JPH029396U - - Google Patents
Info
- Publication number
- JPH029396U JPH029396U JP8715988U JP8715988U JPH029396U JP H029396 U JPH029396 U JP H029396U JP 8715988 U JP8715988 U JP 8715988U JP 8715988 U JP8715988 U JP 8715988U JP H029396 U JPH029396 U JP H029396U
- Authority
- JP
- Japan
- Prior art keywords
- tube
- packing
- tightening
- diameter
- circumferential surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012856 packing Methods 0.000 claims description 5
- 230000013011 mating Effects 0.000 description 1
Landscapes
- Joints With Sleeves (AREA)
Description
第1図は本考案の一例の分解斜視図、第2図は
その組立状態を示す斜視図である。
1……継手、2……ハウジング、3……パツキ
ング、4a,4b……半割体、5a,5b……フ
ランジ、6……ボルト、7……ボルト回り止め、
9,10……合せ用凹凸部、11……ストツプリ
ング。
FIG. 1 is an exploded perspective view of an example of the present invention, and FIG. 2 is a perspective view showing its assembled state. 1... Joint, 2... Housing, 3... Packing, 4a, 4b... Half body, 5a, 5b... Flange, 6... Bolt, 7... Bolt rotation stopper,
9, 10... uneven portion for mating, 11... stop ring.
Claims (1)
ンジをボルトの締め付けにより固定されるハウジ
ングと、該ハウジング内の凹部に配され且つ連結
を行なう管の端部に密着するパツキングとを有す
る管継手において、前記ハウジングは長手方向両
端側に管外径よりも小径の締め付け面を有し、前
記パツキングは管外径よりも大径の内周面と前記
凹部の内径よりも小径の外周面とを有しており、
前記半割体のボルトの締め付けにより前記締め付
け面が管外周面を固定するとともに前記凹部がパ
ツキングを変形させて前記管の端部にパツキング
を密着させることを特徴とする管継手。 A pipe joint comprising a housing made of a half-split body and whose flanges at both ends are fixed by tightening bolts, and a packing disposed in a recess in the housing and tightly attached to the end of the pipe to be connected. , the housing has a tightening surface having a smaller diameter than the outer diameter of the tube on both ends in the longitudinal direction, and the packing has an inner circumferential surface having a larger diameter than the outer diameter of the tube and an outer circumferential surface having a smaller diameter than the inner diameter of the recess. and
A pipe joint characterized in that the tightening surface fixes the outer circumferential surface of the tube by tightening the bolt of the half body, and the concave portion deforms the packing to bring the packing into close contact with the end of the tube.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8715988U JPH029396U (en) | 1988-06-30 | 1988-06-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8715988U JPH029396U (en) | 1988-06-30 | 1988-06-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH029396U true JPH029396U (en) | 1990-01-22 |
Family
ID=31311781
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8715988U Pending JPH029396U (en) | 1988-06-30 | 1988-06-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH029396U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4993170U (en) * | 1972-11-28 | 1974-08-12 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5638829A (en) * | 1979-09-06 | 1981-04-14 | Yamada Seisakusho:Kk | Feeding and discharging mechanism for machining device of semiconductor mold package frame |
JPS5847622B2 (en) * | 1981-02-25 | 1983-10-24 | 信義 久保山 | Air flow generation mechanism in reduced pressure equilibrium heating device |
JPS5922388B2 (en) * | 1979-10-26 | 1984-05-26 | シャープ株式会社 | How to bond a flexible board to a wiring board |
-
1988
- 1988-06-30 JP JP8715988U patent/JPH029396U/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5638829A (en) * | 1979-09-06 | 1981-04-14 | Yamada Seisakusho:Kk | Feeding and discharging mechanism for machining device of semiconductor mold package frame |
JPS5922388B2 (en) * | 1979-10-26 | 1984-05-26 | シャープ株式会社 | How to bond a flexible board to a wiring board |
JPS5847622B2 (en) * | 1981-02-25 | 1983-10-24 | 信義 久保山 | Air flow generation mechanism in reduced pressure equilibrium heating device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4993170U (en) * | 1972-11-28 | 1974-08-12 |