JPH029396U - - Google Patents
Info
- Publication number
- JPH029396U JPH029396U JP8715988U JP8715988U JPH029396U JP H029396 U JPH029396 U JP H029396U JP 8715988 U JP8715988 U JP 8715988U JP 8715988 U JP8715988 U JP 8715988U JP H029396 U JPH029396 U JP H029396U
- Authority
- JP
- Japan
- Prior art keywords
- tube
- packing
- tightening
- diameter
- circumferential surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012856 packing Methods 0.000 claims description 5
- 230000013011 mating Effects 0.000 description 1
Landscapes
- Joints With Sleeves (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8715988U JPH029396U (es) | 1988-06-30 | 1988-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8715988U JPH029396U (es) | 1988-06-30 | 1988-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH029396U true JPH029396U (es) | 1990-01-22 |
Family
ID=31311781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8715988U Pending JPH029396U (es) | 1988-06-30 | 1988-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH029396U (es) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4993170U (es) * | 1972-11-28 | 1974-08-12 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5638829A (en) * | 1979-09-06 | 1981-04-14 | Yamada Seisakusho:Kk | Feeding and discharging mechanism for machining device of semiconductor mold package frame |
| JPS5847622B2 (ja) * | 1981-02-25 | 1983-10-24 | 信義 久保山 | 減圧平衡発熱装置における空気流発生機構 |
| JPS5922388B2 (ja) * | 1979-10-26 | 1984-05-26 | シャープ株式会社 | 配線基板へのフレキシブル基板接着方法 |
-
1988
- 1988-06-30 JP JP8715988U patent/JPH029396U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5638829A (en) * | 1979-09-06 | 1981-04-14 | Yamada Seisakusho:Kk | Feeding and discharging mechanism for machining device of semiconductor mold package frame |
| JPS5922388B2 (ja) * | 1979-10-26 | 1984-05-26 | シャープ株式会社 | 配線基板へのフレキシブル基板接着方法 |
| JPS5847622B2 (ja) * | 1981-02-25 | 1983-10-24 | 信義 久保山 | 減圧平衡発熱装置における空気流発生機構 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4993170U (es) * | 1972-11-28 | 1974-08-12 |