JPH029538Y2 - - Google Patents
Info
- Publication number
- JPH029538Y2 JPH029538Y2 JP16571483U JP16571483U JPH029538Y2 JP H029538 Y2 JPH029538 Y2 JP H029538Y2 JP 16571483 U JP16571483 U JP 16571483U JP 16571483 U JP16571483 U JP 16571483U JP H029538 Y2 JPH029538 Y2 JP H029538Y2
- Authority
- JP
- Japan
- Prior art keywords
- exterior
- capacitor
- molded
- mounting leg
- capacitor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 2
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【考案の詳細な説明】
本考案はモールドコンデンサに関するものであ
る。[Detailed Description of the Invention] The present invention relates to a molded capacitor.
モールドコンデンサは、コンデンサ素子を金型
に収納し、この金型内に溶融した樹脂を注入して
硬化させることにより外装を形成し、製造されて
いる。 A molded capacitor is manufactured by housing a capacitor element in a mold, and forming an exterior by injecting molten resin into the mold and hardening it.
樹脂は、硬化すると収縮するが、そのためにコ
ンデンサ素子と外装との間に多少、隙間ができ、
特に外装の厚い箇所は硬化が遅く、収縮が大きく
隙間が大きくなる。それ故、第１図に示す通り、
外装１の下部に取付脚２を一体的に形成した構造
のモールドコンデンサ３は、外装１の硬化前に取
付脚２の根本の部分の外装１が非常に厚くなり、
硬化後に大きな空隙４が生じる欠点がある。 When the resin hardens, it contracts, which creates a gap between the capacitor element and the exterior.
Particularly in areas where the exterior is thick, curing is slow, shrinkage is large, and gaps become large. Therefore, as shown in Figure 1,
In a molded capacitor 3 having a structure in which the mounting leg 2 is integrally formed at the bottom of the exterior 1, the exterior 1 at the base of the mounting leg 2 becomes extremely thick before the exterior 1 hardens.
There is a drawback that large voids 4 are formed after curing.
本考案は、以上の欠点を改良したモールドコン
デンサの提供を目的とするものである。 The object of the present invention is to provide a molded capacitor that improves the above-mentioned drawbacks.
本考案は、上記の目的を達成するために、コン
デンサ素子に樹脂モールドにより外装を設けたモ
ールドコンデンサにおいて、外装と一体的に形成
された取付脚と、該取付脚の根本に形成された括
部とを有することを特徴とするモールドコンデン
サを提供する。 In order to achieve the above object, the present invention provides a molded capacitor in which a capacitor element is provided with an exterior by resin molding, a mounting leg formed integrally with the exterior, and a bracket formed at the base of the mounting leg. Provided is a molded capacitor characterized by having the following.
以下、本考案の実施例を図面に基づいて説明す
る。 Hereinafter, embodiments of the present invention will be described based on the drawings.
第２図において、１１は、コンデンサ素子であ
り、ポリエチレンテレフタレートフイルムやポリ
プロピレンフイルム、ポリカーボネートフイルム
等の高分子フイルムに金属蒸着した金属化プラス
チツクフイルムやあるいは金属化紙を巻回したも
ので、両端にメタリコン１２及び１３が設けられ
ている。１４及び１５はメタリコン１２及び１３
に半田１６及び１７により接続された端子であ
る。１８は、外装であり、エポキシやポリプロピ
レン等の樹脂をモールドして成形したものであ
る。１９及び２０は、取付脚であり、外装１８の
下部にこの外装１８と一体的に形成されており、
特に根本の部分に活部２１及び２２が設けられて
いる。 In FIG. 2, reference numeral 11 is a capacitor element, which is made by winding a metallized plastic film or metallized paper made by vapor-depositing a metal around a polymer film such as polyethylene terephthalate film, polypropylene film, or polycarbonate film. 12 and 13 are provided. 14 and 15 are Metallicon 12 and 13
These terminals are connected to each other by solders 16 and 17. Reference numeral 18 denotes an exterior, which is molded from resin such as epoxy or polypropylene. 19 and 20 are mounting legs, which are formed integrally with the exterior 18 at the lower part of the exterior 18;
In particular, active parts 21 and 22 are provided at the root portion.
すなわち、本考案によれば、取付脚１９及び２
０の根本に括部２１及び２２が設けられているた
めに、根本の部分の外装１８の厚さが薄くなり、
外装１９形成の際に樹脂が硬化収縮してもその収
縮率が他の箇所とそれほど差がなく、コンデンサ
素子１との間に空隙が生じることがない。また、
取付にワツシヤー等を用いる場合には、括部２１
及び２２にワツシヤーの一部を食い込ませること
ができるため、取付脚１９及び２０を短かくで
き、全体としてコンデンサ２３を小型化できる。 That is, according to the present invention, the mounting legs 19 and 2
Since the constrictions 21 and 22 are provided at the base of 0, the thickness of the exterior 18 at the base is thinner,
Even if the resin hardens and shrinks when forming the exterior 19, the shrinkage rate is not much different from other parts, and no gap is created between the resin and the capacitor element 1. Also,
When using washers etc. for installation, use the bracket 21.
Since a part of the washer can be bitten into and 22, the mounting legs 19 and 20 can be shortened, and the capacitor 23 can be made smaller as a whole.
以上の通り、本考案によれば、コンデンサ素子
と外装との間の大きな空隙を無くすことができる
モールドコンデンサが得られる。 As described above, according to the present invention, a molded capacitor can be obtained in which a large gap between the capacitor element and the exterior can be eliminated.
第１図は従来のモールドコンデンサの正面断面
図、第２図は本考案の実施例の正面断面図を示
す。
１１……コンデンサ素子、１８……外装、１
９，２０……取付脚、２１，２２……括部、２３
……コンデンサ。
FIG. 1 is a front sectional view of a conventional molded capacitor, and FIG. 2 is a front sectional view of an embodiment of the present invention. 11...Capacitor element, 18...Exterior, 1
9, 20...Mounting leg, 21, 22...Block part, 23
...Capacitor.
Claims (1)
けたモールドコンデンサにおいて、外装と一体的
に形成された取付脚と、該取付脚の根本に形成さ
れた括部とを有することを特徴とするモールドコ
ンデンサ。 1. A molded capacitor in which a capacitor element is provided with an exterior by resin molding, the molded capacitor having a mounting leg formed integrally with the exterior and a bracket formed at the base of the mounting leg.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16571483U JPS6073217U (en) | 1983-10-26 | 1983-10-26 | molded capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16571483U JPS6073217U (en) | 1983-10-26 | 1983-10-26 | molded capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6073217U JPS6073217U (en) | 1985-05-23 |
| JPH029538Y2 true JPH029538Y2 (en) | 1990-03-09 |
Family
ID=30362981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16571483U Granted JPS6073217U (en) | 1983-10-26 | 1983-10-26 | molded capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6073217U (en) |
-
1983
- 1983-10-26 JP JP16571483U patent/JPS6073217U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6073217U (en) | 1985-05-23 |
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