JPH0295248U - - Google Patents
Info
- Publication number
- JPH0295248U JPH0295248U JP1989002181U JP218189U JPH0295248U JP H0295248 U JPH0295248 U JP H0295248U JP 1989002181 U JP1989002181 U JP 1989002181U JP 218189 U JP218189 U JP 218189U JP H0295248 U JPH0295248 U JP H0295248U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- coolant
- liquid
- circuit device
- bellows
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/877—
-
- H10W90/724—
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989002181U JPH0295248U (enExample) | 1989-01-13 | 1989-01-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989002181U JPH0295248U (enExample) | 1989-01-13 | 1989-01-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0295248U true JPH0295248U (enExample) | 1990-07-30 |
Family
ID=31202731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989002181U Pending JPH0295248U (enExample) | 1989-01-13 | 1989-01-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0295248U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016119451A (ja) * | 2014-10-14 | 2016-06-30 | インテル・コーポレーション | マルチチップパッケージに対する熱除去アセンブリの自動的な高さ補償、および共平面の水平化 |
-
1989
- 1989-01-13 JP JP1989002181U patent/JPH0295248U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016119451A (ja) * | 2014-10-14 | 2016-06-30 | インテル・コーポレーション | マルチチップパッケージに対する熱除去アセンブリの自動的な高さ補償、および共平面の水平化 |
| US9743558B2 (en) | 2014-10-14 | 2017-08-22 | Intel Corporation | Automatic height compensating and co-planar leveling heat removal assembly for multi-chip packages |