JPH0291347U - - Google Patents
Info
- Publication number
- JPH0291347U JPH0291347U JP68989U JP68989U JPH0291347U JP H0291347 U JPH0291347 U JP H0291347U JP 68989 U JP68989 U JP 68989U JP 68989 U JP68989 U JP 68989U JP H0291347 U JPH0291347 U JP H0291347U
- Authority
- JP
- Japan
- Prior art keywords
- pepper pot
- wafer sheet
- ejector pin
- pepper
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 235000002566 Capsicum Nutrition 0.000 claims 6
- 239000006002 Pepper Substances 0.000 claims 6
- 241000722363 Piper Species 0.000 claims 6
- 235000016761 Piper aduncum Nutrition 0.000 claims 6
- 235000017804 Piper guineense Nutrition 0.000 claims 6
- 235000008184 Piper nigrum Nutrition 0.000 claims 6
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP68989U JPH0291347U (enExample) | 1989-01-06 | 1989-01-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP68989U JPH0291347U (enExample) | 1989-01-06 | 1989-01-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0291347U true JPH0291347U (enExample) | 1990-07-19 |
Family
ID=31504627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP68989U Pending JPH0291347U (enExample) | 1989-01-06 | 1989-01-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0291347U (enExample) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS622633A (ja) * | 1985-06-28 | 1987-01-08 | Toshiba Corp | 半導体チツプの剥離方法および装置 |
-
1989
- 1989-01-06 JP JP68989U patent/JPH0291347U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS622633A (ja) * | 1985-06-28 | 1987-01-08 | Toshiba Corp | 半導体チツプの剥離方法および装置 |