19936484U Expired JPH029556Y2 (enrdf_load_stackoverflow) 1984-12-28 1984-12-28

Country Status (1)

Country Link
JP (1) JPH029556Y2 (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS61114832U (enrdf_load_stackoverflow) 1986-07-19

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