JPH0294131U - - Google Patents
Info
- Publication number
- JPH0294131U JPH0294131U JP17021888U JP17021888U JPH0294131U JP H0294131 U JPH0294131 U JP H0294131U JP 17021888 U JP17021888 U JP 17021888U JP 17021888 U JP17021888 U JP 17021888U JP H0294131 U JPH0294131 U JP H0294131U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- insulating substrate
- terminal
- array
- thermal head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 3
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図は、実施例サーマルヘツドを示す斜視図
、第２図は、実施例サーマルヘツドの信号用配線
パターンを示す要部拡大説明図、第３図は、実施
例サーマルヘツドの放熱板の接続用端子部を示す
要部拡大斜視図、第４図は、接続用端子部とコネ
クタとの接続状態を示す断面図、第５図は、従来
のサーマルヘツドを示す側面図、第６図は、従来
のサーマルヘツドを示す斜視図である。
１：放熱板、２：絶縁基板、５：信号用端子、
１１：折り曲げ部、１２：接続用端子部、１２ａ
：接続孔部、２１：発熱素子列、２２：駆動ＩＣ
列、３２：端子突出金具。
Fig. 1 is a perspective view showing the thermal head of the embodiment, Fig. 2 is an enlarged explanatory view of the main part showing the signal wiring pattern of the thermal head of the embodiment, and Fig. 3 is the connection of the heat sink of the thermal head of the embodiment. FIG. 4 is a cross-sectional view showing the state of connection between the connecting terminal portion and the connector, FIG. 5 is a side view showing a conventional thermal head, and FIG. FIG. 2 is a perspective view showing a conventional thermal head. 1: Heat sink, 2: Insulating board, 5: Signal terminal,
11: Bend part, 12: Connection terminal part, 12a
: Connection hole, 21: Heat generating element row, 22: Drive IC
Row, 32: terminal protruding metal fittings.
Claims (1)
に複数の端子孔を貫設した接続用端子部を設けた
放熱板と、この放熱板の上面に載置され、発熱素
子列及び駆動ＩＣ列を備えた絶縁基板とからなり
、前記接続用端子部をコネクタとし、外部装置と
前記絶縁基板の信号用端子を接続して成るサーマ
ルヘツド。 A heat sink has a connection terminal section with a plurality of terminal holes inserted through the bent portion of both sides bent inward, and a heat sink array and a drive IC array are placed on the top surface of the heat sink. What is claimed is: 1. A thermal head comprising: an insulating substrate provided with an insulating substrate, the connecting terminal portion serving as a connector, and an external device and a signal terminal of the insulating substrate being connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17021888U JPH0294131U (en) | 1988-12-29 | 1988-12-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17021888U JPH0294131U (en) | 1988-12-29 | 1988-12-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0294131U true JPH0294131U (en) | 1990-07-26 |
Family
ID=31460973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17021888U Pending JPH0294131U (en) | 1988-12-29 | 1988-12-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0294131U (en) |
-
1988
- 1988-12-29 JP JP17021888U patent/JPH0294131U/ja active Pending