JPH0286743U - - Google Patents

Info

Publication number
JPH0286743U
JPH0286743U JP16640688U JP16640688U JPH0286743U JP H0286743 U JPH0286743 U JP H0286743U JP 16640688 U JP16640688 U JP 16640688U JP 16640688 U JP16640688 U JP 16640688U JP H0286743 U JPH0286743 U JP H0286743U
Authority
JP
Japan
Prior art keywords
module wiring
wiring board
print head
heat sink
led print
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16640688U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16640688U priority Critical patent/JPH0286743U/ja
Publication of JPH0286743U publication Critical patent/JPH0286743U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Dot-Matrix Printers And Others (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
JP16640688U 1988-12-22 1988-12-22 Pending JPH0286743U ( )

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16640688U JPH0286743U ( ) 1988-12-22 1988-12-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16640688U JPH0286743U ( ) 1988-12-22 1988-12-22

Publications (1)

Publication Number Publication Date
JPH0286743U true JPH0286743U ( ) 1990-07-10

Family

ID=31453757

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16640688U Pending JPH0286743U ( ) 1988-12-22 1988-12-22

Country Status (1)

Country Link
JP (1) JPH0286743U ( )

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004241729A (ja) * 2003-02-07 2004-08-26 Matsushita Electric Ind Co Ltd 発光光源、照明装置、表示装置及び発光光源の製造方法
JP2011061139A (ja) * 2009-09-14 2011-03-24 Kansai Electric Power Co Inc:The 半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004241729A (ja) * 2003-02-07 2004-08-26 Matsushita Electric Ind Co Ltd 発光光源、照明装置、表示装置及び発光光源の製造方法
JP2011061139A (ja) * 2009-09-14 2011-03-24 Kansai Electric Power Co Inc:The 半導体装置

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