JPH0291341U - - Google Patents
Info
- Publication number
- JPH0291341U JPH0291341U JP25289U JP25289U JPH0291341U JP H0291341 U JPH0291341 U JP H0291341U JP 25289 U JP25289 U JP 25289U JP 25289 U JP25289 U JP 25289U JP H0291341 U JPH0291341 U JP H0291341U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- heating plate
- conveyance path
- semiconductor chips
- die bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims 2
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25289U JPH0291341U (enExample) | 1989-01-05 | 1989-01-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25289U JPH0291341U (enExample) | 1989-01-05 | 1989-01-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0291341U true JPH0291341U (enExample) | 1990-07-19 |
Family
ID=31199114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25289U Pending JPH0291341U (enExample) | 1989-01-05 | 1989-01-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0291341U (enExample) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61154041A (ja) * | 1984-12-26 | 1986-07-12 | Toshiba Corp | 半導体組立装置 |
-
1989
- 1989-01-05 JP JP25289U patent/JPH0291341U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61154041A (ja) * | 1984-12-26 | 1986-07-12 | Toshiba Corp | 半導体組立装置 |