JPH0292966U - - Google Patents
Info
- Publication number
- JPH0292966U JPH0292966U JP120289U JP120289U JPH0292966U JP H0292966 U JPH0292966 U JP H0292966U JP 120289 U JP120289 U JP 120289U JP 120289 U JP120289 U JP 120289U JP H0292966 U JPH0292966 U JP H0292966U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- attachment area
- wiring pattern
- forming body
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP120289U JPH0292966U (enExample) | 1989-01-11 | 1989-01-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP120289U JPH0292966U (enExample) | 1989-01-11 | 1989-01-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0292966U true JPH0292966U (enExample) | 1990-07-24 |
Family
ID=31200887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP120289U Pending JPH0292966U (enExample) | 1989-01-11 | 1989-01-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0292966U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997031510A1 (en) * | 1994-07-26 | 1997-08-28 | Advantest Corporation | Electrode pad for electric signal connection |
| JP2009170474A (ja) * | 2008-01-10 | 2009-07-30 | Seiko Instruments Inc | 回路基板とその製造方法および電子機器 |
-
1989
- 1989-01-11 JP JP120289U patent/JPH0292966U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997031510A1 (en) * | 1994-07-26 | 1997-08-28 | Advantest Corporation | Electrode pad for electric signal connection |
| JP2009170474A (ja) * | 2008-01-10 | 2009-07-30 | Seiko Instruments Inc | 回路基板とその製造方法および電子機器 |