JPH029396U - - Google Patents

Info

Publication number
JPH029396U
JPH029396U JP8715988U JP8715988U JPH029396U JP H029396 U JPH029396 U JP H029396U JP 8715988 U JP8715988 U JP 8715988U JP 8715988 U JP8715988 U JP 8715988U JP H029396 U JPH029396 U JP H029396U
Authority
JP
Japan
Prior art keywords
tube
packing
tightening
diameter
circumferential surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8715988U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8715988U priority Critical patent/JPH029396U/ja
Publication of JPH029396U publication Critical patent/JPH029396U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Joints With Sleeves (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一例の分解斜視図、第2図は
その組立状態を示す斜視図である。 1……継手、2……ハウジング、3……パツキ
ング、4a,4b……半割体、5a,5b……フ
ランジ、6……ボルト、7……ボルト回り止め、
9,10……合せ用凹凸部、11……ストツプリ
ング。
FIG. 1 is an exploded perspective view of an example of the present invention, and FIG. 2 is a perspective view showing its assembled state. 1... Joint, 2... Housing, 3... Packing, 4a, 4b... Half body, 5a, 5b... Flange, 6... Bolt, 7... Bolt rotation stopper,
9, 10... uneven portion for mating, 11... stop ring.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 二分割された半割体からなり且つその両端フラ
ンジをボルトの締め付けにより固定されるハウジ
ングと、該ハウジング内の凹部に配され且つ連結
を行なう管の端部に密着するパツキングとを有す
る管継手において、前記ハウジングは長手方向両
端側に管外径よりも小径の締め付け面を有し、前
記パツキングは管外径よりも大径の内周面と前記
凹部の内径よりも小径の外周面とを有しており、
前記半割体のボルトの締め付けにより前記締め付
け面が管外周面を固定するとともに前記凹部がパ
ツキングを変形させて前記管の端部にパツキング
を密着させることを特徴とする管継手。
A pipe joint comprising a housing made of a half-split body and whose flanges at both ends are fixed by tightening bolts, and a packing disposed in a recess in the housing and tightly attached to the end of the pipe to be connected. , the housing has a tightening surface having a smaller diameter than the outer diameter of the tube on both ends in the longitudinal direction, and the packing has an inner circumferential surface having a larger diameter than the outer diameter of the tube and an outer circumferential surface having a smaller diameter than the inner diameter of the recess. and
A pipe joint characterized in that the tightening surface fixes the outer circumferential surface of the tube by tightening the bolt of the half body, and the concave portion deforms the packing to bring the packing into close contact with the end of the tube.
JP8715988U 1988-06-30 1988-06-30 Pending JPH029396U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8715988U JPH029396U (en) 1988-06-30 1988-06-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8715988U JPH029396U (en) 1988-06-30 1988-06-30

Publications (1)

Publication Number Publication Date
JPH029396U true JPH029396U (en) 1990-01-22

Family

ID=31311781

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8715988U Pending JPH029396U (en) 1988-06-30 1988-06-30

Country Status (1)

Country Link
JP (1) JPH029396U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4993170U (en) * 1972-11-28 1974-08-12

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5638829A (en) * 1979-09-06 1981-04-14 Yamada Seisakusho:Kk Feeding and discharging mechanism for machining device of semiconductor mold package frame
JPS5847622B2 (en) * 1981-02-25 1983-10-24 信義 久保山 Air flow generation mechanism in reduced pressure equilibrium heating device
JPS5922388B2 (en) * 1979-10-26 1984-05-26 シャープ株式会社 How to bond a flexible board to a wiring board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5638829A (en) * 1979-09-06 1981-04-14 Yamada Seisakusho:Kk Feeding and discharging mechanism for machining device of semiconductor mold package frame
JPS5922388B2 (en) * 1979-10-26 1984-05-26 シャープ株式会社 How to bond a flexible board to a wiring board
JPS5847622B2 (en) * 1981-02-25 1983-10-24 信義 久保山 Air flow generation mechanism in reduced pressure equilibrium heating device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4993170U (en) * 1972-11-28 1974-08-12

Similar Documents

Publication Publication Date Title
JPH029396U (en)
JPH0449220U (en)
JPH0369783U (en)
JPH0292190U (en)
JPH01150294U (en)
JPS6287283U (en)
JPS63121885U (en)
JPH0386285U (en)
JPH0276293U (en)
JPS6154589U (en)
JPS6166288U (en)
JPH01171909U (en)
JPS6296190U (en)
JPH01152189U (en)
JPH0285091U (en)
JPS6429587U (en)
JPH0323261U (en)
JPS61129914U (en)
JPS62146086U (en)
JPH01173592U (en)
JPH0360669U (en)
JPS61126181U (en)
JPH01176292U (en)
JPS63139390U (en)
JPS62102087U (en)