JPH0288157U - - Google Patents
Info
- Publication number
- JPH0288157U JPH0288157U JP16730888U JP16730888U JPH0288157U JP H0288157 U JPH0288157 U JP H0288157U JP 16730888 U JP16730888 U JP 16730888U JP 16730888 U JP16730888 U JP 16730888U JP H0288157 U JPH0288157 U JP H0288157U
- Authority
- JP
- Japan
- Prior art keywords
- evaluation device
- joint
- quality
- utility
- flat plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000011156 evaluation Methods 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図はこの考案の一実施例による半田付け評
価装置を示す側面図、第２図は従来の実装プリン
ト基板の検出方法を示す側面図である。
図において、１はプリント基板、２は部品、３
は半田、４は光源、５は撮像素子、６は駆動部、
７は画像処理部、８は制御部、９はＸ―Ｙ―θテ
ーブル、１０は撮像素子の傾斜角、１１は支持筒
、１２はミラー、１３は光軸である。なお、図中
同一符号は同一、又は相当部分を示す。
FIG. 1 is a side view showing a soldering evaluation device according to an embodiment of this invention, and FIG. 2 is a side view showing a conventional method for detecting a mounted printed circuit board. In the figure, 1 is a printed circuit board, 2 is a component, and 3 is a printed circuit board.
is solder, 4 is a light source, 5 is an image sensor, 6 is a drive unit,
7 is an image processing section, 8 is a control section, 9 is an XY-θ table, 10 is an inclination angle of the image sensor, 11 is a support tube, 12 is a mirror, and 13 is an optical axis. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
上に配置され、半田付けされた部品との間の接合
部分の品質を一方向から同時に評価することので
きる半田付け評価装置。 A soldering evaluation device that can simultaneously evaluate the quality of a joint between an electrical conductor pattern printed on a flat plate and a soldered component placed thereon from one direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16730888U JPH0288157U (en) | 1988-12-22 | 1988-12-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16730888U JPH0288157U (en) | 1988-12-22 | 1988-12-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0288157U true JPH0288157U (en) | 1990-07-12 |
Family
ID=31455482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16730888U Pending JPH0288157U (en) | 1988-12-22 | 1988-12-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0288157U (en) |
-
1988
- 1988-12-22 JP JP16730888U patent/JPH0288157U/ja active Pending
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