JPH0197523U - - Google Patents
Info
- Publication number
- JPH0197523U JPH0197523U JP19201987U JP19201987U JPH0197523U JP H0197523 U JPH0197523 U JP H0197523U JP 19201987 U JP19201987 U JP 19201987U JP 19201987 U JP19201987 U JP 19201987U JP H0197523 U JPH0197523 U JP H0197523U
- Authority
- JP
- Japan
- Prior art keywords
- parallel
- wire
- bonded
- toroidal coil
- toroidal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004804 winding Methods 0.000 claims description 6
- 239000011810 insulating material Substances 0.000 claims 1
- 239000000463 material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
Description
第１図は本考案のトロイダルコイル及び基板実
装斜視図、第２図は本考案のマグネツトワイヤー
（巻線材）図、第３図は、従来のトロイダルコイ
ル及び基板実装斜視図、第４図は従来のマグネツ
トワイヤー（巻線材）図である。
１：トロイダル磁気コア、２：絶縁蓋、２１：
絶縁ケース、３：単線マグネツトワイヤー（単線
巻線材）、３１，３１′：よじり端末、４：巻線
材ボビン、５：平行線マグネツトワイヤー（平行
線巻線材）、５１，５１′：平行端末、６：接着
剤付マグネツトワイヤー（ボンドメツト線）、７
：基板、８：丸穴、９：長穴、Ａ：よじり端末半
田寸法、Ｂ：平行端末半田寸法。
Figure 1 is a perspective view of the toroidal coil and board mounting of the present invention, Figure 2 is a diagram of the magnet wire (winding material) of the present invention, Figure 3 is a perspective view of the conventional toroidal coil and board mounting, and Figure 4 is a perspective view of the toroidal coil and board mounting of the present invention. It is a diagram of a conventional magnet wire (winding material). 1: Toroidal magnetic core, 2: Insulating lid, 21:
Insulation case, 3: Single wire magnet wire (single wire winding material), 31, 31': Twisted terminal, 4: Winding material bobbin, 5: Parallel wire magnet wire (parallel wire winding material), 51, 51': Parallel terminal , 6: Magnet wire with adhesive (bondmet wire), 7
: Board, 8: Round hole, 9: Long hole, A: Twisted terminal solder dimension, B: Parallel terminal solder dimension.
Claims (1)
ス及び蓋からなるリング状のケース中に収納され
、該ケース上に複数本の並列マグネツトワイヤー
からなる巻線が施されてなるトロイダルコイルに
おいて、前記マグネツトワイヤーはボンドメツト
線であり、かつ、複数の並列マグネツトワイヤー
は並列状態で互いに接着されており、しかも両端
部は、並列に接着されたままのリード端子とされ
ていることを特徴とするトロイダルコイル。 A toroidal coil in which a toroidal magnetic core is housed in a ring-shaped case made of an insulating material and a lid, and a winding made of a plurality of parallel magnet wires is provided on the case. A toroidal coil characterized in that the wire is a bonded wire, a plurality of parallel magnet wires are bonded to each other in parallel, and both ends are lead terminals that remain bonded in parallel. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19201987U JPH0197523U (en) | 1987-12-19 | 1987-12-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19201987U JPH0197523U (en) | 1987-12-19 | 1987-12-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0197523U true JPH0197523U (en) | 1989-06-29 |
Family
ID=31482897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19201987U Pending JPH0197523U (en) | 1987-12-19 | 1987-12-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0197523U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004281727A (en) * | 2003-03-17 | 2004-10-07 | Tdk Corp | Surface-mounting package and electronic component using the same |
| WO2017149649A1 (en) * | 2016-03-01 | 2017-09-08 | 三菱電機株式会社 | Electronic circuit board and coil device |
-
1987
- 1987-12-19 JP JP19201987U patent/JPH0197523U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004281727A (en) * | 2003-03-17 | 2004-10-07 | Tdk Corp | Surface-mounting package and electronic component using the same |
| WO2017149649A1 (en) * | 2016-03-01 | 2017-09-08 | 三菱電機株式会社 | Electronic circuit board and coil device |
| JPWO2017149649A1 (en) * | 2016-03-01 | 2018-06-07 | 三菱電機株式会社 | Electronic circuit board and coil device |
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