JPH0295240U - - Google Patents
Info
- Publication number
- JPH0295240U JPH0295240U JP1989004676U JP467689U JPH0295240U JP H0295240 U JPH0295240 U JP H0295240U JP 1989004676 U JP1989004676 U JP 1989004676U JP 467689 U JP467689 U JP 467689U JP H0295240 U JPH0295240 U JP H0295240U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- mounting
- circuit board
- shaped
- top surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W74/00—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989004676U JPH0295240U (enExample) | 1989-01-18 | 1989-01-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989004676U JPH0295240U (enExample) | 1989-01-18 | 1989-01-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0295240U true JPH0295240U (enExample) | 1990-07-30 |
Family
ID=31207399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989004676U Pending JPH0295240U (enExample) | 1989-01-18 | 1989-01-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0295240U (enExample) |
-
1989
- 1989-01-18 JP JP1989004676U patent/JPH0295240U/ja active Pending