JPH029421U - - Google Patents
Info
- Publication number
- JPH029421U JPH029421U JP8717388U JP8717388U JPH029421U JP H029421 U JPH029421 U JP H029421U JP 8717388 U JP8717388 U JP 8717388U JP 8717388 U JP8717388 U JP 8717388U JP H029421 U JPH029421 U JP H029421U
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- component
- lead wires
- lead wire
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 125000006850 spacer group Chemical group 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図Ａは本考案のブロツク電子部品の一実施
例の一部省略正面図、第１図Ｂは第１図Ａのブロ
ツク電子部品の一部省略斜視図、第２図Ａないし
Ｃは第１図のブロツク電子部品と従来のブロツク
電子部品とを基板に半田付け接続した状態をそれ
ぞれ示す説明図、第３図ＡないしＤは第１図のブ
ロツク電子部品の製造工程を示す図、第４図Ａ及
びＢは連続カバーを熱圧着する前と熱圧着した後
の状態を示す図、第５図は本考案の他の実施例を
示す一部省略斜視図である。
１……リード線付電子部品、２……部品本体、
３，４……リード線、５……接続導体、６，６′
……絶縁樹脂成型カバー、６ａ……側壁部、６ｂ
……連結部、７，７′……突出部（スペーサ部）
、ｇ……空間、ＣＢ……基板（電子部品取付基体
）、ＴＨ……スルーホール。
FIG. 1A is a partially omitted front view of an embodiment of the block electronic component of the present invention, FIG. 1B is a partially omitted perspective view of the block electronic component of FIG. 1A, and FIGS. 1 is an explanatory diagram showing the state in which the block electronic component of FIG. 1 and a conventional block electronic component are soldered and connected to a board, FIGS. 3A to D are diagrams showing the manufacturing process of the block electronic component of FIG. 1, and FIG. Figures A and B are diagrams showing the continuous cover before and after thermocompression bonding, and FIG. 5 is a partially omitted perspective view showing another embodiment of the present invention. 1... Electronic component with lead wire, 2... Part body,
3, 4... Lead wire, 5... Connection conductor, 6, 6'
...Insulating resin molded cover, 6a...Side wall part, 6b
...Connection part, 7, 7'...Protrusion part (spacer part)
, g... Space, CB... Board (electronic component mounting base), TH... Through hole.
Claims (1)
リード線付電子部品が並列に配置され、前記複数
個のリード線付電子部品の一方の側のリード線が
接続導体に接続され、前記複数個のリード線付電
子部品の前記部品本体及び前記一方の側のリード
線と前記接続導体との接続部が絶縁外装部材によ
つて覆われてなるブロツク電子部品において、 前記絶縁外装部材として絶縁樹脂を成型して形
成した絶縁樹脂成型カバーが用いられ、 前記絶縁樹脂成型カバーは、前記複数個のリー
ド線付電子部品の前記部品本体を挟持する一対の
側壁部と該一対の側壁部の一端をそれぞれ連結し
て前記接続部を覆う連結部とを具備し、前記一対
の側壁部の他端には電子部品取付基体に形成され
たスルーホールに前記リード線付電子部品の他方
の側のリード線が挿入された時に前記電子部品取
付基体の基体表面と接触して前記部品本体の端部
と前記基体表面との間に空間を形成するスペーサ
部が形成されていることを特徴とするブロツク電
子部品。[Claims for Utility Model Registration] A plurality of electronic components with lead wires having lead wires extending from both ends of the component body are arranged in parallel, and a lead wire on one side of the plurality of electronic components with lead wires is a connecting conductor. In the block electronic component, the component main body of the plurality of lead wire-equipped electronic components and the connection portion between the lead wires on one side and the connection conductor are covered with an insulating exterior member, An insulating resin molded cover formed by molding an insulating resin is used as the insulating exterior member, and the insulating resin molded cover includes a pair of side walls that sandwich the component bodies of the plurality of electronic components with lead wires, and the pair of side walls that sandwich the component bodies of the plurality of electronic components with lead wires. a connecting portion that connects one end of each of the side wall portions to cover the connecting portion, and the other end of the pair of side wall portions is provided with a through hole formed in the electronic component mounting base to which the electronic component with lead wire is connected. A spacer portion is formed that contacts the base surface of the electronic component mounting base to form a space between the end of the component body and the base surface when the other side lead wire is inserted. Characteristic block electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8717388U JPH0429545Y2 (en) | 1988-06-30 | 1988-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8717388U JPH0429545Y2 (en) | 1988-06-30 | 1988-06-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH029421U true JPH029421U (en) | 1990-01-22 |
| JPH0429545Y2 JPH0429545Y2 (en) | 1992-07-17 |
Family
ID=31311795
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8717388U Expired JPH0429545Y2 (en) | 1988-06-30 | 1988-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0429545Y2 (en) |
-
1988
- 1988-06-30 JP JP8717388U patent/JPH0429545Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0429545Y2 (en) | 1992-07-17 |
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