JPH028877U - - Google Patents

Info

Publication number
JPH028877U
JPH028877U JP8738488U JP8738488U JPH028877U JP H028877 U JPH028877 U JP H028877U JP 8738488 U JP8738488 U JP 8738488U JP 8738488 U JP8738488 U JP 8738488U JP H028877 U JPH028877 U JP H028877U
Authority
JP
Japan
Prior art keywords
circuit board
lead
soldered
lead terminal
pulled out
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8738488U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8738488U priority Critical patent/JPH028877U/ja
Publication of JPH028877U publication Critical patent/JPH028877U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Multi-Conductor Connections (AREA)
JP8738488U 1988-06-30 1988-06-30 Pending JPH028877U (US06174465-20010116-C00003.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8738488U JPH028877U (US06174465-20010116-C00003.png) 1988-06-30 1988-06-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8738488U JPH028877U (US06174465-20010116-C00003.png) 1988-06-30 1988-06-30

Publications (1)

Publication Number Publication Date
JPH028877U true JPH028877U (US06174465-20010116-C00003.png) 1990-01-19

Family

ID=31311999

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8738488U Pending JPH028877U (US06174465-20010116-C00003.png) 1988-06-30 1988-06-30

Country Status (1)

Country Link
JP (1) JPH028877U (US06174465-20010116-C00003.png)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59230279A (ja) * 1983-06-14 1984-12-24 松下電器産業株式会社 端子装置の製造方法
JPS63138673A (ja) * 1986-11-29 1988-06-10 東芝ライテック株式会社 回路基板用リ−ドフレ−ム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59230279A (ja) * 1983-06-14 1984-12-24 松下電器産業株式会社 端子装置の製造方法
JPS63138673A (ja) * 1986-11-29 1988-06-10 東芝ライテック株式会社 回路基板用リ−ドフレ−ム

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