JPH0291316U - - Google Patents
Info
- Publication number
- JPH0291316U JPH0291316U JP17106388U JP17106388U JPH0291316U JP H0291316 U JPH0291316 U JP H0291316U JP 17106388 U JP17106388 U JP 17106388U JP 17106388 U JP17106388 U JP 17106388U JP H0291316 U JPH0291316 U JP H0291316U
- Authority
- JP
- Japan
- Prior art keywords
- case
- coil
- housed
- silicone gel
- silicone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920001296 polysiloxane Polymers 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims 1
- 239000011810 insulating material Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 238000004804 winding Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
Landscapes
- Coils Or Transformers For Communication (AREA)
Description
第１図は本考案の一実施例を示すチツプ型コイ
ルの外観透視斜視図。第２図は、第１図の実施例
のチツプ型コイルの中央Ａ―Ａ断面図。第３図は
、従来のチツプ型コイルを示す外観斜視図。
１……リード端子、２……巻線型コイル、３…
…モールド樹脂、４……シリコーンゲル、５……
室温硬化型シリコーン、６……（ケース上部モー
ルド加工）樹脂、７……（コア固定）ケース、８
……コア。
FIG. 1 is an external perspective view of a chip-type coil showing an embodiment of the present invention. FIG. 2 is a sectional view taken along the center line AA of the chip-type coil of the embodiment shown in FIG. FIG. 3 is an external perspective view showing a conventional chip-type coil. 1... Lead terminal, 2... Wire-wound coil, 3...
...Mold resin, 4...Silicone gel, 5...
Room temperature curing silicone, 6... (case upper mold processing) resin, 7... (core fixed) case, 8
……core.
Claims (1)
線の端部をケース下部に固定されているリード端
子に接続したのち、コイルが収納されたケース中
にシリコーンゲルを流し込み、更にその上部表面
に室温硬化型シリコーンをかぶせたのち、エポキ
シ樹脂等でケースの上面部をモールドにより封止
することを特徴とするチツプ型コイル。 The coil is housed in a case made of insulating material, and the ends of the windings are connected to the lead terminals fixed at the bottom of the case. Silicone gel is poured into the case where the coil is housed, and then the upper surface is coated with silicone gel. A chip-type coil characterized by covering the case with room-temperature-curing silicone and then sealing the upper surface of the case with epoxy resin or the like using a mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17106388U JPH0291316U (en) | 1988-12-28 | 1988-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17106388U JPH0291316U (en) | 1988-12-28 | 1988-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0291316U true JPH0291316U (en) | 1990-07-19 |
Family
ID=31462554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17106388U Pending JPH0291316U (en) | 1988-12-28 | 1988-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0291316U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5128657B1 (en) * | 1969-08-26 | 1976-08-20 | ||
| JPS5921507U (en) * | 1982-08-02 | 1984-02-09 | ミサワホ−ム株式会社 | Ceiling lighting device |
-
1988
- 1988-12-28 JP JP17106388U patent/JPH0291316U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5128657B1 (en) * | 1969-08-26 | 1976-08-20 | ||
| JPS5921507U (en) * | 1982-08-02 | 1984-02-09 | ミサワホ−ム株式会社 | Ceiling lighting device |