JPH0290645A - Inspection of image sensor and inspecting device which is used for that - Google Patents

Inspection of image sensor and inspecting device which is used for that

Info

Publication number
JPH0290645A
JPH0290645A JP24114188A JP24114188A JPH0290645A JP H0290645 A JPH0290645 A JP H0290645A JP 24114188 A JP24114188 A JP 24114188A JP 24114188 A JP24114188 A JP 24114188A JP H0290645 A JPH0290645 A JP H0290645A
Authority
JP
Japan
Prior art keywords
light
image sensor
inspection
lens
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24114188A
Other languages
Japanese (ja)
Inventor
Kenji Iwasa
Munenori Ozawa
Original Assignee
Hitachi Ltd
Hitachi Tobu Semiconductor Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Tobu Semiconductor Ltd filed Critical Hitachi Ltd
Priority to JP24114188A priority Critical patent/JPH0290645A/en
Publication of JPH0290645A publication Critical patent/JPH0290645A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To bring closer an image sensor to a state after the sensor is sealed and moreover, to make possible the inspection of the image sensor having little variability by a method wherein light emitted from a light source is scattered and the scattered light is turned into a light close to a uniform light and is irradiated on the image sensor to inspect.
CONSTITUTION: Light irradiated from an LED 7 reaches a frosted glass 10 and is made to pass through the glass 10. At this time, the light emitted from the LED strikes on the interior of a luminous part main body 6 as well, but an irregular reflection is not caused because a discharge machining is performed on the surface of the interior. The light made to pass through the glass 10 becomes an almost uniform light as being scattered sufficiently by the glass 10 and reaches a SELFOC lens 4. Even here, even if the light strikes on the interior of the lens 4, the light is absorbed by the surface, on which a discharge machining is performed, of the lens 4. The angle of the light made to pass through the lens 4 is spread by about 20° and the light is released. As this light becomes an almost uniform light, the light becomes the optimum light for the inspection of an image sensor which is an object. This light is irradiated on the image sensor 1a formed on a wafer 1 and as the result, a current which is made to flow through the sensor 1a is detected by probes 2. Thereby, the inspection of the image sensor is executed.
COPYRIGHT: (C)1990,JPO&Japio
JP24114188A 1988-09-28 1988-09-28 Inspection of image sensor and inspecting device which is used for that Pending JPH0290645A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24114188A JPH0290645A (en) 1988-09-28 1988-09-28 Inspection of image sensor and inspecting device which is used for that

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24114188A JPH0290645A (en) 1988-09-28 1988-09-28 Inspection of image sensor and inspecting device which is used for that

Publications (1)

Publication Number Publication Date
JPH0290645A true JPH0290645A (en) 1990-03-30

Family

ID=17069882

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24114188A Pending JPH0290645A (en) 1988-09-28 1988-09-28 Inspection of image sensor and inspecting device which is used for that

Country Status (1)

Country Link
JP (1) JPH0290645A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004053451A1 (en) * 2002-12-06 2004-06-24 Inter Action Corporation Instrument for testing solid-state imaging device
JP2006064441A (en) * 2004-08-25 2006-03-09 Yokogawa Electric Corp Light source for inspection and ic tester
JP2006147171A (en) * 2004-11-16 2006-06-08 Yokogawa Electric Corp Light source device
KR100691087B1 (en) * 2003-05-16 2007-03-09 동경 엘렉트론 주식회사 Inspection apparatus
JP2007150033A (en) * 2005-11-29 2007-06-14 Japan Electronic Materials Corp Optical device test unit
KR100737366B1 (en) * 2004-07-13 2007-07-09 요코가와 덴키 가부시키가이샤 Light source for inspection
WO2008059767A1 (en) * 2006-11-15 2008-05-22 Japan Electronic Materials Corp. Optical device inspecting apparatus
US7589541B2 (en) 2005-06-16 2009-09-15 Fujifilm Corporation Method and apparatus for inspecting solid-state image pick-up device
TWI421502B (en) * 2010-06-25 2014-01-01 Omnivision Tech Inc Probe card

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004053451A1 (en) * 2002-12-06 2004-06-24 Inter Action Corporation Instrument for testing solid-state imaging device
KR100691087B1 (en) * 2003-05-16 2007-03-09 동경 엘렉트론 주식회사 Inspection apparatus
KR100737366B1 (en) * 2004-07-13 2007-07-09 요코가와 덴키 가부시키가이샤 Light source for inspection
KR100749434B1 (en) * 2004-07-13 2007-08-14 요코가와 덴키 가부시키가이샤 Light source for inspection
JP2006064441A (en) * 2004-08-25 2006-03-09 Yokogawa Electric Corp Light source for inspection and ic tester
JP4513059B2 (en) * 2004-08-25 2010-07-28 横河電機株式会社 IC tester
JP2006147171A (en) * 2004-11-16 2006-06-08 Yokogawa Electric Corp Light source device
US7589541B2 (en) 2005-06-16 2009-09-15 Fujifilm Corporation Method and apparatus for inspecting solid-state image pick-up device
JP2007150033A (en) * 2005-11-29 2007-06-14 Japan Electronic Materials Corp Optical device test unit
WO2008059767A1 (en) * 2006-11-15 2008-05-22 Japan Electronic Materials Corp. Optical device inspecting apparatus
TWI421502B (en) * 2010-06-25 2014-01-01 Omnivision Tech Inc Probe card

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