JPH029435U - - Google Patents
Info
- Publication number
- JPH029435U JPH029435U JP1988087517U JP8751788U JPH029435U JP H029435 U JPH029435 U JP H029435U JP 1988087517 U JP1988087517 U JP 1988087517U JP 8751788 U JP8751788 U JP 8751788U JP H029435 U JPH029435 U JP H029435U
- Authority
- JP
- Japan
- Prior art keywords
- bonding stage
- lead
- bonding
- tab tape
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims description 6
- 239000008188 pellet Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 3
- 230000000379 polymerizing effect Effects 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988087517U JPH029435U (pt) | 1988-06-30 | 1988-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988087517U JPH029435U (pt) | 1988-06-30 | 1988-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH029435U true JPH029435U (pt) | 1990-01-22 |
Family
ID=31312122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988087517U Pending JPH029435U (pt) | 1988-06-30 | 1988-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH029435U (pt) |
-
1988
- 1988-06-30 JP JP1988087517U patent/JPH029435U/ja active Pending
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